公开(公告)号：US5750421A

公开(公告)日：1998-05-12

申请号：US789625

申请日：1997-01-27

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L21/60

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 一种半导体器件，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装， 引线从封装外部延伸。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5637923A

公开(公告)日：1997-06-10

申请号：US455909

申请日：1995-05-31

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L23/04

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 一种半导体器件，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装， 引线从封装外部延伸。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5475259A

公开(公告)日：1995-12-12

申请号：US961161

申请日：1992-10-16

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L23/02 ,  H01L23/12 ,  H01L23/48 ,  H01L29/40

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 半导体器件包括分别由内部引线和外部引线构成的多个引线，与引线的内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装 外引线延伸到封装外面。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US06472744B2

公开(公告)日：2002-10-29

申请号：US09084097

申请日：1998-05-26

申请人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

发明人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

IPC分类号： H01L2500

CPC分类号： H01L25/105 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2924/09701 ,  H01L2924/1533 ,  H01L2924/3025 ,  H01R12/82 ,  H05K7/1431 ,  H01L2924/00

摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

摘要翻译： 半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可分离地保持半导体器件的插座。

公开(公告)号：US5861669A

公开(公告)日：1999-01-19

申请号：US488673

申请日：1995-06-07

申请人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

发明人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

IPC分类号： H01L23/482 ,  H01L23/495 ,  H01L23/58 ,  H05K3/30 ,  H05K3/34 ,  H01L29/41

CPC分类号： H05K3/303 ,  H01L23/49555 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K3/3426 ,  Y02P70/613

摘要： A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

摘要翻译： 具有单列直插式封装的半导体器件包括：半导体芯片;封装体，其容纳半导体芯片并由一对相对的主表面限定;多个互连引线，其由所述封装主体保持，以基本上延伸 垂直于底面。 每个互连引线由位于封装主体内部的内引线部分和位于封装主体外部的外引线部分组成，外引线部分在内部与外部之间的边界处侧向弯曲，在第一 以及彼此相对并且基本上垂直于包装主体的相对主表面的第二方向。 多个支撑腿在包装体的底表面处横向延伸，用于当将半导体器件放置在基底上时支撑包装体直立。

公开(公告)号：US5736428A

公开(公告)日：1998-04-07

申请号：US789661

申请日：1997-01-27

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L21/58 ,  H01L21/60 ,  H01L21/66

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A process for manufacturing semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 一种制造半导体器件的方法，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片以及至少封装引线和半导体芯片的内部引线的封装 外引线延伸到封装外面。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5574310A

公开(公告)日：1996-11-12

申请号：US485117

申请日：1995-06-07

申请人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

发明人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

IPC分类号： H01L23/482 ,  H01L23/495 ,  H01L23/58 ,  H05K3/30 ,  H05K3/34 ,  H01L29/41

CPC分类号： H05K3/303 ,  H01L23/49555 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K3/3426 ,  Y02P70/613

摘要： A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

摘要翻译： 具有单列直插式封装的半导体器件包括：半导体芯片;封装体，其容纳半导体芯片并由一对相对的主表面限定;多个互连引线，其由所述封装主体保持，以基本上延伸 垂直于底面。 每个互连引线由位于封装主体内部的内引线部分和位于封装主体外部的外引线部分组成，外引线部分在内部与外部之间的边界处侧向弯曲，在第一 以及彼此相对并且基本上垂直于包装主体的相对主表面的第二方向。 多个支撑腿在包装体的底表面处横向延伸，用于当将半导体器件放置在基底上时支撑包装体直立。

公开(公告)号：US5521432A

公开(公告)日：1996-05-28

申请号：US252540

申请日：1994-06-01

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Junichi Kasai ,  Michio Sono

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Junichi Kasai ,  Michio Sono

IPC分类号： H01L23/495 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/48 ,  H01L23/49582 ,  H05K3/3426 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01202 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/351 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

摘要： A semiconductor device includes a semiconductor chip, a die-pad on which the semiconductor chip is mounted, a package encapsulating the die pad and the semiconductor chip, and a plurality of leads electrically connected to the semiconductor chip and projecting from the package, wherein each of the leads has a lead body made of pure nickel (Ni) having a purity equal to or greater than 99% and a first film formed thereon, the first film being made of palladium (Pd).

摘要翻译： 半导体器件包括半导体芯片，其上安装有半导体芯片的芯片焊盘，封装芯片焊盘和半导体芯片的封装以及与半导体芯片电连接并从封装突出的多个引线，其中， 的引线具有由纯度等于或大于99％的纯镍（Ni）制成的铅体和形成在其上的第一膜，第一膜由钯（Pd）制成。

公开(公告)号：US07144754B2

公开(公告)日：2006-12-05

申请号：US10856777

申请日：2004-06-01

申请人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

发明人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L21/50

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

摘要翻译： 一种包括芯片的装置和密封芯片的树脂封装，树脂封装具有位于树脂封装的安装侧表面上的树脂突起。 金属膜分别设置在树脂突起上。 连接部件电连接芯片的电极焊盘和金属膜。

公开(公告)号：US06495773B1

公开(公告)日：2002-12-17

申请号：US09160536

申请日：1998-09-25

申请人： Ryuji Nomoto ,  Kazuto Tsuji ,  Mitsutaka Sato ,  Junichi Kasai

发明人： Ryuji Nomoto ,  Kazuto Tsuji ,  Mitsutaka Sato ,  Junichi Kasai

IPC分类号： H05K116

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49109 ,  H01L2224/4945 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85009 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399

摘要： A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead so as to form a predetermined loop, and a second bonding process for forming a second ball-shaped part in a predetermined position in the wire; and a second bonding process for bonding the second ball-shaped part to a semiconductor element pad that serves as a second connected member.

摘要翻译： 引线接合方法包括用于在线中形成第一球形部分并将第一球形部分接合到第一连接部件的第一接合工艺; 一种用于将线材从导线接合的位置引导到内部引线以形成预定的环路的滚珠形部分形成工艺，以及用于在预定位置形成第二球形部件的第二接合工艺 电线; 以及用于将第二球形部件接合到用作第二连接部件的半导体元件衬垫的第二接合工艺。