公开(公告)号：US4203082A

公开(公告)日：1980-05-13

申请号：US911082

申请日：1978-05-31

申请人： Masahide Tsukamoto ,  Masahiro Nagasawa ,  Hiroshi Yamazoe

发明人： Masahide Tsukamoto ,  Masahiro Nagasawa ,  Hiroshi Yamazoe

IPC分类号： H03H3/08 ,  H03H9/00 ,  H03H9/145 ,  H03H9/64 ,  H03H9/04 ,  H01L41/10 ,  H03H9/26 ,  H03H9/32

CPC分类号： H03H9/1455 ,  H03H9/0038 ,  H03H9/1452 ,  H03H9/14547 ,  H03H9/14558 ,  H03H9/14564 ,  H03H9/14567 ,  H03H9/14594 ,  H03H9/6433 ,  H03H9/14552

摘要： To obtain low insertion loss and low TTE level, a first central transducer, a second transducer and a third transducer are disposed on one surface of a piezoelectric substrate in such a manner that the second and the third transducers are in the direction of propagation (X-direction) of surface acoustic waves launched by the first transducer and the distance between center lines of the first and the second transducers and also the distance between the center lines of the first and the third transducers vary along the Y-direction perpendicular to the X-direction.

摘要翻译： 为了获得低插入损耗和低TTE电平，第一中心换能器，第二换能器和第三换能器以这样的方式设置在压电基板的一个表面上，使得第二和第三换能器处于传播方向（X 由第一换能器发射的表面声波和第一和第二换能器的中心线之间的距离以及第一和第三换能器的中心线之间的距离沿垂直于X的Y方向变化 -方向。

公开(公告)号：US06888072B2

公开(公告)日：2005-05-03

申请号：US09810846

申请日：2001-03-16

申请人： Masahide Tsukamoto ,  Kazufumi Yamaguchi ,  Takeshi Shimamoto ,  Fumikazu Tateishi

发明人： Masahide Tsukamoto ,  Kazufumi Yamaguchi ,  Takeshi Shimamoto ,  Fumikazu Tateishi

IPC分类号： H01L21/68 ,  H01L23/32 ,  H05K3/32 ,  H05K1/16

CPC分类号： H01L21/6835 ,  H01L23/32 ,  H01L24/16 ,  H01L24/72 ,  H01L2224/16238 ,  H01L2224/73251 ,  H01L2224/81901 ,  H01L2924/01078 ,  H01L2924/19041 ,  H05K3/325 ,  Y10T29/49137 ,  H01L2224/16 ,  H01L2224/72

摘要： A fixture with movable pawls and positioning walls is attached to a circuit board. An electronic component is inserted into the fixture from its upper side. Since the movable pawls move outward due to their slopes, the electronic component is allowed to fit between the positioning walls. After the fitting of the electronic component, the movable pawls hold the sides of the upper face of the electronic component and the positioning walls are in contact with the peripheral walls of the electronic component. Bumps provided on electrode pads of the electronic component are connected to electrodes on the circuit board. Thus, the electronic component can be mounted using the flip chip technique. In addition, the electronic component can be removed easily by moving the movable pawls even after being mounted.

摘要翻译： 具有可移动爪和定位壁的夹具连接到电路板。 电子部件从其上侧插入固定装置。 由于可动爪由于其斜面而向外移动，所以允许电子部件配合在定位壁之间。 在电子部件的装配之后，可动爪保持电子部件的上表面的侧面并且定位壁与电子部件的周壁接触。 提供在电子部件的电极焊盘上的凸起连接到电路板上的电极。 因此，可以使用倒装芯片技术来安装电子部件。 此外，即使在安装之后，通过移动可动爪也能够容易地去除电子部件。

公开(公告)号：US06197407B1

公开(公告)日：2001-03-06

申请号：US09304714

申请日：1999-05-04

申请人： Daizou Andou ,  Toshio Sugawa ,  Tadashi Nakamura ,  Hideki Higashitani ,  Masahide Tsukamoto

发明人： Daizou Andou ,  Toshio Sugawa ,  Tadashi Nakamura ,  Hideki Higashitani ,  Masahide Tsukamoto

IPC分类号： B32B300

CPC分类号： H05K3/20 ,  H05K3/007 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4623 ,  H05K3/4658 ,  H05K3/4688 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0384 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/2804

摘要： Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate, which are then heated and pressurized. After that, the supporting bases are removed, thus obtaining a circuit board in which the wiring layers have been embedded in the adhesive layers. The conductor within the through holes are compressed sufficiently, thus forming minute via holes with high reliability.

摘要翻译： 形成在其两面具有粘合层的电绝缘基板中的通孔填充有导体。 然后，将具有预定图案的布线层的支撑基板层压在电绝缘基板的两个表面上，然后被加热和加压。 之后，除去支撑基底，从而获得其中布线层已经嵌入粘合剂层中的电路板。 通孔内的导体被充分压缩，从而形成具有高可靠性的微通孔。

公开(公告)号：US5622590A

公开(公告)日：1997-04-22

申请号：US430484

申请日：1995-04-28

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  B32B7/12 ,  B29C65/54 ,  H01L21/58 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成阵列的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5550408A

公开(公告)日：1996-08-27

申请号：US408965

申请日：1995-03-23

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  H01L23/28

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2224/92125 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in a matrix. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成矩阵的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5406459A

公开(公告)日：1995-04-11

申请号：US939000

申请日：1992-09-02

申请人： Masahide Tsukamoto ,  Seiichi Nakatani ,  Toru Ishida

发明人： Masahide Tsukamoto ,  Seiichi Nakatani ,  Toru Ishida

IPC分类号： H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/16

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K1/181 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10977 ,  H05K2201/10984 ,  H05K2203/0191 ,  H05K3/28 ,  H05K3/305 ,  H05K3/32 ,  H05K3/3484 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623

摘要： An electric circuit board module includes a substrate with electric components mounted on one side thereof and electrodes provided on the other side thereof for the electric connection with the mounted electrical components. The electric circuit board module further includes conductor columns adhered to the electrodes and an adhesion layer provided on the other side of the substrate and around the conductor columns such that the conductor columns extrude from the adhesion layer by a predetermined length. By pressing the electric circuit board module against a separate circuit board to mount thereon, the electric components are electrically connected with electrodes of the sperate circuit board through conductor columns. Since conductor columns are made of a resinous paste with metallic powders dispersed therein, no heating operation as required in conventional module using a solder flow is necessary, resulting in that electric components are kept from the degradation caused by the heat.

摘要翻译： 一种电路板模块，包括其一侧安装有电气部件的基板和设置在其另一侧上的电极，用于与所安装的电气部件的电连接。 电路板模块还包括粘附到电极的导体柱和设置在基板的另一侧上并围绕导体柱的粘合层，使得导体列从粘合层挤出预定长度。 通过将电路板模块压靠在单独的电路板上以安装在其上，电气部件通过导体柱与工作电路板的电极电连接。 由于导体柱由分散有金属粉末的树脂浆料制成，因此不需要使用焊料流动的常规模块中的加热操作，导致电子部件不受热引起的劣化。

公开(公告)号：US4352162A

公开(公告)日：1982-09-28

申请号：US162614

申请日：1980-06-24

申请人： Tomoaki Nyuji ,  Itaru Kawasaki ,  Masahiro Noguchi ,  Masahide Tsukamoto

发明人： Tomoaki Nyuji ,  Itaru Kawasaki ,  Masahiro Noguchi ,  Masahide Tsukamoto

IPC分类号： G10L13/047 ,  G10L19/06 ,  H03H17/02 ,  G06F15/34 ,  G10L1/00

CPC分类号： H03H17/0285 ,  G10L13/047 ,  G10L19/06

摘要： A digital filter for a voice synthesis circuit which operates on the basis of the principle of linear predictive coding. More particularly, a digital filter of the lattice type for voice synthesis on the basis of the principle of linear predictive coding and capable of operating with a low clock frequency. Furthermore, the digital filter may use one multiplication circuit and one addition/subtraction circuit as well as containing an attenuation term element.

摘要翻译： 一种用于语音合成电路的数字滤波器，其基于线性预测编码的原理进行操作。 更具体地，基于线性预测编码的原理并且能够以低时钟频率操作的用于语音合成的格子类型的数字滤波器。 此外，数字滤波器可以使用一个乘法电路和一个加法/减法电路以及包含衰减项元件。

公开(公告)号：US06192581B1

公开(公告)日：2001-02-27

申请号：US08997624

申请日：1997-12-23

申请人： Masahide Tsukamoto

发明人： Masahide Tsukamoto

IPC分类号： H01K310

CPC分类号： H01L24/80 ,  H01L23/3107 ,  H01L23/49827 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/115 ,  H05K3/007 ,  H05K3/20 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4658 ,  H05K2201/0367 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49345 ,  H01L2924/00

摘要： A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material.

摘要翻译： 印刷电路板具有：具有第一通孔的基材层; 以及具有第二通孔的绝缘层，所述绝缘层设置在所述基材层的一个表面上，其中所述第二通孔的横截面面积小于所述第一通孔的横截面面积，以及 其中所述第一和第二通孔用导电材料填充。

公开(公告)号：US5858884A

公开(公告)日：1999-01-12

申请号：US856548

申请日：1997-05-15

申请人： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

发明人： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

IPC分类号： B32B15/14 ,  C08J5/04 ,  C09D5/25 ,  D04H1/00 ,  D04H1/42 ,  D04H1/58 ,  D21H13/26 ,  D21H17/52 ,  H05K1/02 ,  H05K1/03 ,  C08J5/24

CPC分类号： H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

摘要： A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan.delta.) peak value at 30.degree.-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

摘要翻译： 一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基材的预浸料坯和印刷线路板。

公开(公告)号：US5353108A

公开(公告)日：1994-10-04

申请号：US725667

申请日：1991-07-03

申请人： Masahide Tsukamoto

发明人： Masahide Tsukamoto

IPC分类号： G03G7/00 ,  G03G8/00 ,  G03G9/08 ,  G03G9/09 ,  G03G21/00

CPC分类号： G03G7/0006 ,  G03G21/00 ,  G03G7/00 ,  G03G8/00 ,  G03G9/0821 ,  G03G9/0926

摘要： A cleaning apparatus is designed to press a heat-soluble resin which is heated and in a tacky state to a heat-soluble ink on an erasable paper having a surface treated with releasing agent, and to peel off the heat-soluble ink.

摘要翻译： 一种清洁装置被设计成将被加热且处于粘性状态的热溶性树脂压制在具有用脱模剂处理的表面的可擦除纸上的热溶性油墨上，并剥离热溶性油墨。