公开(公告)号：US20060072202A1

公开(公告)日：2006-04-06

申请号：US11143233

申请日：2005-06-02

Applicant: Timothy Bonardi ,  Randall Beute ,  Randall Braun ,  Bradley Busscher ,  Kenton Ypma ,  Gregory Bosch ,  Edward DeNave ,  Daniel Bostwick ,  Wayne Jordan ,  John Roberts

Inventor： Timothy Bonardi ,  Randall Beute ,  Randall Braun ,  Bradley Busscher ,  Kenton Ypma ,  Gregory Bosch ,  Edward DeNave ,  Daniel Bostwick ,  Wayne Jordan ,  John Roberts

IPC: G02B5/08

CPC classification number: B60R1/0602 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/072 ,  B60R1/088 ,  B60R1/1207 ,  B60R2001/1215 ,  G02B5/08 ,  H05K1/02 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A mirror assembly includes a housing, an angularly adjustable power pack, wires for supplying power and mirror angle control, an electrochromic mirror subassembly including a heater, and a turn signal device. The components include individual connectors that plug into a multi-prong connector on the bundle of wires, or that piggyback into each other. Optionally, the heater incorporates an internal wire with end connectors for communicating power to opposite sides of the heater, and also includes layers of light-transmitting/diffusing material for diffusing light passing from the turn signal device through the diffusing material. A printed circuit board fits into a pocket in the panel-shaped carrier, and an integral retainer releasably secures the printed circuit board. The power pack is attached to the carrier via a ring of resilient fingers, and a continuous hoop flange prevents distortion of the carrier and in turn of the glass elements in the mirror subassembly.

公开(公告)号：US20050286259A1

公开(公告)日：2005-12-29

申请号：US10878008

申请日：2004-06-29

Applicant: Tiger Wang

Inventor： Tiger Wang

IPC: F21S8/10 ,  F21V19/00 ,  H05K3/30 ,  F21W11/02

CPC classification number: H05K3/301 ,  F21S43/14 ,  F21V19/0025 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: A mounting device is used in a vehicle lamp and has at least one base, a circuit board and a reflective cover. The vehicle lamp further has a protective cover, at least one LED, a protective cover and an electrical connector. Each LED has two electrical leads. Each base has a longitudinal through hole, a distal end and a proximal end. An LED is mounted in the distal end of each base. The proximal end of each base is mounted on the circuit board. The circuit board has multiple connection holes with two connection holes corresponding to each base so the LED electrical leads can be connected to the circuit board respectively in the two connection holes. The reflective cover has at least one through hole corresponding respectively to the at least one base so the LED can pass through the reflective cover.

Abstract translation: 一种安装装置用于车灯，并具有至少一个底座，电路板和反射罩。 车辆灯还具有保护盖，至少一个LED，保护盖和电连接器。 每个LED都有两根电线。 每个基座具有纵向通孔，远端和近端。 LED安装在每个基座的远端。 每个基座的近端安装在电路板上。 电路板具有多个连接孔，两个连接孔对应于每个基座，因此LED电线可分别连接到两个连接孔中的电路板上。 反射罩具有分别对应于至少一个基座的至少一个通孔，使得LED可以穿过反射盖。

公开(公告)号：US06833618B2

公开(公告)日：2004-12-21

申请号：US09964474

申请日：2001-09-28

Applicant: Takao Ono ,  Hironori Iwasaki ,  Mitsuya Tanaka

Inventor： Takao Ono ,  Hironori Iwasaki ,  Mitsuya Tanaka

IPC: H01L2334

CPC classification number: H01L25/065 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/14 ,  H05K2201/10159 ,  H05K2201/10484 ,  H01L2924/00

Abstract: The invention provides a memory system that allows connection of a memory controller to each of plural memory modules in an equal distance. The memory system includes a memory controller, three memory modules, a single socket which the three memory modules can be inserted into and pulled out from, and a mother board on which the memory controller and the socket are mounted, etc. And, the memory controller and each of the memory modules are connected in an equal distance through the socket pins of the socket that are branched from bus wirings on the mother board. The socket is furnished with three sets of the plural socket pins in a radial form, in correspondence with each of the memory modules. The socket has two types of structures: one has three module-board contacts for one board-bus connection, and the other has one module-board contact for one board-bus connection.

Abstract translation: 本发明提供一种存储器系统，其允许存储器控制器以等距离连接到多个存储器模块中的每一个。 存储器系统包括存储器控制器，三个存储器模块，三个存储器模块可插入和拔出的单个插座，以及安装存储器控制器和插座的母板等。而且，存储器 控制器和每个存储器模块通过从主板上的总线布线分支的插座的插座销以相等的距离连接。 该插座与径向形式配备有三组多个插座销，与每个存储器模块相对应。 插座具有两种类型的结构：一个具有三个模块板触点，用于一个板卡总线连接，另一个具有一个模块板触点用于一个板卡总线连接。

公开(公告)号：US20040251435A1

公开(公告)日：2004-12-16

申请号：US10819318

申请日：2004-04-07

Inventor： Noboru Sawayama ,  Kayoko Ikegami ,  Katsuo Hatase

IPC: H01J003/14 ,  G01N021/55

CPC classification number: H05K3/301 ,  G01N21/55 ,  G01N2201/062 ,  G03G2215/00042 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: An optical sensor includes at least one light emitting unit that emits a light, a first light receiving unit that receives specular reflection light from an illumination object when the light is incident on the illumination object with an incidence angle and specularly reflected with a reflection angle, and a second light receiving unit that receives diffuse reflection light from the illumination object when the incident light is diffusely reflected at the illumination object. The sum of the incident angle and the reflection angle is 25 degrees or less.

Abstract translation: 光学传感器包括至少一个发光的发光单元，第一光接收单元，当光以入射角入射到照明物​​体上并以反射角镜面反射时，该第一光接收单元从照明物体接收镜面反射光， 以及第二光接收单元，当所述入射光在所述照明对象处漫反射时，所述第二光接收单元接收来自所述照明物体的漫反射光。 入射角和反射角的和为25度以下。

公开(公告)号：US20040222947A1

公开(公告)日：2004-11-11

申请号：US10730600

申请日：2003-12-08

Inventor： James Newton ,  Bijan Bayat

IPC: G09G003/14 ,  G09G003/32

CPC classification number: H05K3/301 ,  F21K9/00 ,  F21L14/023 ,  F21V14/02 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K1/148 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/2027

Abstract: An LED lighting array is disclosed wherein a plurality of light emitting devices disposed in at least first and second columns are mounted on a planar mounting surface to form an emission plane. The emission axes of all the LEDs in a first column are parallel with each other and lie in a first plane. The emission axes of the LEDs in an adjacent, second column are also parallel, but a second plane containing the emission axes of the second column is disposed at a predetermined, non-zero angle with respect to the first plane. The non-zero angle is a function of the LED beam width and the distance to a lighting target. This configuration of the LEDs provides an optimum balance at a predetermined target distance between the size of the area illuminated and the brightness of the illumination of the target. In one aspect of the invention the LED lighting array includes at least first, second and third columns of LEDs. In another aspect of the invention an LED task light includes a transparent tube and an LED lighting array disposed within the tube. An electrical drive circuit associated with the mounting substrate within the tube provides pulsed direct current for driving the LED's.

Abstract translation: 公开了一种LED照明阵列，其中设置在至少第一和第二列中的多个发光器件安装在平面安装表面上以形成发射平面。 第一列中的所有LED的发射轴彼此平行并且位于第一平面中。 相邻的第二列中的LED的发射轴也是平行的，但是包含第二列的发射轴的第二平面相对于第一平面设置在预定的非零角度。 非零角度是LED光束宽度和到照明目标的距离的函数。 LED的这种配置在照明区域的尺寸和目标照明的亮度之间的预定目标距离处提供最佳平衡。 在本发明的一个方面，LED照明阵列至少包括第一，第二和第三列的LED。 在本发明的另一方面，LED任务灯包括透明管和设置在管内的LED照明阵列。 与管内的安装基板相关联的电驱动电路提供用于驱动LED的脉冲直流电。

公开(公告)号：US20040008519A1

公开(公告)日：2004-01-15

申请号：US10463887

申请日：2003-06-18

Inventor： Shinichi Todaka ,  Isamu Yoshioka

IPC: B60Q001/00 ,  B60Q001/26

CPC classification number: B60Q1/2665 ,  B60R1/1207 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10484

Abstract: A lighting device, which has light-emitting diodes, a circuit board, and pedestals. In this lighting device, some of light-emitting diodes are installed on the circuit board through a pedestal, respectively. In this pedestal, a mounting plane, to which the light-emitting diode is mounted, is formed. Since this mounting plane is inclined with respect to the surface of the circuit board, the optic axis of a light-emitting diode faces different direction in compliance with the angle of slanting of this mounting plane.

Abstract translation: 具有发光二极管，电路板和基座的照明装置。 在这种照明装置中，一些发光二极管分别通过基座安装在电路板上。 在该基座中，形成有安装有发光二极管的安装面。 由于该安装面相对于电路基板的表面倾斜，所以发光二极管的光轴面朝着与安装面的倾斜角度不同的方向。

公开(公告)号：US06628537B1

公开(公告)日：2003-09-30

申请号：US10197027

申请日：2002-07-16

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G11C502

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

公开(公告)号：US20020041020A1

公开(公告)日：2002-04-11

申请号：US09964474

申请日：2001-09-28

Inventor： Takao Ono ,  Hironori Iwasaki ,  Mitsuya Tanaka

IPC: H01L023/02 ,  H01L023/52

CPC classification number: H01L25/065 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/14 ,  H05K2201/10159 ,  H05K2201/10484 ,  H01L2924/00

Abstract: The invention provides a memory system that allows connection of a memory controller to each of plural memory modules in an equal distance. The memory system includes a memory controller, three memory modules, a single socket which the three memory modules can be inserted into and pulled out from, and a mother board on which the memory controller and the socket are mounted, etc. And, the memory controller and each of the memory modules are connected in an equal distance through the socket pins of the socket that are branched from bus wirings on the mother board. The socket is furnished with three sets of the plural socket pins in a radial form, in correspondence with each of the memory modules. The socket has two types of structures: one has three module-board contacts for one board-bus connection, and the other has one module-board contact for one board-bus connection.

Abstract translation: 本发明提供一种存储器系统，其允许存储器控制器以等距离连接到多个存储器模块中的每一个。 存储器系统包括存储器控制器，三个存储器模块，三个存储器模块可插入和拔出的单个插座，以及安装存储器控制器和插座的母板等。而且，存储器 控制器和每个存储器模块通过从主板上的总线布线分支的插座的插座销以相等的距离连接。 该插座与径向形式配备有三组多个插座销，与每个存储器模块相对应。 插座具有两种类型的结构：一个具有三个模块板触点，用于一个板卡总线连接，另一个具有一个模块板触点用于一个板卡总线连接。

公开(公告)号：US06368115B2

公开(公告)日：2002-04-09

申请号：US09765191

申请日：2001-01-18

Applicant: Robert M. Kalis

Inventor： Robert M. Kalis

IPC: H05K111

CPC classification number: H05K1/148 ,  H01R12/52 ,  H01R43/0263 ,  H01R43/205 ,  H05K1/0215 ,  H05K3/3447 ,  H05K9/0039 ,  H05K2201/096 ,  H05K2201/10484 ,  H05K2201/10924

Abstract: A circuit board assembly is provided for electrically coupling together two or more circuit boards, with one circuit board oriented at an acute angle relative to the other circuit board. The assembly includes a first circuit board having a first edge and a plurality of connecting holes disposed therethrough adjacent the first edge. Each of the holes is electrically isolated from the others and each is electrically connected to electronic circuitry printed on the first circuit board. The assembly further includes a second circuit board having a first edge and a plurality of connecting holes disposed therethrough adjacent the first edge. Each of the holes of the second board is electrically isolated from the others and is electrically connected to electronic circuitry printed on the second circuit board. The assembly also includes a conductive support plate having a plurality of connecting legs extending therefrom along a first edge thereof. The second circuit board is placed in registry with the plate, with the legs extending through the connecting holes of the second circuit board. The legs also extend through the connecting holes of the first circuit board, with the plate and the second circuit board being oriented at an angle with respect to the first circuit board. The legs are adapted to be soldered to the first circuit board and the second circuit board, and are adapted to be severed from the plate to form an electrical connection between the first circuit board and the second circuit board.

Abstract translation: 提供一种电路板组件，用于将两个或多个电路板电耦合在一起，其中一个电路板相对于另一个电路板定向成锐角。 组件包括第一电路板，其具有第一边缘和邻近第一边缘穿过其设置的多个连接孔。 每个孔与其它孔电隔离，并且每个孔电连接到印刷在第一电路板上的电子电路。 组件还包括第二电路板，其具有第一边缘和邻近第一边缘穿过其设置的多个连接孔。 第二板的每个孔与其它板电气隔离并且电连接到印刷在第二电路板上的电子电路。 组件还包括导电支撑板，其具有沿其第一边缘从其延伸的多个连接腿。 第二电路板被放置在与板对准的位置，腿部延伸穿过第二电路板的连接孔。 腿部还延伸穿过第一电路板的连接孔，其中板和第二电路板相对于第一电路板成一角度定向。 腿适于焊接到第一电路板和第二电路板，并且适于从板上切断以在第一电路板和第二电路板之间形成电连接。

公开(公告)号：US5753973A

公开(公告)日：1998-05-19

申请号：US798954

申请日：1997-02-11

Applicant: Masatoshi Yasunaga ,  Shin Nakao ,  Shinji Baba ,  Mitsuyasu Matsuo ,  Hironori Matsushima

Inventor： Masatoshi Yasunaga ,  Shin Nakao ,  Shinji Baba ,  Mitsuyasu Matsuo ,  Hironori Matsushima

IPC: H01L21/60 ,  H01L21/56 ,  H01L21/68 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/32 ,  H01L23/485 ,  H01L25/10 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L21/568 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/10 ,  H01L25/105 ,  H05K3/303 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/1131 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/1191 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4813 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2225/1005 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/2036 ,  H05K3/3442 ,  Y02P70/613

Abstract: Bonding pads are formed on a main surface of a semiconductor chip. An insulating layer having openings located on the bonding pads is formed on the main surface of the semiconductor chip. Base metal layers are formed on the bonding pads. A buffer coat film having a portion laid on a periphery of the base metal layer is formed on the insulating layer. Connection layers are formed on the base metal layers. First conductors are formed on the connection layers. A seal resin exposing only top surfaces of the first conductors is formed. Lumpish second conductors are formed on the top surfaces of the first conductor. Thereby, a resin seal semiconductor package can be made compact and it has improved electrical characteristics and high reliability.

Abstract translation: 接合焊盘形成在半导体芯片的主表面上。 在半导体芯片的主表面上形成具有位于接合焊盘上的开口的绝缘层。 在接合焊盘上形成基底金属层。 在绝缘层上形成具有放置在基底金属层周围的部分的缓冲涂膜。 连接层形成在基底金属层上。 第一导体形成在连接层上。 形成仅露出第一导体的顶表面的密封树脂。 在第一导体的顶表面上形成笨重的第二导体。 因此，可以使树脂密封半导体封装紧凑并且具有改善的电特性和高可靠性。