公开(公告)号：US08043895B2

公开(公告)日：2011-10-25

申请号：US12221924

申请日：2008-08-07

申请人： Belgacem Haba ,  Ilyas Mohammed

发明人： Belgacem Haba ,  Ilyas Mohammed

IPC分类号： H01L21/60

CPC分类号： H01L25/105 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/544 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2223/54426 ,  H01L2224/16 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method is provided for fabricating a stacked microelectronic assembly by steps including stacking and joining first and second like microelectronic substrates, each including a plurality of like microelectronic elements attached together at dicing lanes. Each microelectronic element has boundaries defined by edges including a first edge and a second edge. The first and second microelectronic substrates can be joined in different orientations, such that first edges of microelectronic elements of the first microelectronic substrate are aligned with second edges of microelectronic elements of the second microelectronic substrate. After exposing traces at the first and second edges of the microelectronic elements of the stacked microelectronic substrates, first and second leads can be formed which are connected to the exposed traces of the first and second microelectronic substrates, respectively. The second leads can be electrically isolated from the first leads.

摘要翻译： 提供了一种用于通过以下步骤制造堆叠的微电子组件的方法，包括堆叠和​​接合第一和第二类似的微电子衬底，每个微电子衬底包括在切割通道处附接在一起的多个类似的微电子元件。 每个微电子元件具有由包括第一边缘和第二边缘的边缘限定的边界。 第一和第二微电子衬底可以以不同的取向接合，使得第一微电子衬底的微电子元件的第一边缘与第二微电子衬底的微电子元件的第二边缘对准。 在堆叠的微电子衬底的微电子元件的第一和第二边缘上暴露迹线之后，可以形成分别连接到第一和第二微电子衬底的暴露痕迹的第一和第二引线。 第二引线可以与第一引线电隔离。

公开(公告)号：US20110248410A1

公开(公告)日：2011-10-13

申请号：US12671993

申请日：2008-08-01

申请人： Osher Avsian ,  Andrey Grinman ,  Giles Humpston ,  Moti Margalit

发明人： Osher Avsian ,  Andrey Grinman ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L25/00 ,  H01L21/77 ,  H01L21/58

CPC分类号： H01L25/00 ,  H01L21/50 ,  H01L21/568 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads.

摘要翻译： 提供堆叠的微电子单元，其具有远离顶表面的顶表面和底表面以及其中的多个垂直堆叠的微电子元件，包括至少一个微电子元件，其具有与顶表面相邻的前表面和朝向后表面 朝向底面。 每个微电子元件具有从前面的触点延伸超过微电子元件的边缘的迹线。 电介质层接触微电子元件的边缘并且位于至少一个微电子元件的后表面的下方。 引线连接到沿着介电层延伸的迹线。 在顶表面暴露的单元触点连接到引线。

公开(公告)号：US08022527B2

公开(公告)日：2011-09-20

申请号：US12908265

申请日：2010-10-20

申请人： Belgacem Haba ,  Vage Oganesian

发明人： Belgacem Haba ,  Vage Oganesian

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L21/78 ,  H01L23/5382 ,  H01L24/48 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： In accordance with an aspect of the invention, a stacked microelectronic package is provided which may include a plurality of subassemblies, e.g., a first subassembly and a second subassembly underlying the first subassembly. A front face of the second subassembly may confront the rear face of the first subassembly. Each of the first and second subassemblies may include a plurality of front contacts exposed at the front face, at least one edge and a plurality of front traces extending about the respective at least one edge. The second subassembly may have a plurality of rear contacts exposed at the rear face. The second subassembly may also have a plurality of rear traces extending from the rear contacts about the at least one edge. The rear traces may extend to at least some of the plurality of front contacts of at least one of the first or second subassemblies.

摘要翻译： 根据本发明的一个方面，提供堆叠的微电子封装，其可以包括多个子组件，例如第一子组件和位于第一子组件下方的第二子组件。 第二子组件的前表面可面对第一子组件的后表面。 第一和第二子组件中的每一个可以包括在前表面处暴露的多个前触点，至少一个边缘和围绕相应的至少一个边缘延伸的多个前迹。 第二子组件可以具有在后表面处暴露的多个后触点。 第二子组件还可以具有从后接触件围绕至少一个边缘延伸的多个后迹线。 后迹线可以延伸到第一或第二子组件中的至少一个的多个前触点中的至少一些。

公开(公告)号：US07990245B1

公开(公告)日：2011-08-02

申请号：US12765548

申请日：2010-04-22

申请人： Igor Krichtafovitch

发明人： Igor Krichtafovitch

IPC分类号： H01F27/30

CPC分类号： H01F27/325 ,  H01F2005/022

摘要： Improved multi-sectional bobbin designs described herein define a channel suitable to accommodate a portion of the wire that transits from prior winding section to the next, wherein opposing walls of the channel so defined separate the transiting portion of the wire from both prior and next winding sections through a substantial entirety of the wires descent from an upper winding layer in the prior section to a lower winding layer in the next.

摘要翻译： 本文所述的改进的多节段筒管设计限定了适于容纳从现有卷绕部分转移到下一个卷绕部分的部分的通道的通道，其中如此限定的通道的相对壁将先前和下一个绕组的过渡部分分开 通过从前一部分的上部卷绕层下降到下一个下部卷绕层的大部分整体的部分。

公开(公告)号：US07952195B2

公开(公告)日：2011-05-31

申请号：US11648172

申请日：2006-12-28

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2924/01079 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： A microelectronic assembly that includes a first microelectronic element having a first rear surface. The assembly further includes a second microelectronic element having a second rear surface. The second microelectronic element is attached to the first microelectronic element so as to form a stacked package. A bridging element electrically connects the first microelectronic element and the second microelectronic element. The first rear surface of the first microelectronic element faces toward the second rear surface of the second microelectronic element.

摘要翻译： 一种微电子组件，其包括具有第一后表面的第一微电子元件。 组件还包括具有第二后表面的第二微电子元件。 第二微电子元件附接到第一微电子元件，以便形成堆叠封装。 桥接元件将第一微电子元件和第二微电子元件电连接。 第一微电子元件的第一后表面朝向第二微电子元件的第二后表面。

公开(公告)号：US07939934B2

公开(公告)日：2011-05-10

申请号：US11315466

申请日：2005-12-22

申请人： Belgacem Haba ,  David Gibson

发明人： Belgacem Haba ,  David Gibson

IPC分类号： H01L23/48 ,  H01L23/14

CPC分类号： G01R1/0483 ,  G01R1/0735 ,  G01R1/07378 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/0367 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599

摘要： An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The assembly also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements.

摘要翻译： 用于测试微电子器件的组件包括具有面和触点的微电子元件，与微电子元件的第一面间隔开并且覆盖微电子元件的第一面的柔性基板，以及从柔性基板延伸并远离第一面 微电子元件，至少一些导电柱与微电子元件电互连。 组件还包括设置在微电子元件和衬底之间的多个支撑元件，用于将柔性衬底支撑在微电子元件上。 至少一些导电柱从支撑元件偏移。

公开(公告)号：US20100270679A1

公开(公告)日：2010-10-28

申请号：US12829709

申请日：2010-07-02

申请人： Belgacem Haba ,  Giles Humpston

发明人： Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.

摘要翻译： 制造微电子封装的方法包括通过提供具有顶表面，底表面和在顶表面和底表面之间延伸的开口的板来制造子组件，将柔性层附接到板的顶表面，顺应层具有开口， 与延伸穿过板的开口对齐，并且在柔性层上提供导电特征。 在制造子组件之后，板的底表面与半导体晶片的顶表面相连，使得延伸穿过该板的开口与晶片上的触点对准。 柔性层上的至少一些导电特征与半导体晶片上的触点电互连。

公开(公告)号：US07816251B2

公开(公告)日：2010-10-19

申请号：US12291853

申请日：2008-11-14

申请人： Belgacem Haba ,  Masud Beroz ,  Young-Gon Kim ,  David B. Tuckerman

发明人： Belgacem Haba ,  Masud Beroz ,  Young-Gon Kim ,  David B. Tuckerman

IPC分类号： H01L21/44

CPC分类号： H01L24/48 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/49 ,  H01L2224/0233 ,  H01L2224/02377 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/49208 ,  H01L2924/00014 ,  H01L2924/00

摘要： A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.

摘要翻译： 用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其它方式减小至少一些柱的高度从电介质元件伸出的柱。

公开(公告)号：US07779776B2

公开(公告)日：2010-08-24

申请号：US11183490

申请日：2005-07-18

申请人： Jesse Burl Thompson ,  Hilda Cantor Tadio ,  Salvador A. Tostado ,  Apolinar Alvarez, Jr.

发明人： Jesse Burl Thompson ,  Hilda Cantor Tadio ,  Salvador A. Tostado ,  Apolinar Alvarez, Jr.

IPC分类号： B05B15/04

CPC分类号： H01L21/67126 ,  H01L21/316 ,  H05K3/1225

摘要： A tool is provided for applying a flowable composition onto a receiving surface. The tool includes a polyceramic coating on a surface thereof and may take the form of a stencil or mold. Also provided are an apparatus and a method that uses the tool. In use, the tool is placed such that its polyceramic-coated surface is in contact with the flowable composition, which, in turn, simultaneously contacts the receiving surface.

摘要翻译： 提供了用于将可流动组合物施加到接收表面上的工具。 该工具在其表面上包括一个聚酯陶瓷涂层，并且可以采用模版或模具的形式。 还提供了使用该工具的装置和方法。 在使用中，该工具被放置成使得其多陶瓷涂覆的表面与可流动的组合物接触，而可流动的组合物又反过来同时接触接收表面。

公开(公告)号：US20100162894A1

公开(公告)日：2010-07-01

申请号：US12723102

申请日：2010-03-12

申请人： Charles E. Taylor ,  Jim L. Lee

发明人： Charles E. Taylor ,  Jim L. Lee

IPC分类号： B03C3/41

CPC分类号： B01D53/32 ,  B01D53/323 ,  B01D2251/104 ,  B03C3/08 ,  B03C3/12 ,  B03C3/32 ,  B03C3/36 ,  B03C3/68 ,  B03C3/743 ,  B03C3/88 ,  B03C2201/08 ,  B03C2201/14 ,  B03C2201/28 ,  C01B13/11 ,  C01B13/115 ,  C01B2201/12 ,  C01B2201/20 ,  C01B2201/22 ,  C01B2201/62 ,  F24F2003/1682 ,  F24F2003/1685 ,  H01T23/00

摘要： An electro-kinetic air mover for creating an airflow using no moving parts. The electro-kinetic air mover includes an ion generator that has an electrode assembly including a first array of emitter electrodes, a second array of collector electrodes, and a high voltage generator. Preferably, a third or leading or focus electrode is located upstream of the first array of emitter electrodes, and/or a trailing electrode is located downstream of the second array of collector electrodes. The device can also include an interstitial electrode located between collector electrodes, an enhanced collector electrode with an integrally formed trailing end, and an enhanced emitter electrode with an enhanced length in order to increase emissivity.

摘要翻译： 一种用于创建不使用移动部件的气流的电动空气推动器。 电动气动驱动器包括具有电极组件的离子发生器，该电极组件包括第一阵列的发射极电极，第二阵列的集电极电极和高压发生器。 优选地，第三或前导或聚焦电极位于第一阵列发射极电极的上游，和/或后电极位于第二阵列的集电极电极的下游。 该器件还可以包括位于集电极之间的间隙电极，具有整体形成的后端的增强的集电极电极以及具有增强的长度以增加发射率的增强型发射电极。