公开(公告)号：US07125176B1

公开(公告)日：2006-10-24

申请号：US10674374

申请日：2003-09-30

申请人： John W. Stafford ,  George G. Grouch ,  Irka Zazulak

发明人： John W. Stafford ,  George G. Grouch ,  Irka Zazulak

IPC分类号： G02B6/30 ,  G02B6/36

CPC分类号： G02B6/4246 ,  G02B6/4214 ,  G02B6/423 ,  H05K1/0274 ,  H05K1/056 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/09745

摘要： High speed high data interconnect apparatus includes a stiffening plate with optical fiber mounting groove defined on a surface thereof. The apparatus further includes a length of optical fiber mounted in the groove on the surface of the stiffening plate in a longitudinally extending direction generally parallel to the surface of the stiffening plate. A reflecting surface is positioned adjacent one, or both, of the opposed ends of the optical fiber to direct light at an angle of approximately ninety degrees to the optical path. A printed circuit board laminate is used to encase the stiffening plate and the optical fiber and includes a light via for the passage of light reflected by the reflecting surface. Bond pads are formed on a surface of the printed circuit board laminate adjacent the light via for the electrical connection of a light element, e.g. a VCSEL or photodiode, in communication with the light via.

摘要翻译： 高速高数据互连装置包括在其表面上限定有光纤安装槽的加强板。 该装置还包括一段长度的光纤，其沿纵向延伸的方向安装在加强板的表面上的凹槽中，该方向大致平行于加强板的表面。 反射表面邻近光纤的相对端的一个或两个定位，以将光以与光路近似九十度的角度引导。 印刷电路板层叠体用于包围加强板和光纤，并且包括用于使由反射表面反射的光通过的光通孔。 接合焊盘形成在邻近光通孔的印刷电路板层压体的表面上，用于光元件的电连接，例如， 与光通孔连通的VCSEL或光电二极管。

公开(公告)号：US5602491A

公开(公告)日：1997-02-11

申请号：US405317

申请日：1995-03-16

申请人： Barbara Vasquez ,  John W. Stafford ,  William M. Williams

发明人： Barbara Vasquez ,  John W. Stafford ,  William M. Williams

IPC分类号： G01R31/26 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  H01L23/373 ,  H05K3/42 ,  H05K3/46 ,  G01R31/02

CPC分类号： G01R31/2863 ,  G01R1/07314 ,  H01L23/3735 ,  H01L23/3737 ,  H05K3/4641 ,  H01L2924/0002 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K3/429 ,  H05K3/4611

摘要： A board (10) for testing an integrated circuit disposed on a semiconductor wafer. The board contains a plurality of substantially parallel signal layers (14) and power planes (16) that are supported and electrically isolated by a dielectric material (12). One or more constraint layers (18,20) are disposed in the dielectric material, and the constraint layers have a coefficient of thermal expansion of about 1-6 ppm/.degree.C. In a preferred embodiment, the dielectric material is a fluoropolymer with-a ceramic or silica filler, and the constraint layers are an iron-nickel alloy of about 30-40 percent nickel by weight. The board has thermal expansion characteristics substantially similar to silicon to ensure good contact to a silicon wafer during burn-in testing.

摘要翻译： 一种用于测试设置在半导体晶片上的集成电路的板（10）。 电路板包含多个基本上平行的信号层（14）和电源层（16），其被电介质材料（12）支撑并电隔离。 一个或多个约束层（18,20）设置在电介质材料中，并且约束层的热膨胀系数为约1-6ppm /℃。在优选实施例中，电介质材料是含氟聚合物， 陶瓷或二氧化硅填料，约束层是约30-40重量％镍的铁镍合金。 该板具有基本上类似于硅的热膨胀特性，以确保在老化测试期间与硅晶片的良好接触。

公开(公告)号：US5160409A

公开(公告)日：1992-11-03

申请号：US740271

申请日：1991-08-05

申请人： Kevin D. Moore ,  John W. Stafford ,  William M. Beckenbaugh ,  Ken Cholewczynski

发明人： Kevin D. Moore ,  John W. Stafford ,  William M. Beckenbaugh ,  Ken Cholewczynski

IPC分类号： H01L21/48 ,  H05K1/11 ,  H05K3/06 ,  H05K3/34

CPC分类号： H05K3/3457 ,  H01L21/4853 ,  H05K1/111 ,  H05K3/3473 ,  H05K1/11 ,  H05K2201/09381 ,  H05K2203/042 ,  H05K2203/043 ,  H05K2203/0723 ,  H05K3/062 ,  Y02P70/611 ,  Y10T29/49121

摘要： A method for forming a solder-bumped circuit trace on a planar dielectric substrate includes fabricating a trace having an intersection between linear section, depositing onto the trace a uniform thin plate of solder alloy and reflowing the solder alloy to form a bump at the intersection. More particularly, the trace comprises first and second linear sections that intersect at an angle between 45 degrees and 135 degrees and have widths preferably between 50 and 150 microns. The solder plate is deposited, preferably by electroplating, at a thickness between about 10 and 25 microns. Thereafter, when the trace is heated to melt the solder layer, the solder coalesces at the intersection to form the bump.

摘要翻译： 在平面介质基板上形成焊料凸起的电路迹线的方法包括制造在线性部分之间具有交点的迹线，在迹线上沉积均匀的焊料合金薄板并回流焊料合金以在交叉点处形成凸块。 更具体地，迹线包括以45度和135度之间的角度相交并且具有优选地在50和150微米之间的宽度的第一和第二线性部分。 焊料板优选通过电镀沉积在约10至25微米之间的厚度。 此后，当加热痕迹以熔化焊料层时，焊料在相交处聚结形成凸块。

公开(公告)号：US5120678A

公开(公告)日：1992-06-09

申请号：US609483

申请日：1990-11-05

申请人： Kevin D. Moore ,  Steven C. Machuga ,  John W. Stafford ,  Kenneth Cholewczynski ,  Dennis B. Miller

发明人： Kevin D. Moore ,  Steven C. Machuga ,  John W. Stafford ,  Kenneth Cholewczynski ,  Dennis B. Miller

IPC分类号： H01L21/58 ,  H01L23/498 ,  H05K3/28 ,  H05K3/34

CPC分类号： H01L24/83 ,  H01L23/49816 ,  H01L24/29 ,  H05K3/284 ,  H05K3/3436 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H05K2201/09072 ,  H05K2201/09909 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49146

摘要： An improved method is provided for assembling an integrated circuit component to a substrate by a solder bump interconnection that is reinforced by a polymer film. The component is attached to a region of the substrate by a plurality of solder bump interconnections that create a gap between the component interface and the substrate region. A polymer dam is applied to the region encircling the attached component spaced apart therefrom. A liquid polymer precursor material is applied to the region including the gap and is confined by the dam to prevent indiscriminate flow across the substrate. In one aspect of this invention, gas is vented from the gap through a passage in the substrate to enhance fill by the precursor liquid. In another aspect of this invention, the precursor liquid is injected into the gap through a passage in the substrate and spread outwardly therefrom. In any event, the precursor liquid infiltrates the gap about the solder interconnections and is cured to form a film that reinforces and protectively encapsulates the solder interconnections.

摘要翻译： 提供了一种改进的方法，用于通过由聚合物膜增强的焊料凸块互连将集成电路部件组装到衬底。 该部件通过在部件界面和基板区域之间产生间隙的多个焊料凸块互连而附着于基板的区域。 将聚合物坝施加到环绕与之间隔开的附接部件的区域。 将液体聚合物前体材料施加到包括间隙的区域，并被坝限制，以防止不加选择地流过基底。 在本发明的一个方面，气体通过衬底中的通道从间隙排出，以增强前体液体的填充。 在本发明的另一方面，前体液体通过基底中的通道注入到间隙中并从其向外扩散。 在任何情况下，前体液体渗透围绕焊料互连的间隙，并且被固化以形成加强和保护性地封装焊料互连的膜。

公开(公告)号：US4997279A

公开(公告)日：1991-03-05

申请号：US263106

申请日：1988-10-25

申请人： Eugene I. Gordon ,  Robert J. Nielsen ,  John W. Stafford

发明人： Eugene I. Gordon ,  Robert J. Nielsen ,  John W. Stafford

IPC分类号： G02B6/42 ,  G02B6/44 ,  H01S5/022 ,  H01S5/024

CPC分类号： G02B6/4225 ,  G02B6/4204 ,  G02B6/4248 ,  G02B6/4448 ,  G02B6/4207 ,  G02B6/4238 ,  H01S5/02248 ,  H01S5/02268 ,  H01S5/02284 ,  H01S5/024

摘要： An alignment fixture includes an optical bench 12 mounting a semiconductor laser 21, a monitor 23 of optical emission, a lens 27 focused for transmitting optical emission along an optical axis 43, a holder 26 mounting the lens 27, a pedestal 36 positioning a diaphragm 29 spaced for the lens 27, an optical fiber 45, a tube 49 surrounding the fiber 45 and joined to the fiber 45, a bushing 55 surrounding the tube 49 and joined to the optical bench 12, and a datum surface 16' on the bench 12 for aligning the lens 27 and the fiber 45 with the optical axis 43.

摘要翻译： 对准夹具包括安装半导体激光器21的光学台12，光发射监视器23，聚焦用于沿光轴43发射光发射的透镜27，安装透镜27的保持器26，定位隔膜29的基座36 间隔开透镜27，光纤45，围绕光纤45并连接到光纤45的管49，围绕管49并连接到光学台12的衬套55以及台架12上的基准面16' 用于将透镜27和光纤45与光轴43对准。

公开(公告)号：US5892661A

公开(公告)日：1999-04-06

申请号：US741793

申请日：1996-10-31

申请人： John W. Stafford ,  Theodore G. Tessier ,  David A. Jandzinski

发明人： John W. Stafford ,  Theodore G. Tessier ,  David A. Jandzinski

IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K1/16 ,  H01Q1/36

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783

摘要： A smartcard (10) is formed in part by a laminate layer (77). The laminate layer (77) is made up of a plurality of dielectric layers (11,30), insulating layers (45, 50), resistive layers (55), and electrically active structures. The electrically active structures include a capacitive structure (23) which is formed from one of the dielectric layers (11) and an antennae (32) which is made from a conductive layer that is formed into a spiral pattern on the another dielectric layer (30). These layers (11,30, 45, 50, 55) are formed separately and then pressed together to form the laminate layer (77).

摘要翻译： 智能卡（10）部分由层压层（77）形成。 层压层（77）由多个电介质层（11,30），绝缘层（45,50），电阻层（55）和电活性结构构成。 电活性结构包括由电介质层（11）之一形成的电容结构（23）和由在另一电介质层（30）上形成为螺旋图案的导电层制成的天线（32） ）。 这些层（11,30,45,50,55）分别形成，然后压在一起以形成层压层（77）。

公开(公告)号：US5838703A

公开(公告)日：1998-11-17

申请号：US719829

申请日：1996-09-30

申请人： Michael S. Lebby ,  John W. Stafford ,  Wenbin Jiang

发明人： Michael S. Lebby ,  John W. Stafford ,  Wenbin Jiang

IPC分类号： H01S3/00 ,  H01S5/00 ,  H01S5/022 ,  H01S5/026 ,  H01S5/183 ,  H01S3/18 ,  H01S3/04 ,  H01S3/08 ,  H01S3/13

CPC分类号： H01S5/02288 ,  H01L2224/48091 ,  H01S5/02216 ,  H01S5/0683 ,  H01S5/183

摘要： A semiconductor laser package including a mounting structure at least partially encapsulating a vertical cavity surface emitting laser and a photodetector. The vertical cavity surface emitting laser generating an emission along a path. The photodetector optically positioned and/or integrally formed with the vertical cavity surface emitting laser to receive a portion of the emission. An optical element is optionally positioned in the path, mounted on the mounting structure utilizing a snap-fit connection, a threaded or adhesive mounting. The mounting structure and optical element are fabricated to allow for proper z-axis alignment of the optical element relative to the laser emission aperture.

摘要翻译： 一种半导体激光器封装，包括至少部分地封装垂直腔表面发射激光器的安装结构和光电检测器。 垂直腔表面发射激光器沿着路径产生发射。 光电探测器与垂直腔表面发射激光器光学定位和/或整体地形成以接收发射的一部分。 光学元件可选地定位在路径中，利用卡扣连接，螺纹或粘合剂安装安装在安装结构上。 制造安装结构和光学元件以允许光学元件相对于激光发射孔的适当的z轴对准。

公开(公告)号：US5816478A

公开(公告)日：1998-10-06

申请号：US465488

申请日：1995-06-05

申请人： Kenneth Kaskoun ,  David A. Jandzinski ,  John W. Stafford

发明人： Kenneth Kaskoun ,  David A. Jandzinski ,  John W. Stafford

IPC分类号： H01L21/60 ,  B23K1/20 ,  H05K3/24 ,  H05K3/34 ,  B23K31/02

CPC分类号： B23K1/20 ,  B23K2201/40 ,  H01L2224/81193 ,  H01L2224/81385 ,  H05K3/244 ,  H05K3/3436

摘要： A method for flip-chip bonding of two electronic components (27,28) does not use a flux material. A substrate (13) of one electronic component (28) is roughened during processing to provide an improved adhesive surface for a solder ball (12). The roughened pattern is replicated by additional conductive layers formed over the substrate or in an alternate embodiment may be formed on one of the intermediary or top conductive layers. Tacking pressure is applied to the two components so the solder ball (12) will be affixed to the roughened surface and provide a temporary bond. This bond ensures the surfaces of the two electrical components remain in contact with each other during reflow of the solder ball (12) to form a permanent bond.

摘要翻译： 用于两个电子部件（27,28）的倒装芯片接合的方法不使用焊剂材料。 一个电子部件（28）的基板（13）在加工期间被粗糙化，以提供用于焊球（12）的改进的粘合剂表面。 粗糙图案由在衬底上形成的附加导电层复制，或者在替代实施例中可以形成在中间导电层或顶层导电层之一上。 对两个部件施加粘合压力，使得焊球（12）将固定到粗糙表面并提供临时粘合。 该焊接确保两个电气部件的表面在焊球（12）的回流期间保持彼此接触以形成永久接合。

公开(公告)号：US5627931A

公开(公告)日：1997-05-06

申请号：US654488

申请日：1996-05-28

申请人： Donald E. Ackley ,  John W. Stafford

发明人： Donald E. Ackley ,  John W. Stafford

IPC分类号： G02B6/42 ,  H01L33/00 ,  H01S5/02 ,  H01S5/183 ,  G02B6/36

CPC分类号： G02B6/4232 ,  G02B6/4214 ,  G02B6/4224 ,  H01L2224/48091 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/02292 ,  H01S5/183

摘要： An optoelectronic transducer includes a fiber carrier having a groove formed in a major side with an optical fiber mounted in the groove and a reflecting surface positioned adjacent one end of the groove so as to direct light in-to/out-of the optical fiber. A photonic device carrier having a photonic device fixedly mounted on a major side. Mounting pads positioned on the major sides of the carriers are affixed together so that the photonic device is optically aligned with the reflecting surface and light traveling in-to/out-of the optical fiber is directed out-of/in-to the photonic device. The carriers are formed of materials with similar thermal coefficients of expansion, such as silicon and ceramic.

摘要翻译： 光电子换能器包括具有形成在主侧的槽的光纤载体，其中安装在槽中的光纤和邻近槽的一端定位的反射表面，以便引导光纤入射到光纤之外。 具有固定地安装在主要侧面上的光子器件的光子器件载体。 定位在载体的主要侧面的安装垫被固定在一起，使得光子装置与反射表面光学对准，并且在光纤内进出的光被引导到光子器件的外部 。 载体由具有类似热膨胀系数的材料形成，例如硅和陶瓷。

公开(公告)号：US5612549A

公开(公告)日：1997-03-18

申请号：US217000

申请日：1994-03-24

申请人： Ronald J. Nelson ,  John W. Stafford ,  Thomas B. Harvey, III

发明人： Ronald J. Nelson ,  John W. Stafford ,  Thomas B. Harvey, III

IPC分类号： G09F9/33 ,  H01L25/16 ,  H01L33/00 ,  H01L51/50 ,  H01L31/0232

CPC分类号： G09F9/33 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2924/12044

摘要： An integrated electro-optical package including an optically transparent substrate with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the substrate. A driver substrate having mounting pads, bump bonded to the pads on the substrate. A plurality of driver circuits connected to the light emitting devices through terminals on the driver substrate. A lens mounted to the substrate over the array of light emitting devices and on a side opposite to magnify the real image and produce an easily viewable virtual image.

摘要翻译： 一种集成的电光学封装，其包括在其上形成有大量发光器件的光学透明衬底，并配合以产生完整的真实图像。 发光器件被定位成行和列并且连接到与衬底的外边缘相邻的焊盘。 具有安装焊盘的驱动器衬底，凸块接合到衬底上的焊盘。 通过驱动器基板上的端子连接到发光器件的多个驱动电路。 透镜安装在发光器件阵列上的衬底上，并且在相对的一侧放大真实图像并产生容易观看的虚像。