公开(公告)号：US20230199957A1

公开(公告)日：2023-06-22

申请号：US17906853

申请日：2020-07-24

申请人： Zhuhai ACCESS Semiconductor Co., Ltd.

发明人： Xianming CHEN ,  Lei FENG ,  Benxia HUANG ,  Yejie HONG

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46

CPC分类号： H05K1/115 ,  H05K3/0047 ,  H05K3/0076 ,  H05K3/188 ,  H05K3/4658 ,  H05K2201/096 ,  H05K2201/09545 ,  H05K2203/061 ,  H05K2203/0723 ,  H05K2203/167

摘要： A multilayer substrate and a manufacturing method thereof are disclosed. The multilayer substrate includes two or more dielectric layers laminated in sequence; a public line disposed at a top or bottom dielectric layer of the two or more dielectric layers; and two or more first through hole pillars respectively each embedded in a respective one of the dielectric layers, and the first through hole pillars are connected in cascade and then connected with the public line.

公开(公告)号：US20230189438A1

公开(公告)日：2023-06-15

申请号：US17921842

申请日：2021-07-16

申请人： ASAHI KASEI KABUSHIKI KAISHA

发明人： Hiroyuki HONMA ,  Amane HIROSE

IPC分类号： H05K1/03 ,  H05K3/00 ,  D03D1/00 ,  D03D15/267 ,  D03D13/00

CPC分类号： H05K1/0366 ,  H05K3/0047 ,  D03D1/0082 ,  D03D15/267 ,  D03D13/008 ,  H05K2201/029 ,  D10B2505/02

摘要： Provided is a glass cloth obtained by weaving a glass thread, which is made from a plurality of glass filaments, as a warp and weft. The average filament diameter of the glass filaments is 3.0-4.5 μm. The respective weaving densities of the warp and the weft constituting the glass cloth are, independently, 70-130 threads/25 mm. The standard deviation of weft width of the glass cloth is not more than 30 μm. The weft covering ratio R, which is represented by the expression R=Y/(25400/D) (where R is the weft covering ratio, Y is the average weft width, and D is the well weaving density) satisfies the relational expression 0.50≤R≤0.83.

公开(公告)号：US20230180396A1

公开(公告)日：2023-06-08

申请号：US18102060

申请日：2023-01-26

申请人： Board of Regents, The University of Texas System

发明人： Romil Modi ,  Jonathan Reeder ,  Gregory T. Ellson ,  Walter E. Voit ,  Alexandra Joshi Imre

IPC分类号： H05K3/40 ,  H05K3/12 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/04 ,  H05K3/06

CPC分类号： H05K3/4007 ,  H05K3/1216 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0041 ,  H05K3/048 ,  H05K3/064 ,  H05K3/067 ,  H05K3/1225 ,  H05K3/3463

摘要： An electrical device, comprising a softening polymer layer, an electrode layer on a surface of the softening polymer layer and a cover polymer layer on the surface of the softening polymer layer. An opening in the polymer cover layer is filled with a reflowed solder, one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer, and another end of the reflowed solder contacts an electrical connector electrode of the device.

公开(公告)号：US11672083B2

公开(公告)日：2023-06-06

申请号：US17497815

申请日：2021-10-08

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Yang Li ,  Yan-Lu Li

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46 ,  H01L21/02 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/14 ,  H01L23/24 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L23/552 ,  H05K3/32 ,  H05K3/00

CPC分类号： H05K3/3452 ,  H05K3/0029 ,  H05K3/022 ,  H05K3/321 ,  H05K2203/0228

摘要： A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

公开(公告)号：US11672081B2

公开(公告)日：2023-06-06

申请号：US16953338

申请日：2020-11-20

申请人： InnoLux Corporation

发明人： Hsueh-Hsuan Chou ,  Yi-Hung Lin

IPC分类号： H05K3/02 ,  H05K3/00

CPC分类号： H05K3/027 ,  H05K3/007

摘要： A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.

公开(公告)号：US11670434B2

公开(公告)日：2023-06-06

申请号：US17688252

申请日：2022-03-07

申请人： Aptiv Technologies Limited

发明人： Jared Bilas ,  David R. Peterson ,  Kurt P. Seifert ,  Christopher G. Reider ,  Doyeon Y. Sohn ,  Gerald A. Rhinehart, Jr. ,  Therese G. Stevens ,  George A. Drew ,  John T. Kightlinger

IPC分类号： H01B7/00 ,  H01B7/02 ,  H01B13/00 ,  H01B13/012 ,  H01B13/24 ,  H01B7/36 ,  H01B7/40 ,  H01R27/02 ,  H01R13/502 ,  H01R12/67 ,  B60R16/02 ,  B33Y80/00 ,  H01R12/59 ,  B29C64/10 ,  B29C64/106 ,  B33Y10/00 ,  H05K3/00 ,  B33Y30/00 ,  H01R13/52

CPC分类号： H01B7/0045 ,  B29C64/10 ,  B29C64/106 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B60R16/0207 ,  H01B7/009 ,  H01B7/0275 ,  H01B7/363 ,  H01B7/40 ,  H01B13/0013 ,  H01B13/01209 ,  H01B13/01236 ,  H01B13/01263 ,  H01B13/24 ,  H01R12/592 ,  H01R12/675 ,  H01R13/502 ,  H01R27/02 ,  H05K3/00 ,  H01B13/01254 ,  H01R13/5202 ,  H01R13/5205 ,  H01R2201/26

摘要： A method of manufacturing a wiring harness assembly includes the steps of forming a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, forming an opening in the substrate located and sized such that a section of the plurality of electrically conductive wires is exposed within the opening, disposing a support segment within the opening, securing a connector segment including a plurality of terminals to the support segment, and placing the plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires.

公开(公告)号：US20230171896A1

公开(公告)日：2023-06-01

申请号：US17976866

申请日：2022-10-30

申请人： Innolux Corporation

发明人： Pei-Chi Chen ,  Wen-Chi Fang ,  Jen-Hai Chi ,  Zhi-Fu Huang ,  Jia-Sin Lin ,  Wan-Chun Tsai

IPC分类号： H05K3/00 ,  H05K3/30

CPC分类号： H05K3/0044 ,  H05K3/30 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/025 ,  H05K2201/10106 ,  H05K2201/10174

摘要： A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.

公开(公告)号：US11665813B2

公开(公告)日：2023-05-30

申请号：US16993725

申请日：2020-08-14

申请人： Toyota Motor Engineering & Manufacturing North America, Inc. ,  Toyota Jidosha Kabushiki Kaisha

发明人： Feng Zhou ,  Shohei Nagai

IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K7/20

CPC分类号： H05K1/0209 ,  H05K1/0207 ,  H05K3/0061 ,  H05K7/205 ,  H05K7/20254

摘要： A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

公开(公告)号：US11664360B2

公开(公告)日：2023-05-30

申请号：US17566397

申请日：2021-12-30

申请人： Micron Technology, Inc.

发明人： Quang Nguyen ,  Christopher Glancey ,  Shams U Arifeen ,  Koustav Sinha

IPC分类号： H01L25/18 ,  H05K1/18 ,  H01L23/00 ,  H01L25/00 ,  H05K3/34 ,  H05K1/02 ,  H05K3/00

CPC分类号： H01L25/18 ,  H01L24/16 ,  H01L25/50 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/3436 ,  H01L2224/16225 ,  H01L2924/15153 ,  H05K3/0017 ,  H05K2201/10159

摘要： Various embodiments described herein provide for printed circuit boards with one or more spaces for embedding components, which can be used to implement a memory sub-system.

公开(公告)号：US11659667B2

公开(公告)日：2023-05-23

申请号：US17381746

申请日：2021-07-21

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Naohiro Mashino

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/42

CPC分类号： H05K3/002 ,  H05K1/115 ,  H05K3/064 ,  H05K3/423

摘要： A wiring board includes an insulating layer; an insulating oxide film that is formed by forming a film of metal oxide or semimetal oxide on a surface of the insulating layer; a seed layer that is made of metal and that is stacked on the insulating oxide film; and an electrode that is made of metal and that is formed on the seed layer, wherein the insulating oxide film and the seed layer are removed from an area not overlapping the electrode to expose the insulating layer.