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    Method and apparatus for electroless plating a contact pad
    122.
    发明授权
    Method and apparatus for electroless plating a contact pad 失效
    化学镀接触焊盘的方法和装置

    公开(公告)号：US06303500B1

    公开(公告)日：2001-10-16

    申请号：US09256548

    申请日：1999-02-24

    Applicant: Tongbi Jiang ,  Li Li

    Inventor： Tongbi Jiang ,  Li Li

    IPC: H01L2144

    CPC classification number: H01L24/05 ,  H01L21/02052 ,  H01L21/288 ,  H01L21/76826 ,  H01L21/76828 ,  H01L21/76834 ,  H01L21/76838 ,  H01L21/7685 ,  H01L24/03 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10S134/902

    Abstract: A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material which resists formation of resistive oxides. In particular, a tank is divided into three compartments, each holding a different solution: a lower compartment and two upper compartments divided by a barrier, which extends across and partway down the tank. The solutions have different densities and therefore separate into different layers. In the illustrated embodiment, integrated circuits with patterned contact pads are passed through one of the upper compartments, in which oxide is removed from the contact pads. Continuing downward into the lower compartment and laterally beneath the barrier, a protective layer is selectively formed on the insulating layer surrounding the contact pads. As the integrated circuits are moved upwardly into the second upper compartment, a conducting monomer selectively forms on the contact pads prior to any exposure to air. The integrated circuits can then be transferred to an ozone chamber where polymerization results in a conductive passivation layer on the contact pad.

    Abstract translation: 公开了用于集成电路的顺序处理的方法和装置，特别是用抵抗形成电阻氧化物的材料导电地钝化接触焊盘。 特别地，罐被分成三个隔室，每个隔间都有一个不同的解决方案：一个下隔室和两个隔离隔间的隔离隔板，两个隔间延伸横跨槽和一半的槽。 溶液具有不同的密度，因此分离成不同的层。 在所示实施例中，具有图案化接触焊盘的集成电路通过上隔室之一，其中氧化物从接触焊盘移除。 继续向下进入下隔室并在屏障下方横向放置，在围绕接触垫的绝缘层上选择性地形成保护层。 当集成电路向上移动到第二上隔室中时，在任何暴露于空气之前，在接触焊盘上选择性地形成导电单体。 然后可以将集成电路转移到臭氧室，其中聚合导致接触焊盘上的导电钝化层。

    Zero insertion force sockets using negative thermal expansion materials
    125.
    发明授权
    Zero insertion force sockets using negative thermal expansion materials 失效
    使用负热膨胀材料的零插入插座

    公开(公告)号：US6164993A

    公开(公告)日：2000-12-26

    申请号：US248932

    申请日：1999-02-12

    Applicant: Tongbi Jiang ,  Zhigiang Wu

    Inventor： Tongbi Jiang ,  Zhigiang Wu

    IPC: H01R12/82 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34 ,  H01R13/20

    CPC classification number: H01R12/82 ,  H01R12/58 ,  H05K1/0271 ,  H05K1/112 ,  H05K3/28 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/09472 ,  Y10S439/932

    Abstract: A socket device for receiving a connection pin is disclosed, the socket device including a substrate having an upper surface. The socket device includes a connection pad disposed on the upper surface and a first layer disposed on the upper surface and on the connection pad. The first layer includes material having an overall positive coefficient of thermal expansion. The socket device includes a second layer disposed on the first layer. The second layer includes material having an overall negative coefficient of thermal expansion. The socket device also includes a contact hole formed in the first and second layers exposing a portion of the connection pad.

    Abstract translation: 公开了一种用于接收连接销的插座装置，插座装置包括具有上表面的基板。 插座装置包括设置在上表面上的连接垫和设置在上表面上和连接垫上的第一层。 第一层包括具有总体正的热膨胀系数的材料。 插座装置包括设置在第一层上的第二层。 第二层包括具有总体负的热膨胀系数的材料。 插座装置还包括形成在第一和第二层中的接触孔，露出连接垫的一部分。

    Method of preparing a conductive bonding pad
    126.
    发明授权
    Method of preparing a conductive bonding pad 失效
    制备导电接合垫的方法

    公开(公告)号：US06113709A

    公开(公告)日：2000-09-05

    申请号：US060786

    申请日：1998-04-15

    Applicant: Tongbi Jiang ,  Li Li

    Inventor： Tongbi Jiang ,  Li Li

    IPC: B05D7/14 ,  H01L21/60 ,  H01L23/485 ,  H05K3/28 ,  H05K3/34 ,  C23C22/00

    CPC classification number: B05D7/14 ,  H01L24/02 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/19043 ,  H05K3/282 ,  H05K3/3489

    Abstract: The present invention is drawn to a method of lowering the net resistivity of an interconnect by depositing a monomer layer upon an aluminum bonding pad, the treatment thereof to cross link the monomer to form an electrically conductive polymer, and simultaneously, the substantial reduction of alumina, Al.sub.2 O.sub.3, to metallic aluminum. In the method of the present invention, deposition of a monomer layer in a solvent, volatilization of the solvent, and contact with a strong oxidizer such as a potassium permanganate allows for the use of the strong oxidizer without the hindrance of having to deal with a manganese oxide husk on the surface of the aluminum bonding pad. Preferably, the chemical qualities of the monomer will include the tendency to be a reducing agent to the native oxide film of the bonding pad. By selecting a monomer that tends to reduce rather than to oxidize, the problem of thickening the native oxide film is avoided. Another preferred chemical quality of the monomer and its polymer after cross linking, is that it will act as a protective coating to the chip package for substantially all further processing. In particular, the monomer or its cross-linked polymer will act as a protective coating to the chip package during an acid dip in an oxidizer solution such as acidic KMnO.sub.4.

    Abstract translation: 本发明涉及一种通过在铝焊盘上沉积单体层来降低互连的电阻率的方法，该方法用于交联单体以形成导电聚合物，同时，氧化铝的显着还原 ，Al2O3，金属铝。 在本发明的方法中，单体层在溶剂中的沉积，溶剂的挥发以及与强氧化剂如高锰酸钾的接触允许使用强氧化剂而不必处理 氧化铝壳在铝焊盘表面。 优选地，单体的化学性质将包括作为键合垫的天然氧化物膜的还原剂的倾向。 通过选择倾向于还原而不是氧化的单体，避免了自然氧化膜增稠的问题。 单体及其交联后的聚合物的另一优选化学品质是它将用作芯片封装的保护涂层，用于基本上所有的进一步处理。 特别地，单体或其交联聚合物将在氧化剂溶液如酸性KMnO 4的酸浸期间用作芯片封装的保护涂层。

    Screens for use in a screen printing system
    129.
    发明授权
    Screens for use in a screen printing system 失效
    屏幕用于丝网印刷系统

    公开(公告)号：US5960712A

    公开(公告)日：1999-10-05

    申请号：US5935

    申请日：1998-01-12

    Applicant: Tongbi Jiang ,  Syed Sajid Ahmad

    Inventor： Tongbi Jiang ,  Syed Sajid Ahmad

    IPC: B41M1/12 ,  H05K3/12 ,  B41L13/02

    CPC classification number: H05K3/1225 ,  B41M1/12

    Abstract: A disposable screen used in a screen printing system for printing onto electronic devices is formed of a non-metallic material. The screen is patterned from a foil. The material can be selected from a group consisting of plastic, nylon, paper, and resin. A disposable screen is mounted in the screen printing system, after which a paste material (including solder or an adhesive such as polyimide, bismaleimide, or a thermoset or thermoplastic compound) can be printed through the screen to a target structure. The used screen is discarded after one or more uses and a new screen is mounted in the screen printing system. A teaching sheet having a disposable transparent film is also used to set up the screen printing system. The film is detachably attached to a frame. After one or more prints, the used film is detached and replaced with a new film.

    Abstract translation: 用于丝网印刷系统中用于印刷到电子装置上的一次性屏幕由非金属材料形成。 屏幕从箔片图案化。 该材料可以选自由塑料，尼龙，纸和树脂组成的组。 一次性屏幕安装在丝网印刷系统中，之后可以通过屏幕将糊状材料（包括焊料或诸如聚酰亚胺，双马来酰亚胺或热固性或热塑性化合物的粘合剂）印刷到目标结构。 所使用的屏幕在一次或多次使用之后丢弃，并且新的屏幕被安装在丝网印刷系统中。 具有一次性透明膜的教导纸也用于设置丝网印刷系统。 胶片可拆卸地连接在一个框架上。 在一次或多次打印之后，将所使用的胶片分离并用新胶片代替。

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