摘要:
A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.
摘要:
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry. The method further includes forming patterns for redistribution lines on a photo resist layer, the photo resist layer disposed under the back surface, and filling the through substrate opening and the patterns for redistribution lines with a conductive material.
摘要:
The present invention is directed to novel methods and compositions containing growth factor proteins. Said compositions are specifically designed to optimize the amount of crucial structural elements of mammalian tissues. The invention is especially useful for the preservation and improvement of dermal tissue appearance.
摘要:
A coupling substrate for semiconductor components includes a patterned metal layer on a topside of an insulating carrier. Metal tracks project beyond the insulating carrier, the metal tracks being angled away at the lateral edges of the carrier in the direction of the underside of the carrier and projecting beyond the underside of the carrier. The metal tracks have a metal coating, thereby enlarging each cross section such that the metal tracks form dimensionally stable, flat, conductor external contacts of the coupling substrate.
摘要:
A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured form via a joining material jet appliance, to the back surfaces of the semiconductor chips of a divided semiconductor wafer.
摘要:
A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.
摘要:
A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.
摘要:
A description is given of a device comprising a first semiconductor chip, a molding compound layer embedding the first semiconductor chip, a first electrically conductive layer applied to the molding compound layer, a through hole arranged in the molding compound layer, and a solder material filling the through hole.
摘要:
A base semiconductor component for a semiconductor component stack is disclosed. In one embodiment, the base semiconductor component has a semiconductor chip arranged centrally on a stiff wiring substrate. The wiring substrate has, in its edge regions, contact pads which are electrically connected to external contacts and at the same time to contact areas of the semiconductor chip and also to stack contact areas. The stack contact areas simultaneously form the upper side of the base semiconductor component and have an arrangement pattern corresponding to an arrangement pattern of external contacts of a semiconductor component to be stacked.
摘要:
A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. In the molding compound a contact via is arranged.