公开(公告)号：US10461041B2

公开(公告)日：2019-10-29

申请号：US15660227

申请日：2017-07-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  H01Q23/00

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.

公开(公告)号：US10199317B2

公开(公告)日：2019-02-05

申请号：US15083421

申请日：2016-03-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H01L23/498 ,  H01L23/66 ,  H01Q9/06 ,  H01Q19/10 ,  H01Q23/00 ,  H01Q1/24

Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.

公开(公告)号：US10074613B2

公开(公告)日：2018-09-11

申请号：US15584281

申请日：2017-05-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hao-Ju Fang ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Tsung-Hsien Tsai ,  Chia-Yang Chen ,  Chun-Chi Ke

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/54 ,  H01L21/56 ,  H01L21/78 ,  H01L23/16 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/85

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

公开(公告)号：US20180090835A1

公开(公告)日：2018-03-29

申请号：US15596113

申请日：2017-05-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q1/48 ,  H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66

CPC classification number: H01Q1/526 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/42 ,  H01L2924/00014

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US09899335B2

公开(公告)日：2018-02-20

申请号：US15298480

申请日：2016-10-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L21/00 ,  H01L23/52 ,  H01L23/58 ,  H01L23/552 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

公开(公告)号：US20170278807A1

公开(公告)日：2017-09-28

申请号：US15181489

申请日：2016-06-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chi-Pin Tsai ,  Chi-Liang Shih ,  Ming-Fan Tsai ,  Chia-Yang Chen

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48195 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48265 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107

Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.

公开(公告)号：US09508656B2

公开(公告)日：2016-11-29

申请号：US14463999

申请日：2014-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L23/552 ,  H05K3/30 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

Abstract translation: 封装结构包括载体，布置在载体上的电子部件，形成在载体上用于封装电子部件的密封剂，形成在密封剂上的第一屏蔽层和形成在第一屏蔽层上的第二屏蔽层。 第一和第二屏蔽层由不同的材料制成。 通过形成在封装层上的多个屏蔽层，电子部件被保护免受电磁干扰。 本发明还提供一种制造封装结构的方法。

公开(公告)号：US09502377B2

公开(公告)日：2016-11-22

申请号：US13971189

申请日：2013-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen ,  Chih-Ming Cheng ,  Yude Chu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/433 ,  H01L25/065 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/552 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.

Abstract translation: 公开了一种半导体封装，其包括：电路板; 布置在电路板上的载体; 布置在载体上的RF芯片; 电连接RF芯片的电极焊盘和电路板的多个高级焊接线; 以及形成在电路板上用于封装载体，高电平接合线和RF芯片的密封剂。 本发明将RF芯片定位在高水平，以便于电路板上的元件布置和高频布线，从而实现高度集成的无线SiP（系统级封装）模块。

公开(公告)号：US20160225728A1

公开(公告)日：2016-08-04

申请号：US15094125

申请日：2016-04-08

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Yude Chu

IPC: H01L23/66 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/66 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/64 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/16 ,  H01L25/50 ,  H01L28/00 ,  H01L2223/6661 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括：具有多个导电焊盘的衬底和围绕形成在其表面上的导电焊盘的多个焊盘; 安装在导电焊盘上的多个无源器件; 绝缘层，其形成在所述表面上并且具有嵌入其中的无源器件的一部分; 安装在所述绝缘层的顶表面上的半导体芯片; 电连接半导体芯片和接合焊盘的多个接合线; 形成在基板的表面上以封装绝缘层，接合线和半导体芯片的密封剂，其中投射到基板上的半导体芯片的区域覆盖无源器件中最外面的一个的一部分。 因此，无源器件的安装密度提高。

公开(公告)号：US20160155559A1

公开(公告)日：2016-06-02

申请号：US14695076

申请日：2015-04-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Ming-Fan Tsai ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01F27/28 ,  H01L23/522 ,  H01F27/02 ,  H01L23/498 ,  H01F27/24 ,  H01L23/31 ,  H01L23/528

CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F27/022 ,  H01F27/24 ,  H01F2027/2809 ,  H01L23/49822 ,  H01L23/645 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic package is provided, including a substrate body, a ferromagnetic material embedded in the substrate body, and a conductor structure disposed around the conductor structure. Therefore, the conductor structure generates high magnetic flux and thus increases inductance.

Abstract translation: 提供了一种电子封装，包括基板主体，嵌入在基板主体中的铁磁材料，以及设置在导体结构周围的导体结构。 因此，导体结构产生高磁通量，从而增加电感。