公开(公告)号：US4463067A

公开(公告)日：1984-07-31

申请号：US430145

申请日：1982-09-30

Applicant: Haim Feigenbaum

Inventor： Haim Feigenbaum

IPC: H01M2/38 ,  H01M8/04 ,  H01M8/24

CPC classification number: H01M2/38 ,  H01M8/04283 ,  H01M8/2415

Abstract: An electrolyte distribution supply system for use with a fuel cell having a wicking medium for drawing electrolyte therein is formed by a set of containers of electrolyte joined to respective fuel cells or groups thereof in a stack of such cells. The electrolyte is separately stored so as to provide for electrical isolation between electrolytes of the individual cells or groups of cells of the stack. Individual storage compartments are coupled by individual tubes, the ends of the respective tubes terminating on the wicking medium in each of the respective fuel cells. The individual compartments are filled with electrolyte by allowing the compartments to overflow such as in a cascading fashion thereby maintaining the requisite depth of electrolyte in each of the storage compartments. The individual compartments can also contain packed carbon fibers to provide a three stage electrolyte distribution system.

Abstract translation: 一种与具有用于吸收电解液的芯吸介质的燃料电池一起使用的电解质分配供​​给系统是通过一组电解液形成的，该组电容器连接到这样的电池堆中的各个燃料电池或其组合。 电解液分开存储，以提供单个电池的电解质或电池组的电池之间的电隔离。 单独的储存室通过单独的管连接，各个管的端部终止于各个燃料电池中的芯吸介质上。 通过允许隔室例如以级联方式使隔室溢出，从而将电解液的所需深度保持在每个储存隔间中，从而使单个隔间填充有电解质。 单个隔室还可以包含填充碳纤维以提供三级电解质分配系统。

公开(公告)号：US20060071677A1

公开(公告)日：2006-04-06

申请号：US10956318

申请日：2004-10-01

Applicant: Haim Feigenbaum ,  Bao Le ,  Long Hoang ,  Robert Betz

Inventor： Haim Feigenbaum ,  Bao Le ,  Long Hoang ,  Robert Betz

IPC: G01R31/02

CPC classification number: H05K3/4092 ,  G01R1/06711 ,  G01R1/07342 ,  G01R3/00 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/205 ,  H05K2201/0391

Abstract: A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second matieral is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.

Abstract translation: 柔性电路包括多个电迹线和直接形成于其上的多个探针尖。 电迹线由第一导电材料制成，并且探针尖端由比第一导电材料硬的第二导电材料制成。 第一种材料是铜或铜合金，第二种材料是镍或镍合金，其中第二种材料可镀金。 探针尖端的部分被暴露以便于与另一个电路的接触垫的电接触。 柔性电路还可以包括接地层，以便在较高频率下与另一电路进行电校正。

公开(公告)号：US06434817B1

公开(公告)日：2002-08-20

申请号：US09454789

申请日：1999-12-03

Applicant: Haim Feigenbaum ,  Chris M. Schreiber

Inventor： Haim Feigenbaum ,  Chris M. Schreiber

IPC: H05K334

CPC classification number: H01L24/10 ,  H01L21/563 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H05K1/189 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for attaching an integrated circuit to a flexible circuit which includes the acts of providing an integrated circuit having a plurality of contact pads formed upon a surface thereof; providing a flexible circuit possessing a plurality of contact bumps formed integral to a surface area; and attaching the integrated circuit to the flexible circuit by fusing at least some of the contact bumps of the flexible circuit to at least some of the contact pads of the integrated circuit. The contact bumps have a shape which mitigates local stress buildup within the contact bumps after attachment of the contact bumps to the contact pads, so as to enhance the reliability of the electrical connection.

Abstract translation: 一种用于将集成电路附接到柔性电路的方法，该柔性电路包括提供集成电路的动作，所述集成电路具有形成在其表面上的多个接触焊盘; 提供具有与表面积一体形成的多个接触凸块的柔性电路; 以及通过将所述柔性电路的至少一些所述接触凸块融合到所述集成电路的至少一些接触焊盘来将所述集成电路附接到所述柔性电路。 接触凸点具有减小接触凸块附接到接触垫之后的接触凸块内的局部应力积累的形状，从而增强电连接的可靠性。

公开(公告)号：US6166333A

公开(公告)日：2000-12-26

申请号：US6805

申请日：1998-01-14

Applicant: William R. Crumly ,  Haim Feigenbaum

Inventor： William R. Crumly ,  Haim Feigenbaum

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/13 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H05K3/00 ,  H05K3/20 ,  H05K3/40 ,  H05K1/03

CPC classification number: H01L24/81 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49811 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4691 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2203/0113 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/05005 ,  H01L2224/05541 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: The present invention includes composite support substrate for both flexible and rigid board circuit applications and method of making the same. The composite substrate is composed of at least two materials formed under the circuitry. A first material is a conventional matrix such as a polyimide/acrylic adhesive, and a second material having unique properties that are useful locally in isolated locations. For instance, the second material may be nonporous to moisture, optically clear, and/or thermally conductive. The second material is integrated into the circuit matrix at specific localized areas where desired with portions coplanar with the first material so that circuit traces remain continuous as they pass from the first material to the second. For example, an integrated circuit chip may be isolated from the polyimide matrix, which is porous in moisture, by using the second material that is nonporous to moisture at locations where the integrated circuit chip is to be attached, thus isolating the integrated circuit chip from the polyimide and preventing moisture from flowing through to the chip.

Abstract translation: 本发明包括用于柔性和刚性电路板电路应用的复合支撑基板及其制造方法。 复合衬底由在电路下形成的至少两种材料组成。 第一种材料是常规的基质，例如聚酰亚胺/丙烯酸粘合剂，以及具有独特性质的第二种材料，其在局部在隔离的位置是有用的。 例如，第二种材料可以是无孔的，透湿的和/或导热的。 第二材料在特定的局部区域集成到电路矩阵中，其中期望的是与第一材料共面的部分，使得电路迹线在从第一材料通过到第二材料时保持连续。 例如，集成电路芯片可以与聚酰亚胺基体隔离，该聚酰亚胺基体在湿气中是多孔的，通过使用在要连接集成电路芯片的位置处无孔的第二种材料，从而将集成电路芯片与 聚酰亚胺并防止水分流入芯片。

公开(公告)号：US5896271A

公开(公告)日：1999-04-20

申请号：US897584

申请日：1997-07-21

Applicant: Eric Dean Jensen ,  William R. Crumly ,  Haim Feigenbaum ,  Chris M. Schreiber

Inventor： Eric Dean Jensen ,  William R. Crumly ,  Haim Feigenbaum ,  Chris M. Schreiber

IPC: H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/20 ,  H05K3/40 ,  H05K7/20

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/17 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/056 ,  H05K1/112 ,  H05K1/189 ,  H05K2201/0367 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4084 ,  Y02P70/611

Abstract: Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal contact includes a metallic trace including a raised feature of thermally conductive material. A solder ball or fillet may be used to make a connection between the raised feature and the heat generating component or between the raised feature and the underlying heat sink or both.

Abstract translation: 公开了具有热接触的柔性基板，其提供从发热部件到散热器的连续高导热路径。 在一个实施例中，热接触包括包括导热材料的凸起特征的金属迹线。 可以使用焊球或圆角来在升高的特征和发热部件之间或在凸起的特征​​和下面的散热器之间或两者之间形成连接。

公开(公告)号：US5354205A

公开(公告)日：1994-10-11

申请号：US51598

申请日：1993-04-23

Applicant: Haim Feigenbaum ,  William R. Crumly ,  Christopher M. Schreiber

Inventor： Haim Feigenbaum ,  William R. Crumly ,  Christopher M. Schreiber

IPC: G01R1/073 ,  G01R31/02 ,  H01H1/14 ,  H01L21/66 ,  H01R12/00 ,  H05K1/11 ,  H05K3/20 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R9/09

CPC classification number: G01R1/073 ,  H05K3/205 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10666 ,  H05K2203/0113 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K2203/167 ,  H05K3/365 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: Shaped contacts (40,42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16,18,26,28) makes indentations (24a,24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a,24b), are electroplated with a pattern of conductive material (34,36,38), and a dielectric substrate (32) is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical (18) or pyramidal (28) shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed. This enables the contacts to penetrate foreign materials, such as oxides, that may form on the surface of the pads (56,58), to which the contacts are to be connected to ensure a good contact without any need for wiping action. The projecting contacts can also be pressed into plated holes (82,84) in a substrate, such as a printed wiring board, to which mateable/demateable electrical connection is to be made.

Abstract translation: 用于互连电路或用于集成电路测试探针的成形触头（40,42）作为电路迹线（34）作为不锈钢芯棒（10）的一部分进行电镀。 成型的硬化钢压痕工具（16,18,26,28）在心轴（10）的表面中形成具有预定形状的凹部（24a，24b），其设置有电介质图案，例如特氟隆（12） ）或光致抗蚀剂。 包括凹陷（24a，24b）的钢心轴的区域用导电材料（34,36,38）的图案电镀，并且电介质基底（32）层压到导电材料上。 由凹口形成的电路特征限定了锥形（18）或金字塔形（28）形状的凸起接触，其具有小的面积的自由端，允许更高的压力施加到触点抵靠的表面。 这使得触点能够渗透可能形成在焊盘（56,58）的表面上的诸如氧化物的异物，触点将被连接到其上，以确保良好的接触而不需要擦拭动作。 突出的触点也可以被压入到将要制造可配对/可分离的电连接的基板（例如印刷电路板）中的电镀孔（82,84）中。

公开(公告)号：US5158466A

公开(公告)日：1992-10-27

申请号：US663972

申请日：1991-03-04

Applicant: Christopher M. Schreiber ,  David B. Swarbrick ,  Haim Feigenbaum

Inventor： Christopher M. Schreiber ,  David B. Swarbrick ,  Haim Feigenbaum

IPC: H01R4/04 ,  H01R12/00 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24 ,  H05K3/40

CPC classification number: H05K3/4007 ,  H01R12/65 ,  H01R4/04 ,  H05K1/0393 ,  H05K1/095 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K3/246 ,  H05K3/247 ,  Y10T29/49155

Abstract: A pressure type contact (10) for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers in which one wafer is plated with a raised conductive interconnection feature. The raised feature is formed by placing a small lump (44) of electrically conductive resin on a substrate (12) and then electrolytically forming on the substrate a trace (18) having an enlarged connector pad (20) that completely covers the cured projecting resin lump.

Abstract translation: 用于柔性或常规电缆电缆终端的压力型接触器（10）由电铸薄金属晶片制造，其中一个晶片被电镀有升高的导电互连特征。 升高的特征是通过将小块（44）导电树脂放置在基底（12）上，然后在基底上电解形成具有扩大的连接器垫（20）的痕迹（18），该连接器垫完全覆盖固化的突出树脂 块。

公开(公告)号：US20100157566A1

公开(公告)日：2010-06-24

申请号：US12317089

申请日：2008-12-19

Applicant: Robert Bogursky ,  Kenneth Krone ,  Peter Bellantoni ,  Haim Feigenbaum

Inventor： Robert Bogursky ,  Kenneth Krone ,  Peter Bellantoni ,  Haim Feigenbaum

IPC: H05K9/00 ,  B05D5/12

CPC classification number: H05K9/0032 ,  H01L23/552

Abstract: A shield assembly useful in the attenuation of electronic noise or spurious electric signals. In one embodiment, the shielding assembly comprises a metallic component that is encapsulated with an electronic component to be shielded, such as an integrated circuit. A conductive coating is applied to an exterior surface of the encapsulated metallic and electronic components so that it is in contact with the metallic component. The metallic component is formed using a selective metal deposition process (e.g., electroforming) and a laser-cutting process that increase manufacturing efficiency and provide enhanced mechanical and structural features, including especially the ability to make the shield very thin, have a high degree of co planarity, and maintain a low profile for the shielded electronic component as a whole (i.e., add very little height to that of the electronic component). Methods of manufacturing and utilizing the shielding assembly in designs are also disclosed.

Abstract translation: 用于衰减电子噪声或杂散电信号的屏蔽组件。 在一个实施例中，屏蔽组件包括用要屏蔽的电子部件例如集成电路封装的金属部件。 将导电涂层施加到封装的金属和电子部件的外表面上，使其与金属部件接触。 使用选择性金属沉积工艺（例如，电铸）形成金属部件，并且提高制造效率并提供增强的机械和结构特征的激光切割工艺，特别是使屏蔽非常薄的能力具有高度的 并且保持屏蔽电子部件整体的低调（即，与电子部件的高度相比增加非常小的高度）。 还公开了在设计中制造和利用屏蔽组件的方法。

公开(公告)号：US06358064B2

公开(公告)日：2002-03-19

申请号：US09277894

申请日：1999-03-29

Applicant: John Steven Szalay ,  Haim Feigenbaum ,  Eric Dean Jensen ,  Terry Shing Wang

Inventor： John Steven Szalay ,  Haim Feigenbaum ,  Eric Dean Jensen ,  Terry Shing Wang

IPC: H05K100

CPC classification number: H01R13/2435 ,  H01R12/62 ,  H01R12/714 ,  H01R13/2464 ,  H05K3/361 ,  H05K3/365 ,  H05K3/368 ,  H05K2201/0367 ,  H05K2201/056

Abstract: A Z-axis electrical interconnect includes a flexible printed circuit folded into a U-shape. The Z-axis electrical interconnect also includes a plurality of raised interconnection members arranged on the flexible printed circuit in a predetermined pattern and a circuit trace interconnecting the pair of raised interconnection members. The Z-axis electrical interconnect further includes a spring fixedly positioned on the flexible printed circuit to maintain the U-shape.

Abstract translation: Z轴电气互连包括折叠成U形的柔性印刷电路。 Z轴电互连还包括以预定图案布置在柔性印刷电路上的多个凸起的互连构件以及将一对升高的互连构件互连的电路迹线。 Z轴电互连还包括固定地定位在柔性印刷电路上以保持U形的弹簧。

公开(公告)号：US6109369A

公开(公告)日：2000-08-29

申请号：US239608

申请日：1999-01-29

Applicant: William Robert Crumly ,  Pete Henry Hudson ,  Robert Joseph Cochrane ,  Haim Feigenbaum ,  Eric Dean Jensen

Inventor： William Robert Crumly ,  Pete Henry Hudson ,  Robert Joseph Cochrane ,  Haim Feigenbaum ,  Eric Dean Jensen

IPC: H01L23/31 ,  H01L23/498 ,  H05K23/28

CPC classification number: H01L23/4985 ,  H01L23/3121 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/85455 ,  H01L2224/8547 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

Abstract: A chip scale package includes a mandrel built flexible circuit having a circuit trace on a first surface and an aperture extending therethrough. The chip scale package includes a pad covering the aperture on the first surface of the flexible circuit and a raised interconnection member extending outwardly from the pad. The chip scale package also includes a chip secured to a second surface of the flexible circuit, such that the chip is electrically connected to the pad.

Abstract translation: 芯片级封装包括具有在第一表面上的电路迹线和延伸穿过其中的孔的心轴构建的柔性电路。 芯片级封装包括覆盖柔性电路的第一表面上的孔的焊盘和从焊盘向外延伸的凸起的互连构件。 芯片级封装还包括固定到柔性电路的第二表面的芯片，使得芯片电连接到焊盘。