公开(公告)号：US20190038170A1

公开(公告)日：2019-02-07

申请号：US15837508

申请日：2017-12-11

Applicant: Intel Corporation

Inventor： Amit Baxi ,  Adel Elsherbini ,  Vincent Mageshkumar ,  Sasha Oster ,  Aleksandar Aleksov ,  Feras Eid

IPC: A61B5/0408 ,  A61B5/01 ,  A61B5/026 ,  A61B5/00 ,  A61B5/0205

Abstract: Sensing patch systems are disclosed herein. A sensing patch system includes a flexible substrate and a sensor node. The flexible substrate includes one or more substrate sensors configured to provide sensor data, one or more substrate conductors electrically coupled to a corresponding substrate sensor to conduct the sensor data provided by the corresponding substrate sensor, and a node interface. The sensor node includes a substrate interface configured to receive the node interface of the flexible substrate. The sensor node is configured to receive the sensor data provided by the substrate sensors, process the sensor data, and communicate the processed sensor data to a remote device.

公开(公告)号：US20180376585A1

公开(公告)日：2018-12-27

申请号：US15780327

申请日：2015-12-11

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Javier Soto Gonzalea ,  Meizi Jiao ,  Shruti R. Jaywant ,  Oscar Ojeda ,  Sashi S. Kandanur ,  Srinivas Pietambaram ,  Roy Dittler ,  Rajat Goyal ,  Dilan Seneviratne

IPC: H05K1/02 ,  H05K3/06 ,  H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K3/30

CPC classification number: H05K1/0283 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5387 ,  H05K1/115 ,  H05K1/189 ,  H05K3/064 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4053 ,  H05K3/4682 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2203/043

Abstract: Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.

公开(公告)号：US10103037B2

公开(公告)日：2018-10-16

申请号：US14273754

申请日：2014-05-09

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Dilan Seneviratne ,  Charavana K. Gurumurthy ,  Ching-Ping J. Shen ,  Daniel N. Sobieski

IPC: H01L23/053 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L21/78

Abstract: Microelectronic systems encapsulated in a stretchable/flexible material, which is skin/bio-compatible and able to withstand environmental conditions. In one embodiment of the present description, the microelectronic system includes a microelectronic device that is substantially encapsulated in a non-permeable encapsulant, such as, butyl rubbers, ethylene propylene rubbers, fluoropolymer elastomers, or combinations thereof. In another embodiment, the microelectronic system includes a microelectronic device that is substantially encapsulated in a permeable encapsulant, such as polydimethylsiloxane, wherein a non-permeable encapsulant substantially encapsulates the permeable encapsulant.

公开(公告)号：US20180295720A1

公开(公告)日：2018-10-11

申请号：US15762791

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Adel A. Elsherbini ,  Javier Soto Gonzalez ,  Dilan Seneviratne ,  Shruti R. Jaywant ,  Sashi S. Kandanur ,  Srinivas Pietambaram ,  Nadine L. Dabby ,  Braxton Lathrop ,  Rajat Goyal ,  Vivek Raghunathan

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/00 ,  H05K3/34 ,  H05K3/28 ,  H05K3/42

CPC classification number: H05K1/0283 ,  H01L23/145 ,  H01L23/5387 ,  H05K1/038 ,  H05K1/111 ,  H05K1/189 ,  H05K3/0023 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/0055 ,  H05K3/18 ,  H05K3/205 ,  H05K3/284 ,  H05K3/341 ,  H05K3/429 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0133 ,  H05K2201/0329 ,  H05K2201/09263 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.

公开(公告)号：US20180255635A1

公开(公告)日：2018-09-06

申请号：US15762811

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Adel A. Elsherbini ,  Braxton Lathrop ,  Sasha N. Oster ,  Aleksandar Aleksov

IPC: H05K1/02 ,  H05K1/11 ,  G06F1/16

CPC classification number: H05K1/0283 ,  G06F1/163 ,  G06F1/1656 ,  H05K1/118 ,  H05K2201/0133

Abstract: Some forms relate to a stretchable computing device. The stretchable computing device includes a first layer that includes electrical interconnects at a first density wherein the first layer includes a first electronic component; a stretchable second layer electrically connected to the first layer, wherein the stretchable second layer includes electrical interconnects at a second density that is less than the first density, wherein the second layer includes a second electronic component; and a stretchable third layer electrically connected to the stretchable second layer, wherein the stretchable third layer includes electrical interconnects at a third density that is less than the second density.

公开(公告)号：US20180020982A1

公开(公告)日：2018-01-25

申请号：US15215529

申请日：2016-07-20

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Aleksandar Aleksov ,  Sasha N. Oster ,  Amit Sudhir Baxi ,  Feras Eid ,  Johanna M. Swan ,  Vincent S. Mageshkumar

IPC: A61B5/00 ,  A61B5/0205 ,  A61B5/1455 ,  A61B5/0408

CPC classification number: A61B5/6833 ,  A61B5/0205 ,  A61B5/024 ,  A61B5/04087 ,  A61B5/08 ,  A61B5/14551 ,  A61B5/7271 ,  A61B5/7405 ,  A61B5/742 ,  A61B5/7455 ,  A61B5/746 ,  A61B2560/0204 ,  A61B2560/0412 ,  A61B2560/0443

Abstract: Discussed generally herein are methods and devices including or providing a wellness monitoring system. The wellness monitoring system can include a first patch including a flexible, stretchable first substrate, a first adhesive on the first substrate, the first adhesive configured to attach the first patch to skin of a user, and first electronics on or at least partially in the first substrate, the first electronics to monitor a first biological parameter of the user, and a second patch including a flexible, stretchable second substrate, a second adhesive on the second substrate, the second adhesive configured to attach the second patch to skin of the user, and second electronics on or at least partially in the second substrate, the second electronics to monitor a second biological parameter of the user, the second biological parameter different from the first biological parameter.

公开(公告)号：US09865941B1

公开(公告)日：2018-01-09

申请号：US15281814

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Sasha Oster ,  Adel A. Elsherbini ,  Feras Eid ,  Aleksandar Aleksov ,  Amit Sudhir Baxi ,  Johanna M. Swan ,  Vincent S. Mageshkumar

IPC: A61B17/00 ,  H01R4/58 ,  H01R43/26 ,  H01R13/03 ,  A44B17/00 ,  A44B19/24

CPC classification number: H01R4/58 ,  A44B17/0041 ,  A44B19/24 ,  H01R13/03 ,  H01R43/26

Abstract: A system can include a first portion of a fabric fastener, a second portion of the fabric fastener, wherein the first portion and the second portion are configured to mechanically connect with each other and to resist separation from each other once connected, and wherein the first and second portions include a plurality of corresponding electrical contacts configured to form a plurality of individual electrical connections when the first portion is mechanically connected with the second portion.

公开(公告)号：US09735893B1

公开(公告)日：2017-08-15

申请号：US15216502

申请日：2016-07-21

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Sasha N. Oster ,  Feras Eid ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Kumar Ranganathan ,  Wen-Ling M. Huang

IPC: A61B5/11 ,  A61B5/01 ,  A61B5/00 ,  A61B5/0402 ,  A61B5/021 ,  A61N1/04 ,  A61M5/142 ,  A61B5/145 ,  H04B5/00 ,  H04B13/00 ,  A61N7/00

CPC classification number: H04B13/005 ,  A61B5/0024 ,  A61B5/01 ,  A61B5/0205 ,  A61B5/021 ,  A61B5/0402 ,  A61B5/0432 ,  A61B5/1102 ,  A61B5/1107 ,  A61B5/1121 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/4839 ,  A61B5/4869 ,  A61B5/6833 ,  A61F7/007 ,  A61M5/14248 ,  A61N1/0484 ,  A61N1/0492 ,  A61N1/3603 ,  A61N7/00 ,  H04B5/0012

Abstract: Discussed generally herein are methods and devices including or providing a patch system that can help in diagnosing a medical condition and/or provide therapy to a user. A body-area network can include a plurality of communicatively coupled patches that communicate with an intermediate device. The intermediate device can provide data representative of a biological parameter monitored by the patches to proper personnel, such as for diagnosis and/or response.

公开(公告)号：US20170200677A1

公开(公告)日：2017-07-13

申请号：US15469964

申请日：2017-03-27

Applicant: INTEL CORPORATION

Inventor： Qing Ma ,  Johanna M. Swan ,  Robert Starkston ,  John S. Guzek ,  Robert L. Sankman ,  Aleksandar Aleksov

IPC: H01L23/538 ,  H01L25/065 ,  H01L21/683 ,  H01L21/48 ,  H01L23/498 ,  H01L23/15 ,  H01L23/00

CPC classification number: H01L23/5386 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/08238 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4688 ,  H05K2201/017 ,  H05K2203/1469 ,  Y10T156/1057 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

公开(公告)号：US20170163178A1

公开(公告)日：2017-06-08

申请号：US14961116

申请日：2015-12-07

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Feras Eid ,  Adel A. Elsherbini ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Sasha Oster

IPC: H02N2/18 ,  F03G5/08

CPC classification number: F03G5/08 ,  H01L41/113 ,  H02N2/18

Abstract: A device for harvesting energy from fabric or clothing includes a piece of fabric or clothing. One or more piezoelectric harvesters are coupled with the piece of fabric or clothing. The piezoelectric harvesters are capable of producing electric energy in response to the movement of the piece of fabric or clothing. Additionally, the device includes one or more energy storage mediums coupled to the one or more piezoelectric harvesters. The energy storage mediums are capable of storing the energy produced by the one or more piezoelectric harvesters. Further, the method for harvesting energy from fabric or clothing involves moving a piece of fabric such that one or more piezoelectric harvesters generate electricity. The method for harvesting energy from fabric or clothing also involves storing the generated electricity in one or more energy storage mediums.