公开(公告)号：US20180098433A1

公开(公告)日：2018-04-05

申请号：US15821446

申请日：2017-11-22

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Robert J. Polastre ,  Bucknell C. Webb

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30 ,  H05K1/03

CPC classification number: H05K1/189 ,  G01R31/2818 ,  G01R31/309 ,  G01R31/44 ,  H05K1/0268 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K3/0026 ,  H05K3/0052 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0069 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10522 ,  H05K2203/107 ,  H05K2203/162

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

公开(公告)号：US20180005932A1

公开(公告)日：2018-01-04

申请号：US15610885

申请日：2017-06-01

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/03

CPC classification number: A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

Abstract: A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.

公开(公告)号：US20180005879A1

公开(公告)日：2018-01-04

申请号：US15196558

申请日：2016-06-29

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC: H01L21/768 ,  H01L23/498 ,  H01L23/15 ,  H01L23/532

CPC classification number: A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

Abstract: A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.

公开(公告)号：US09761516B1

公开(公告)日：2017-09-12

申请号：US15214914

申请日：2016-07-20

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC: H01L21/48 ,  H01L23/498 ,  H05K1/03

CPC classification number: A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

Abstract: A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.

公开(公告)号：US09721864B2

公开(公告)日：2017-08-01

申请号：US14984227

申请日：2015-12-30

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Jae-Woong Nah ,  Robert John Polastre

IPC: H01L23/15 ,  H01L23/31 ,  H01L21/786

CPC classification number: H05K5/0095 ,  H01L21/486 ,  H01L23/15 ,  H01L23/3121 ,  H05K5/0247 ,  H05K5/04

Abstract: A hermetically sealed electronic device and method of fabrication are provided. A base layer of a wafer is created using a substrate formed from ultra-thin glass or ceramic using panel or roll to roll processing. One or more layers are bonded to the base layer. The wafer is singulated into a plurality of electronic devices having a top surface and a plurality of sides. A hermetic sealant is applied to each electronic device to completely encase the top surface and the sides while bonding to the base layer. At least one of the layers is a metallization layer formed by metal deposition. Full metallization may be applied over the entire wafer and a pattern subsequently transferred to the full metallization by one of laser and chemical etching. The electronic device may further include at least one electronic component attached to one of the layers and encased by the hermetic sealant.

公开(公告)号：US20170192254A1

公开(公告)日：2017-07-06

申请号：US14985627

申请日：2015-12-31

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Emily R. Kinser ,  John U. Knickerbocker ,  Roy R. Yu

IPC: G02C7/08 ,  G02C7/04

CPC classification number: G02C7/083 ,  B29D11/00028 ,  B29D11/00807 ,  B29D11/00826 ,  G02C7/04

Abstract: Lenses and methods for adjusting the focus of a lens include dividing multiple light sensors in a lens into four quadrants. A position of the lens relative to occlusion along a top and bottom edge of the lens is determined based on lengths of bit sequences from light sensors in each of the four quadrants. An optimal focal length for the lens is determined based on the position of the lens. The focal length of the lens is adjusted to match the optimal focal length.

公开(公告)号：US20170180870A1

公开(公告)日：2017-06-22

申请号：US14974860

申请日：2015-12-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Li-Wen Hung ,  John U. Knickerbocker

IPC: H04R19/04 ,  H04R29/00

CPC classification number: H04R1/04 ,  A61B5/0022 ,  A61B5/02 ,  A61B5/02028 ,  A61B5/02438 ,  A61B5/02444 ,  A61B5/6833 ,  A61B7/00 ,  A61B2560/0214 ,  A61B2560/0412 ,  A61B2562/0204 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/166 ,  H04R19/016 ,  H04R2201/003 ,  H04R2420/07

Abstract: A wearable monitoring system includes a microelectromechanical (MEMS) microphone to receive acoustic signal data through skin of a user. An integrated circuit chip is bonded to and electrically connected to the MEMS microphone. A portable power source is connected to at least the integrated circuit chip. A flexible substrate is configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user.

公开(公告)号：US20170133345A1

公开(公告)日：2017-05-11

申请号：US14936849

申请日：2015-11-10

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Jae-Woong Nah

IPC: H01L23/00 ,  H01L23/544

CPC classification number: H01L24/81 ,  H01L21/6836 ,  H01L23/544 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2224/8113 ,  H01L2224/81815 ,  H01L2924/3511

Abstract: Methods are provided for bonding substrates together using alignment structures and solder reflow techniques which achieve self-alignment in three dimensions, as well as semiconductor structures that are formed using such methods. A first alignment structure is formed on a bonding surface of a first substrate, which includes an alignment trench formed in the bonding surface of the first substrate. A second alignment structure is formed on a bonding surface of a second substrate, which includes a bonding pad with solder formed on the bonding pad. The first and second substrates are placed together with the solder of the second alignment structure in contact with the first alignment structure. A solder reflow process causes the solder to melt and flow into the alignment trench while pulling on the bonding pad to cause the second substrate to move into alignment with the first substrate in each of X, Y, and Z directions.

公开(公告)号：US09601364B2

公开(公告)日：2017-03-21

申请号：US15077113

申请日：2016-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert D. Allen ,  Paul S. Andry ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker ,  Cornelia K. Tsang

IPC: H01L21/00 ,  H01L23/34 ,  H01L21/683 ,  H01L25/03 ,  H01L21/762 ,  H01L23/00 ,  H01L21/463 ,  H01L21/306 ,  H01L21/304 ,  H01L21/768

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/463 ,  H01L21/6835 ,  H01L21/76256 ,  H01L21/76898 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/03 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381

Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

公开(公告)号：US20170011223A1

公开(公告)日：2017-01-12

申请号：US14794399

申请日：2015-07-08

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Joana Sofia Branquinho Teresa Maria ,  Sufi Zafar

IPC: G06F21/60 ,  H04W12/02

CPC classification number: G06F21/606 ,  H04W4/38 ,  H04W4/80 ,  H04W12/02

Abstract: Methods, devices, systems, and computer program products for implementing a bio-medical sensing platform are provided herein. A method includes receiving one or more items of sensed biological data and/or sensor-related information from one or more sensor devices via a communication link established with the one or more sensor devices, wherein the one or more sensor devices are associated with a given user; analyzing the one or more items of sensed biological data and/or sensor-related information to perform one or more characterization functions pertaining to the one or more items of biological data and/or the given user; and transferring the one or more items of sensed biological data and/or sensor-related information and/or a result of the one or more characterization functions to a private storage component via a communication link established with the private storage component, wherein said transferring comprises implementing one or more security functions in conjunction with said transferring.

Abstract translation: 本文提供了用于实现生物医学感测平台的方法，设备，系统和计算机程序产品。 一种方法包括经由与所述一个或多个传感器设备建立的通信链路从一个或多个传感器设备接收感测的生物数据和/或传感器相关信息的一个或多个项目，其中所述一个或多个传感器设备与给定的 用户; 分析感测到的生物数据和/或传感器相关信息的一个或多个项目以执行与生物数据的一个或多个项目和/或给定用户有关的一个或多个表征功能; 以及经由与所述专用存储组件建立的通信链路将所感测的生物数据和/或传感器相关信息的一个或多个项目和/或所述一个或多个表征功能的结果传送到专用存储组件，其中所述传送包括 结合所述传送实现一个或多个安全功能。