公开(公告)号：US07534654B2

公开(公告)日：2009-05-19

申请号：US11733562

申请日：2007-04-10

Applicant: David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

Inventor： David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

Abstract translation: 提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。 插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。 公开了各种捕获垫结构。 通过邻近插座基板表面的导电迹线提供与外部设备的连接。 插座基板可以由支撑基板支撑。 在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

公开(公告)号：US20090072848A1

公开(公告)日：2009-03-19

申请号：US12277653

申请日：2008-11-25

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: G01R1/067 ,  G01R31/02

CPC classification number: G01R31/2887 ,  G01R1/0735 ,  G01R31/2886

Abstract: An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. The fluid, when contained in the fluid containing structure, presses the flexible wiring layer towards a device under test to form electrical interconnections between the first contact elements and corresponding second contact elements on the device under test. In a further embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact terminals and a semiconductor substrate which includes a plurality of second contact terminals. A plurality of freestanding, resilient contact elements, in one embodiment, are mechanically coupled to one of the flexible wiring layers or the semiconductor substrate and make electrical contacts between corresponding ones of the first contact terminals and the second contact terminals. In another embodiment, a method of making electrical interconnections includes joining a flexible wiring layer and a substrate together in proximity and causing a pressure differential between a first side and a second side of the flexible wiring layer. The pressure differential deforms the flexible wiring layer and causes a plurality of first contact terminals on the flexible wiring layer to electrically connect with a corresponding plurality of second contact terminals on the substrate.

Abstract translation: 电互连组件和用于制造电互连组件的方法。 在一个实施例中，互连组件包括具有多个第一接触元件和耦合到柔性布线层的流体容纳结构的柔性布线层。 当容纳在流体容纳结构中时，流体将柔性布线层压向被测器件，以在被测器件上的第一接触元件和对应的第二接触元件之间形成电互连。 在另一实施例中，互连组件包括具有多个第一接触端子的柔性布线层和包括多个第二接触端子的半导体衬底。 在一个实施例中，多个独立的弹性接触元件机械耦合到柔性布线层或半导体衬底中的一个，并且在对应的第一接触端子和第二接触端子之间形成电接触。 在另一个实施例中，制造电互连的方法包括将柔性布线层和基板接合在一起并在柔性布线层的第一侧和第二侧之间形成压差。 压差使柔性布线层变形，使柔性布线层上的多个第一接触端子与基板上的对应的多个第二接触端子电连接。

公开(公告)号：US20090066352A1

公开(公告)日：2009-03-12

申请号：US11872008

申请日：2007-10-13

Applicant: John K. Gritters ,  Rodney Ivan Martens ,  Onnik Yaglioglu ,  Benjamin N. Eldridge ,  Alexander H. Slocum

Inventor： John K. Gritters ,  Rodney Ivan Martens ,  Onnik Yaglioglu ,  Benjamin N. Eldridge ,  Alexander H. Slocum

IPC: G01R31/26 ,  H01R4/48 ,  H01R9/00 ,  H01L23/58 ,  H01R43/16 ,  H01R12/00

CPC classification number: G01R1/06716 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/06755 ,  G01R3/00 ,  H01L2924/0002 ,  Y10T29/49004 ,  Y10T29/49147 ,  Y10T29/49204 ,  H01L2924/00

Abstract: Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the product substrate. The columns can be treated to enhance mechanical properties such as stiffness, electrical properties such as electrical conductivity, and/or physical contact characteristics. The columns can be mechanically tuned to have predetermined spring properties. The columns can be used as electromechanical probes, for example, to contact and test electronic devices such as semiconductor dies, and the columns can make unique marks on terminals of the electronic devices.

Abstract translation: 包括多个垂直排列的碳纳米管的柱可以被配置为机电接触结构或探针。 柱可以在牺牲衬底上生长并转移到产物基底，或者可以在产物基底上生长柱。 可以处理柱以增强诸如刚度，电性能如导电性和/或物理接触特性的机械性能。 柱可以被机械调节以具有预定的弹簧性质。 这些列可以用作机电探针，例如用于接触和测试诸如半导体管芯的电子器件，并且这些列可以在电子器件的端子上形成独特的标记。

公开(公告)号：US07455540B2

公开(公告)日：2008-11-25

申请号：US11691369

申请日：2007-03-26

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: H01R4/60

CPC classification number: G01R31/2887 ,  G01R1/0735 ,  G01R31/2886

Abstract: An interconnect assembly can include a semiconductor device that is to be tested, and the semiconductor device can include compliant, elongate contact structures that provide an electrical interface to the semiconductor device. The interconnect assembly can also include a flexible wiring substrate, which can have electrical connections to a semiconductor tester. The flexible wiring substrate can also include electrically conductive contact features located on the substrate in a pattern that corresponds to the elongate contact structures of the semiconductor device to be tested. The flexible wiring substrate can also include wiring that interconnects the probes to the electrical connections to the semiconductor tester. The semiconductor device can be located such that some of the elongate contact structures of the semiconductor device are near some of the conductive contact features of the substrate.

Abstract translation: 互连组件可以包括待测试的半导体器件，并且半导体器件可以包括提供到半导体器件的电接口的顺应的细长接触结构。 互连组件还可以包括柔性布线基板，其可以具有到半导体测试器的电连接。 柔性布线基板还可以包括位于基板上的导电接触特征，其图形对应于要测试的半导体器件的细长接触结构。 柔性布线基板还可以包括将探针互连到与半导体测试器的电连接的布线。 半导体器件可以被定位成使得半导体器件的一些细长接触结构靠近衬底的一些导电接触特征。

公开(公告)号：US20080265922A1

公开(公告)日：2008-10-30

申请号：US12169538

申请日：2008-07-08

Applicant: Benjamin N. Eldridge ,  Carl V. Reynolds

Inventor： Benjamin N. Eldridge ,  Carl V. Reynolds

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  G01R1/07307 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer comprises a substrate having a first surface and a second surface opposite of said first surface, a first plurality of contact elements disposed on said first side of said substrate, and a second plurality of contact elements disposed on said second surface of said substrate, wherein said interposer connects electronic devices via said first and said second plurality of contact elements.

Abstract translation: 双面插入器组件及其形成和使用方法。 在本发明的一个示例中，插入器包括具有第一表面和与所述第一表面相对的第二表面的基板，设置在所述基板的所述第一侧上的第一多个接触元件和设置在所述第一表面上的第二多个接触元件 所述基板的所述第二表面，其中所述插入件经由所述第一和第二多个接触元件连接电子器件。

公开(公告)号：US07335057B2

公开(公告)日：2008-02-26

申请号：US11532801

申请日：2006-09-18

Applicant: Charles A. Miller ,  Benjamin N. Eldridge

Inventor： Charles A. Miller ,  Benjamin N. Eldridge

IPC: H01R9/05

CPC classification number: G01R1/0466 ,  H01R13/025 ,  H01R13/40 ,  H01R2201/20

Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.

Abstract translation: 一种包括具有多个通孔的基板和包括电线和/或同轴电缆的多根电缆的设备，其延伸穿过基板的多个通孔中的相应的通孔。 每个电缆包括导体并围绕基板的表面终止，使得多个电缆中的相应电缆的导体平面对准并且可用于电接触。 一种系统，包括延伸穿过所述界面的主体的多个通孔中的相应一个的电缆接口; 互连部件，其包括与所述多根电缆中的相应导体对准的第一多个接触点以及与要测试的设备的相应接触点对准的第二多个接触点。 而且，一种通过电子部件之间的多根电缆的导线路由信号的方法。

公开(公告)号：US07325302B2

公开(公告)日：2008-02-05

申请号：US11440145

申请日：2006-05-23

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge

IPC: H01R43/16

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06761 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/71 ,  H01L24/72 ,  H01L2224/05001 ,  H01L2224/05568 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01R12/57 ,  H01R12/718 ,  H01R13/03 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.

Abstract translation: 一种形成互连元件的方法。 在一个实施例中，互连元件包括耦合到第一结构的第一结构和第二结构。 与第一材料耦合的第二结构具有大于单独的第一结构的弹簧常数的弹簧常数。 在一个实施例中，互连元件适于耦合到从电子部件跟踪为导电路径的电子部件。 在一个实施例中，该方法包括形成耦合到衬底的第一（互连）结构以限定适合于集成电路环境中的互连的形状，然后例如通过将第二（互连）结构涂覆到第一（互连） 互连）结构以形成互连元件。 总的来说，第一（互连）结构和第二（互连）结构具有大于第一（互连）结构的弹簧常数的弹簧常数。

公开(公告)号：US07245137B2

公开(公告)日：2007-07-17

申请号：US11119715

申请日：2005-05-02

Applicant: Benjamin N. Eldridge ,  Stuart W. Wenzel

Inventor： Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: G01R31/02

CPC classification number: G01R1/06716 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/07342 ,  G01R3/00 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01R12/52 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2442 ,  H01R2201/20 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00

Abstract: A test head assembly can include a probe card, which can include first contact areas. The test head assembly can also include a contactor, which can include second contact areas. An interposer can include first spring contact structures and second spring contact structures. The first spring contact structures can contact one of the first contact areas, and the second spring contact structures can contact one of the second contact areas. Ones of the first spring contact structures can be electrically connected through the interposer to ones of the second spring contact structures. One of the first spring contact structures can include a pair of contacts, both of which can extend from a first surface of the interposer to contact one of the first contact areas. Alternatively or additionally, one of the second spring contact structures can include a pair of contacts, both of which can extend form a second surface of the interposer to contact one of the second contact areas.

Abstract translation: 测试头组件可以包括探针卡，其可以包括第一接触区域。 测试头组件还可以包括接触器，其可以包括第二接触区域。 插入件可以包括第一弹簧接触结构和第二弹簧接触结构。 第一弹簧接触结构可以接触第一接触区域中的一个，并且第二弹簧接触结构可以接触第二接触区域中的一个。 第一弹簧接触结构的一部分可以通过插入件电连接到第二弹簧接触结构中的一个。 第一弹簧接触结构中的一个可以包括一对触头，它们都可以从插入器的第一表面延伸以接触第一接触区域之一。 或者或另外，第二弹簧接触结构中的一个可以包括一对触头，它们都可以延伸形成插入件的第二表面以接触第二接触区域中的一个。

公开(公告)号：US07245120B2

公开(公告)日：2007-07-17

申请号：US11237092

申请日：2005-09-27

Applicant: Benjamin N. Eldridge ,  Charles A. Miller

Inventor： Benjamin N. Eldridge ,  Charles A. Miller

IPC: G01R31/28

CPC classification number: G06F1/26 ,  G01R31/2851 ,  G01R31/31721 ,  G01R31/31905 ,  G01R31/31924

Abstract: A main power source supplies current through path impedance to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases following edges of a clock signal applied to the DUT during a test as transistors within the IC switch in response to the clock signal edges. To limit variation (noise) in voltage at the power input terminal, an auxiliary power supply supplies an additional current pulse to the power input terminal to meet the increased demand during each cycle of the clock signal. The magnitude of the current pulse is a function of a predicted increase in current demand during that clock cycle, and of the magnitude of an adaption signal controlled by a feedback circuit provided to limit variation in voltage developed at the DUT's power input terminal.

Abstract translation: 主电源将电流通过路径阻抗提供给被测集成电路器件（DUT）的电源端子。 在测试期间，DUT对电源输入端的电流需求暂时增加了在测试期间施加到DUT的时钟信号的随后边缘，作为IC开关中的晶体管响应于时钟信号的边缘。 为了限制电源输入端子的电压变化（噪声），辅助电源为电源输入端子提供额外的电流脉冲，以满足在时钟信号的每个周期期间增加的需求。 电流脉冲的大小是在该时钟周期期间电流需求的预测增加以及由反馈电路控制的适配信号的大小的函数，以设置用于限制在DUT的功率输入端产生的电压变化。

公开(公告)号：US07230437B2

公开(公告)日：2007-06-12

申请号：US10868425

申请日：2004-06-15

Applicant: Benjamin N. Eldridge ,  Barbara Vasquez ,  Makarand S. Shinde ,  Gaetan L. Mathieu ,  A. Nicholas Sporck

Inventor： Benjamin N. Eldridge ,  Barbara Vasquez ,  Makarand S. Shinde ,  Gaetan L. Mathieu ,  A. Nicholas Sporck

IPC: G01R13/02

CPC classification number: G01R31/2889 ,  G01R1/0416 ,  G01R1/07307

Abstract: A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, and unpluggable using pins, enabling movement over a range of positions.

Abstract translation: 晶片测试组件包括多个探针头基底，其布置成瓦片，其中连接器连接到一侧，探针支撑在相对侧上。 在一个实施例中，柔性电缆连接器将探头头瓦片上的连接器直接连接到测试头，而在另一实施例中，柔性电缆将探头头瓦片连接到PCB，从而为测试头连接器提供水平布线。 在一个实施例中，调平销提供连接到附接到瓦片的保持元件以提供施加推挽平整力的简化支撑结构。 测试头连接器接口框架能够重新布置测试头和探针卡之间的连接器，以提供完整的晶片接触或部分晶片接触。 测试头连接器通过在轨道上滑动来重新布置，并且使用引脚可拔出，使得能够在一定范围的位置上移动。