公开(公告)号：US06465082B1

公开(公告)日：2002-10-15

申请号：US09554502

申请日：2000-05-16

申请人： Hiroaki Takezawa ,  Masahide Tsukamoto ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Hideo Hatanaka ,  Yasushi Fukumura ,  Kazuo Eda ,  Toru Ishida

发明人： Hiroaki Takezawa ,  Masahide Tsukamoto ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Hideo Hatanaka ,  Yasushi Fukumura ,  Kazuo Eda ,  Toru Ishida

IPC分类号： H05K100

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/105 ,  H05K3/321 ,  H05K2201/0212 ,  H05K2201/0379 ,  H05K2201/10257 ,  H05K2201/10992 ,  H05K2203/121 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681

摘要： A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.

摘要翻译： 一种要安装在电路板上的应力松弛型电子部件，其中应力松弛机构部件设置在所述电子部件的表面上，所述表面位于要连接所述电子部件的连接部分的一侧 到所述电路板，并且所述应力松弛机构构件是导电的。

公开(公告)号：US06207550B1

公开(公告)日：2001-03-27

申请号：US09107319

申请日：1998-06-30

申请人： Nobuhiro Hase ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Satoru Yuhaku ,  Hiroaki Takezawa ,  Yoshihiro Bessho

发明人： Nobuhiro Hase ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Satoru Yuhaku ,  Hiroaki Takezawa ,  Yoshihiro Bessho

IPC分类号： H01L2144

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/092 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/323 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10674 ,  H05K2203/0278 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is a method for mounting a semiconductor element, the method requiring no strict flatness for a substrate and being reliable in a semiconductor device produced by mounting a semiconductor element on a circuit substrate. In the multilayer circuit substrate comprising bump electrodes formed of a conductive paste, a conductive adhesive is applied to the top of bump electrodes and then leveled to obtain the end portions on the bump electrodes with a high coplanarity in height. The semiconductor element is mounted on this substrate using a combination of a conductive resin and a sealing resin or an anisotropic conductive sheet. Every top of the bump electrodes after the conductive adhesive is applied has a high coplanarity. The semiconductor element can be mounted with high reliability, on the substrate having such a poor flatness of the electrode face that mounting by a conventional method can not be applied.

摘要翻译： 公开了一种用于安装半导体元件的方法，该方法对于基板不需要严格的平坦度，并且在通过将半导体元件安装在电路基板上而制造的半导体器件中是可靠的。 在包含由导电浆料形成的凸块电极的多层电路基板中，将导电性粘合剂施加到凸块电极的顶部，然后平整，以在凸起电极上获得具有高共面度的端部。 半导体元件使用导电树脂和密封树脂或各向异性导电片的组合安装在该基板上。 使用导电性粘合剂之后的凸起电极的每个顶部具有高的共面性。 半导体元件可以以高可靠性安装在基板上，其电极面的平坦度差，不能施加常规方法的安装。

公开(公告)号：US06814893B2

公开(公告)日：2004-11-09

申请号：US10613042

申请日：2003-07-07

申请人： Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Tsutomu Mitani ,  Tousaku Nishiyama

发明人： Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Tsutomu Mitani ,  Tousaku Nishiyama

IPC分类号： H01B122

CPC分类号： H01L24/83 ,  C09J9/02 ,  H01B1/22 ,  H01L23/49883 ,  H01L24/28 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/321 ,  H05K13/0469 ,  H05K2201/0769 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/121 ,  Y02P70/611 ,  Y10T428/2982 ,  Y10T428/2984 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

公开(公告)号：US06675474B2

公开(公告)日：2004-01-13

申请号：US10309597

申请日：2002-12-03

申请人： Tsutomu Mitani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

发明人： Tsutomu Mitani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

IPC分类号： H05K1300

CPC分类号： H05K3/321 ,  H05K2201/0129 ,  H05K2201/10992 ,  H05K2203/176 ,  H05K2203/306 ,  Y10T29/49172

摘要： An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.

摘要翻译： 电子部件安装部件包括电路板，连接到电路板的电子部件和插入在电子部件和电路板之间的导电粘合剂。 在导电粘合剂和电路板的电极的接合界面中，由软化温度为100℃至300℃的热塑性绝缘粘合剂形成的中间层介于导电粘合剂和 电极。 包含在导电粘合剂中的导电填料部分地存在于中间层中，从而允许导电粘合剂和电路板的电极之间的导电。 使用该电子部件安装部件，当需要修理时，对应于要修复的电子部件的中间层的一部分被加热，以将该部分的温度升高至热塑性绝缘体的至少熔点 粘合剂，从而熔化热塑性绝缘粘合剂。 然后，保持该状态，去除电子部件。

公开(公告)号：US06666994B2

公开(公告)日：2003-12-23

申请号：US10309426

申请日：2002-12-03

申请人： Hiroaki Takezawa ,  Takashi Kitae ,  Yukihiro Ishimaru ,  Tsutomu Mitani ,  Tousaku Nishiyama

发明人： Hiroaki Takezawa ,  Takashi Kitae ,  Yukihiro Ishimaru ,  Tsutomu Mitani ,  Tousaku Nishiyama

IPC分类号： H01L2314

CPC分类号： H01B1/22 ,  C09J9/02 ,  H01L2924/181 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0272 ,  H05K2201/0769 ,  Y10T428/12069 ,  Y10T428/1209 ,  Y10T428/12111 ,  Y10T428/12139 ,  Y10T428/12528 ,  Y10T428/25 ,  H01L2924/00012

摘要： The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

公开(公告)号：US06429382B1

公开(公告)日：2002-08-06

申请号：US09547922

申请日：2000-04-11

申请人： Kazuyoshi Amami ,  Hiroaki Takezawa ,  Tsukasa Shiraishi ,  Yoshihiro Bessho

发明人： Kazuyoshi Amami ,  Hiroaki Takezawa ,  Tsukasa Shiraishi ,  Yoshihiro Bessho

IPC分类号： H05K102

CPC分类号： H01L24/83 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0769 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/121 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2224/05644

摘要： For the reliability in insulation and against sulfurization, the mounting structure of the invention includes an electric structure, and an electrically conductive adhesive layer including an electrically conductive filler disposed on the electric structure, and at least a portion of surface of the electrically conductive filler is exposed to an external environment, and an elution preventive film is disposed on at least a portion of the exposed surface. Further, an electrically conductive adhesive of this invention includes the electrically conductive filler, and an elution preventive film is disposed on the entire surface of the electrically conductive filler.

摘要翻译： 为了绝缘和耐硫化的可靠性，本发明的安装结构包括电结构，以及包括设置在电结构上的导电填料的导电粘合剂层，并且导电填料表面的至少一部分是 暴露在外部环境中，并且防洗掉膜被设置在暴露表面的至少一部分上。 此外，本发明的导电性粘合剂包括导电填料，并且在导电填料的整个表面上设置防淘汰膜。

公开(公告)号：US07755893B2

公开(公告)日：2010-07-13

申请号：US11816650

申请日：2006-03-15

申请人： Hiroto Yanagawa ,  Hiroaki Takezawa

发明人： Hiroto Yanagawa ,  Hiroaki Takezawa

IPC分类号： H05K7/20 ,  H05K5/00 ,  G06F1/20

CPC分类号： H05K7/20009 ,  H05K7/20972 ,  Y10S345/905

摘要： The present invention provides a display apparatus that can achieve high durability by making the most of the function of the exhaust fans to effectively suppress the rise of the temperature. The display apparatus comprises a display panel for displaying images, a rear case covering a rear side of the display panel, and an exhaust fan disposed within the rear case, wherein the rear case includes a first air-hole area and a second air-hole area each provided with a plurality of air holes, the first air-hole area is located at a higher level than the second air-hole area with respect to a vertical direction with a spacing therebetween, and at least partially faces the exhaust fan, and an area surrounded by the first air-hole area, the second air-hole area and external common tangents thereof is a shielded area in which no air hole is provided.

摘要翻译： 本发明提供一种显示装置，通过充分利用排气风扇的功能能够有效地抑制温度上升，能够实现高耐久性。 显示装置包括用于显示图像的显示面板，覆盖显示面板的后侧的后壳和设置在后壳体内的排气扇，其中后壳包括第一气孔区域和第二气孔 所述第一气孔区域相对于垂直方向位于比所述第二气孔区域更高的高度，其间具有间隔，并且至少部分地面对所述排风扇，并且 由第一气孔区域，第二气孔区域和外部共同切线围绕的区域是不设置空气孔的屏蔽区域。

公开(公告)号：US07705536B2

公开(公告)日：2010-04-27

申请号：US10594155

申请日：2006-01-25

申请人： Hiroto Yanagawa ,  Tetsuo Kawakita ,  Taketoshi Nakao ,  Hiroaki Takezawa ,  Kiyohide Amemiya

发明人： Hiroto Yanagawa ,  Tetsuo Kawakita ,  Taketoshi Nakao ,  Hiroaki Takezawa ,  Kiyohide Amemiya

IPC分类号： H01J17/49

CPC分类号： H05K7/20972 ,  H05K7/20963

摘要： A display device is provided which is capable of inhibiting a localized elevation in the temperature of a casing thereby uniformalizing the surface temperature distribution over the casing. A display device includes: a display panel having surface arrays of plural pixels for displaying an image by light radiation control on a pixel to pixel basis; an electronic component forming a control circuit configured to perform the light radiation control; a casing housing the display panel and the electronic component therein; and a flat heat-conductive sheet interposed between the display panel and the casing and between the electronic component and the casing.

摘要翻译： 提供一种显示装置，其能够抑制壳体的温度的局部升高，从而使壳体上的表面温度分布均匀化。 显示装置包括：显示面板，具有多个像素的表面阵列，用于通过基于像素到像素的光辐射控制来显示图像; 形成控制电路的电子部件，被配置为执行所述光辐射控制; 将所述显示面板和所述电子部件容纳在其中的壳体; 以及介于所述显示面板和所述壳体之间以及所述电子部件与所述壳体之间的平坦的导热片。

公开(公告)号：US20090009047A1

公开(公告)日：2009-01-08

申请号：US11816650

申请日：2006-03-15

申请人： Hiroto Yanagawa ,  Hiroaki Takezawa

发明人： Hiroto Yanagawa ,  Hiroaki Takezawa

IPC分类号： H01J61/52

CPC分类号： H05K7/20009 ,  H05K7/20972 ,  Y10S345/905

摘要： The present invention provides a display apparatus that can achieve high durability by making the most of the function of the exhaust fans to effectively suppress the rise of the temperature. The display apparatus comprises a display panel for displaying images, a rear case covering a rear side of the display panel, and an exhaust fan disposed within the rear case, wherein the rear case includes a first air-hole area and a second air-hole area each provided with a plurality of air holes, the first air-hole area is located at a higher level than the second air-hole area with respect to a vertical direction with a spacing therebetween, and at least partially faces the exhaust fan, and an area surrounded by the first air-hole area, the second air-hole area and external common tangents thereof is a shielded area in which no air hole is provided.

摘要翻译： 本发明提供一种显示装置，通过充分利用排气风扇的功能能够有效地抑制温度上升，能够实现高耐久性。 显示装置包括用于显示图像的显示面板，覆盖显示面板的后侧的后壳和设置在后壳体内的排气扇，其中后壳包括第一气孔区域和第二气孔 所述第一气孔区域相对于垂直方向位于比所述第二气孔区域更高的高度，其间具有间隔，并且至少部分地面对所述排风扇，并且 由第一气孔区域，第二气孔区域和外部共同切线围绕的区域是不设置空气孔的屏蔽区域。

公开(公告)号：US07151306B2

公开(公告)日：2006-12-19

申请号：US11009045

申请日：2004-12-13

申请人： Takashi Kitae ,  Tsutomu Mitani ,  Yukihiro Ishimaru ,  Hiroaki Takezawa

发明人： Takashi Kitae ,  Tsutomu Mitani ,  Yukihiro Ishimaru ,  Hiroaki Takezawa

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/19041 ,  H05K3/321 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2203/0307 ,  H05K2203/1446 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element.Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.

摘要翻译： 电子部件4的外部电极3的表面形成有含有树脂成分的涂层。 因此，通过导电粘合剂的介质将电子部件安装到电路板1上可以显着改善粘附强度和可靠性。 此外，通过利用形成作为连接元件的外部电极3的导电粘合剂，能够将电子部件安装到要安装的元件上。 此外，电子部件的外部电极3的表面粗糙度（R a1 a）设定为0.1μm以上至10.0μm以下，优选为1.0μm以上且5.0μm以下 。 因此，与传统的电子部件相比，与导电粘合剂的粘附强度可以显着提高。