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公开(公告)号：US20090242241A1
公开(公告)日：2009-10-01
申请号：US12403220
申请日：2009-03-12
Applicant: Michimasa Takahashi , Masakazu Aoyama
Inventor： Michimasa Takahashi , Masakazu Aoyama
CPC classification number: H05K3/4691 , H05K3/4602 , H05K3/4652 , H05K2201/055 , H05K2201/09127 , H05K2201/09536 , H05K2203/063 , H05K2203/308 , Y10T29/49124
Abstract: A flex-rigid wiring board includes a first rigid substrate, a second rigid substrate arranged at a distance from the first rigid substrate to provide a space between the first and second rigid substrates and a flexible substrate. The flexible substrate includes a first tip portion connected to the first rigid substrate, and a second tip portion connected to the second rigid substrate such that the first and second rigid substrates are connected to each other by way of the flexible substrate. At least one bending portion is formed between the first and second tip portions of the flexible substrate, each of the at least one bending portions is provided in the space between the first and second rigid substrates.
Abstract translation: 柔性刚性布线板包括第一刚性基板，布置在与第一刚性基板相距一定距离处的第二刚性基板，以在第一和第二刚性基板之间提供空间和柔性基板。 柔性基板包括连接到第一刚性基板的第一末端部分和连接到第二刚性基板的第二末端部分，使得第一和第二刚性基板通过柔性基板相互连接。 至少一个弯曲部分形成在柔性基板的第一和第二末端部分之间，所述至少一个弯曲部分中的每一个设置在第一和第二刚性基板之间的空间中。
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公开(公告)号：US20080283287A1
公开(公告)日：2008-11-20
申请号：US12050646
申请日：2008-03-18
Applicant: Michimasa Takahashi , Masakazu Aoyama
Inventor： Michimasa Takahashi , Masakazu Aoyama
CPC classification number: H05K3/4691 , H05K1/0373 , H05K3/0032 , H05K3/429 , H05K3/4602 , H05K3/4652 , H05K2201/0187 , H05K2201/0209 , H05K2201/09536 , H05K2203/1536
Abstract: A wiring board and method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate, such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) or through hole penetrates the base substrate and vias are formed in at least one of the first substrate or the second substrate.
Abstract translation: 一种布线板以及形成布线板的方法，所述布线板包括第一基板，具有比所述第一基板的安装面积小的安装面积的第二基板以及层叠在所述第一基板和所述第二基板之间的基底基板， 衬底延伸超过第二衬底的边缘。 IVH（间隙通孔）或通孔穿透基底基板，并且通孔形成在第一基板或第二基板中的至少一个中。
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公开(公告)号：US20080283276A1
公开(公告)日：2008-11-20
申请号：US12050771
申请日：2008-03-18
Applicant: Michimasa Takahashi , Masakazu Aoyama
Inventor： Michimasa Takahashi , Masakazu Aoyama
CPC classification number: H05K3/4691 , H05K1/0373 , H05K3/0032 , H05K3/429 , H05K3/4602 , H05K3/4652 , H05K2201/0187 , H05K2201/0209 , H05K2201/09536 , H05K2203/1536 , Y10T29/49126 , Y10T29/49165
Abstract: A wiring board and a method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) penetrates the base substrate.
Abstract translation: 一种布线板和形成布线板的方法，该布线板包括第一基板，具有比第一基板的安装面积小的安装面积的第二基板以及层叠在第一基板和第二基板之间的基底基板， 衬底延伸超过第二衬底的边缘。 IVH（间隙通孔）穿透基底。
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公开(公告)号：US20080093118A1
公开(公告)日：2008-04-24
申请号：US11876413
申请日：2007-10-22
Applicant: Michimasa TAKAHASHI , Masakazu Aoyama
Inventor： Michimasa TAKAHASHI , Masakazu Aoyama
IPC: H05K1/11
CPC classification number: H05K3/4691 , H05K1/0218 , H05K3/0035 , H05K3/4652 , H05K3/4664 , H05K2201/0187 , H05K2201/0715 , H05K2201/09127 , H05K2201/09509 , Y10T29/49124 , Y10T29/49165
Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.
Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括形成在柔性基板上的柔性基板和导体图案，邻近柔性基板设置的非柔性基板，覆盖柔性基板和非柔性基板的绝缘层，以及 暴露柔性板的一个或多个部分，形成在绝缘层上的导体图案，以及将柔性板的导体图案和导体图案连接在绝缘层上的镀层。
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公开(公告)号：US20070154741A1
公开(公告)日：2007-07-05
申请号：US11480851
申请日：2006-07-06
Applicant: Michimasa Takahashi , Yukinobu Mikado , Takenobu Nakamura , Masakazu Aoyama
Inventor： Michimasa Takahashi , Yukinobu Mikado , Takenobu Nakamura , Masakazu Aoyama
CPC classification number: H05K3/421 , H05K1/115 , H05K3/423 , H05K3/4602 , H05K3/4652 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2201/09709 , H05K2201/09863 , H05K2203/0733 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/31511
Abstract: A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.
Abstract translation: 多层印刷布线板包括彼此交替堆叠的绝缘层和导体层。 导体层通过形成在绝缘层中的通孔彼此电连接。 每个通孔形成为沿与绝缘层的厚度方向大致正交的方向凸出。 该多层印刷线路板具有安装在其表面层上的诸如电容器，IC等的电子部件。
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Patent Agency Ranking
106.发明申请公开(公告)号：US20060102384A1
公开(公告)日：2006-05-18
申请号：US11250531
申请日：2005-10-17
Applicant: Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
Inventor： Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
CPC classification number: H05K1/113 , H01L23/49816 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/19105 , H01L2924/19106 , H05K1/114 , H05K3/243 , H05K3/28 , H05K3/282 , H05K3/4614 , H05K2201/0391 , H05K2201/10674 , H05K2203/0574 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , H01L2224/0401
Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.
Abstract translation: 本发明提供了一种通过提高可靠性而获得电连接性和功能性的多层印刷线路板，特别是可提高落下试验的可靠性。 在要安装部件的焊料垫60B上没有形成耐腐蚀层，以获得柔性。 因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。 另一方面，即使构成操作键的碳柱重复接触，也可能不形成耐腐蚀层的焊盘60A接触不良。
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公开(公告)号：US08973259B2
公开(公告)日：2015-03-10
申请号：US13228496
申请日：2011-09-09
Applicant: Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
Inventor： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
CPC classification number: H01L24/83 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24227 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K1/185 , H05K3/0035 , H05K3/4652 , H05K2201/096 , H05K2201/10477 , H05K2201/10674 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/01049 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/13111 , H01L2224/13109
Abstract: A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered.
Abstract translation: 一种多层印刷电路板的制造方法，其特征在于，包括形成具有与半导体装置的尺寸基本对应的金属层的第一绝缘性树脂基板，形成第二绝缘树脂基板，形成延伸到第一绝缘树脂基板的金属层的凹部 使得金属层的表面露出，将半导体器件容纳在凹部中，使得半导体器件安装在金属层的表面上，并且在第一绝缘树脂基板上形成树脂绝缘层，使得半导体器件 容纳在凹处被覆盖。
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公开(公告)号：US08921705B2
公开(公告)日：2014-12-30
申请号：US12537607
申请日：2009-08-07
Applicant: Michimasa Takahashi
Inventor： Michimasa Takahashi
CPC classification number: H05K1/142 , H05K1/115 , H05K3/10 , H05K3/4602 , H05K3/4694 , H05K2201/0187 , H05K2201/2018 , Y10T29/49124 , Y10T29/49155
Abstract: A wiring board includes an insulating board, a wiring sub board having a wiring layer, and an insulating layer. The insulating layer has a via hole in which a conductor is formed by plating. The insulating board and the wiring sub board are horizontally laid out. The insulating layer is laid out to cover a boundary portion between the insulating board and the wiring sub board and continuously extends from the insulating board to the wiring sub board. A resin which constitutes the insulating layer is filled in the boundary portion. The conductor is electrically connected to the wiring layer.
Abstract translation: 布线板包括绝缘板，具有布线层的布线子板和绝缘层。 绝缘层具有通孔，导电体通过电镀形成。 绝缘板和布线子板水平布置。 绝缘层布置成覆盖绝缘板和布线子板之间的边界部分，并且从绝缘板连续延伸到布线子板。 构成绝缘层的树脂填充在边界部分中。 导体电连接到布线层。
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公开(公告)号：US08912451B2
公开(公告)日：2014-12-16
申请号：US13344913
申请日：2012-01-06
Applicant: Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
Inventor： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
CPC classification number: H01L24/83 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24227 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K1/185 , H05K3/0035 , H05K3/4652 , H05K2201/096 , H05K2201/10477 , H05K2201/10674 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/01049 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/13111 , H01L2224/13109
Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.
Abstract translation: 用于安装半导体器件的多层印刷电路板或基板包括半导体器件，容纳半导体器件的第一树脂绝缘层，设置在第一树脂绝缘层上的第二树脂绝缘层，设置在第二树脂绝缘层上的导体电路 层和用于将半导体器件电连接到导体电路的通孔，其中半导体器件容纳在设置在第一树脂绝缘层中的凹部中，并且用于放置半导体器件的金属层设置在 休息。 提供了一种多层印刷电路板，其中安装的半导体器件通过通孔建立电连接。
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公开(公告)号：US08759687B2
公开(公告)日：2014-06-24
申请号：US12948882
申请日：2010-11-18
Applicant: Nobuyuki Naganuma , Michimasa Takahashi , Masakazu Aoyama
Inventor： Nobuyuki Naganuma , Michimasa Takahashi , Masakazu Aoyama
IPC: H05K1/03
CPC classification number: H05K3/4691 , H05K2201/0715 , H05K2201/09145 , H05K2201/09154 , H05K2201/09827 , H05K2201/09845
Abstract: A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.
Abstract translation: 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性布线板以及位于绝缘基板和柔性布线板上方的绝缘层，并露出柔性布线板的至少一部分。 柔性布线板具有在位于绝缘基板旁边的柔性布线板的端部处朝向绝缘基板制成的锥形部分。
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