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68 条记录 (耗时 0.047 秒)

    Thin multichip flex-module
    11.
    发明授权
    Thin multichip flex-module 失效
    薄多芯片柔性模块

    公开(公告)号：US07429788B2

    公开(公告)日：2008-09-30

    申请号：US11715091

    申请日：2007-03-07

    申请人： James E. Clayton ,  Zakaryae Fathi

    发明人： James E. Clayton ,  Zakaryae Fathi

    IPC分类号： H01L23/02

    CPC分类号： H05K1/189 ,  H01L23/473 ,  H01L23/5387 ,  H01L25/50 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/0064 ,  H05K2201/0191 ,  H05K2201/056 ,  H05K2201/09118 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/2018 ,  H01L2924/00

    摘要： A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.

    摘要翻译： 薄多芯片模块包括：可折叠框架，其包括两个刚性的基本平坦的构件，其能够围绕选定的折叠轴线折叠在一起以形成基本封闭的结构; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路在其各自表面的每一个的至少一部分上结合到所述平面构件中的至少一个; 并且模块上的电极被配置为在框架关闭之后可以被外部插座访问。 一种制造薄多芯片模块的方法包括以下步骤：a。 将集成电路芯片附接到柔性电路; b。 将柔性电路接合到可折叠框架，该可折叠框架包括两个刚性的基本平坦的构件，能够围绕选定的折叠轴线折叠在一起以形成基本封闭的结构; 和，c。 将框架围绕折叠轴线折叠约180°。

    Thermal management system for computers
    12.
    发明申请
    Thermal management system for computers 审中-公开
    电脑热管理系统

    公开(公告)号：US20080192428A1

    公开(公告)日：2008-08-14

    申请号：US12069372

    申请日：2008-02-08

    申请人： James E. Clayton ,  Zakaryae Fathi ,  James R. Gentry

    发明人： James E. Clayton ,  Zakaryae Fathi ,  James R. Gentry

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/20 ,  H05K1/0203 ,  H05K1/189 ,  H05K3/0061 ,  H05K7/20727 ,  H05K2201/056 ,  H05K2201/064 ,  H05K2201/09445 ,  H05K2201/10159

    摘要： The invention involves systems to channel the air available for cooling inside the chassis of the computing device to force the air into selected channels in the memory bank (i.e., between the modules rather than around the modules or some other path of least resistance). This tunneled cooling (or collimated cooling) is made possible by using a set of baffles (or apertures) placed upstream of and between the cooling air supply and the memory bank area to force air to go only through the rectangular space available between adjacent modules in the memory bank of the high speed computing machines (super computers or blade servers in these cases). In some instances, it may be desirable to include both a blower fan, for forcing cool air through the baffles and through the heat exchanger(s) aligned with openings in the baffles, and a suction fan to draw or pull air as it exits the rear of the blade server chassis. The invention includes a high performance heat exchanger to be thermally coupled to the memory chips and either placed between adjacent modules (in the memory bank) or integrated within a cross sectional area of the module that is in the cooling air path; whereby, the heat from a given module is transferred laterally to a heat sink that, in turn, transfers the heat to the heat exchanger which in turn is placed in the path of cool air. However in this case, the cool air has no other alternative path but to pass through the high performance heat exchanger. The efficiency of heat exhaust is thereby maximized. Lateral heat conduction and removal is a preferred method for module cooling in order to minimize the total module height of vertically mounted Very Low Profile (VLP) memory modules. The invention is applicable to a wide range of modules; however, it is particularly suitable for a set of memory modules with unique packaging techniques that further enhance the heat exhaust.

    摘要翻译： 本发明涉及将可用于在计算设备的机箱内部进行冷却的空气通道的系统，以迫使空气进入存储器组中的选定通道（即，在模块之间，而不是在模块周围或最小阻力的某些其他路径上）。 这种隧道式冷却（或准直冷却）可以通过使用放置在冷却空气供应和存储器区域之间和之间的一组挡板（或孔）来实现，以迫使空气仅通过相邻模块之间可用的矩形空间 高速计算机的存储器（这些情况下是超级计算机或刀片服务器）。 在一些情况下，可能期望包括鼓风扇，用于迫使冷空气通过挡板并通过与挡板中的开口对准的热交换器，以及抽风机，以在空气流出时吸入或拉动空气 刀片服务器机箱的后部。 本发明包括一个高性能热交换器，它被热耦合到存储器芯片，并且放置在相邻模块之间（在存储体中）或集成在模块的处于冷却空气路径的横截面区域内; 由此，来自给定模块的热量横向转移到散热器，散热器又将热量传递到热交换器，热交换器又被放置在冷空气的路径中。 然而，在这种情况下，冷空气没有其他替代路径，而是通过高性能热交换器。 从而使排热效率最大化。 侧向热传导和去除是模块冷却的首选方法，以便将垂直安装的超薄型（VLP）存储器模块的总模块高度最小化。 本发明适用于各种模块; 然而，它特别适用于具有独特封装技术的一组存储器模块，其进一步增强了散热。

    Thin multi-chip flex module
    19.
    再颁专利
    Thin multi-chip flex module 有权
    薄多芯片柔性模块

    公开(公告)号：USRE42252E1

    公开(公告)日：2011-03-29

    申请号：US12804381

    申请日：2010-07-20

    申请人： James E. Clayton ,  Zakaryae Fathi

    发明人： James E. Clayton ,  Zakaryae Fathi

    IPC分类号： H05K1/00 ,  H05K7/20

    CPC分类号： H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

    摘要： A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

    摘要翻译： 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。