公开(公告)号：US5862588A

公开(公告)日：1999-01-26

申请号：US514703

申请日：1995-08-14

申请人： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

发明人： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC分类号： B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/91 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  H05K13/04

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H05K3/3415 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  H05K3/3436 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265

摘要： A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

摘要翻译： 一种制造互连结构和电路板的方法，包括将布置在背板上的基板上的相应金属触点上具有连接凸块的区域阵列部件放置在一起，提供与凸块和触点相连通的热固化连接材料，直接接触气体喷嘴 到围绕组件的基板的一部分，以将衬底压在喷嘴和背板之间，以限制衬底的包裹，加热组件，接合材料和接近金属触点的衬底，同时将喷嘴保持在衬底上以固化 接合材料，并冷却组件，接合材料和基底。 选择的部件也可以利用气体喷嘴进行更换，以限制基材的包装。

公开(公告)号：US5315227A

公开(公告)日：1994-05-24

申请号：US010888

申请日：1993-01-29

申请人： Mark V. Pierson ,  How T. Lin

发明人： Mark V. Pierson ,  How T. Lin

IPC分类号： B60L8/00 ,  B60L11/18 ,  H02J7/35 ,  H02J7/00

CPC分类号： B60L11/1818 ,  B60L11/1824 ,  B60L11/1833 ,  B60L11/1844 ,  H02J7/355 ,  B60L2200/26 ,  B60L2210/30 ,  B60L2230/22 ,  B60L2230/30 ,  Y02E60/721 ,  Y02T10/7005 ,  Y02T10/7088 ,  Y02T10/7241 ,  Y02T90/121 ,  Y02T90/125 ,  Y02T90/127 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/163 ,  Y04S10/126 ,  Y10S136/291 ,  Y10S136/293

摘要： A solar recharge station is described having a contact area, a battery bank charge area and a solar panel array for maintaining the battery bank charged. The contact area includes electric contacts formed for engagement automatically by contacts on an electric powered vehicle as the vehicle enters the contact area. The battery bank is connected so that its energy is available for either recharging the vehicle or other use, and in case the vehicle needs a recharge but the battery banks lacks sufficient charge, ordinary house voltage is used.

摘要翻译： 描述了具有接触区域，电池组充电区域和用于维持电池组充电的太阳能电池板阵列的太阳能充电站。 接触区域包括当车辆进入接触区域时由电动车辆上的触点自动地接合形成的电触头。 电池组被连接，使得其能量可用于对车辆或其他用途进行充电，并且如果车辆需要充电，但是电池组缺少足够的电量，则使用普通房屋电压。

公开(公告)号：US4273393A

公开(公告)日：1981-06-16

申请号：US76975

申请日：1979-09-20

申请人： Michael S. Foley ,  Mark V. Pierson

发明人： Michael S. Foley ,  Mark V. Pierson

IPC分类号： H05K13/00 ,  B23P19/00 ,  B65G1/04 ,  B65G1/06 ,  B65G1/10 ,  B65G1/133 ,  B65G59/06 ,  A47F5/02 ,  H05K13/04

CPC分类号： B65G1/045 ,  B65G1/10 ,  Y10T29/515

摘要： A dispensing device for small parts arranged in a compact shape from when the parts can be withdrawn from a single point including a plurality of vertically stacked trays slidably disposed upon banks of spaced flanges which are rotatable about a central axis of the device and reciprocable in a plane parallel to the central axis. The uppermost and lowermost trays in the stack are free to rotate with the flanges and the balance of the trays are restrained from rotation so as to be disengaged from one bank of flanges and received between the planes of another bank of flanges.

摘要翻译： 一种用于小部件的分配装置，其布置成紧凑的形状，从零件可以从包括多个垂直堆叠的托盘中的单个点撤出时，该托盘可滑动地设置在间隔开的凸缘组上，该凸缘可围绕装置的中心轴线旋转， 平行于中心轴的平面。 堆叠中的最上面和最下面的托盘随着凸缘自由旋转，并且托盘的平衡被限制在旋转中，以便与一组凸缘分离并容纳在另一组凸缘的平面之间。

公开(公告)号：US11083316B1

公开(公告)日：2021-08-10

申请号：US13161767

申请日：2011-06-16

申请人： Mark V. Pierson ,  Anthony D'Amelia

发明人： Mark V. Pierson ,  Anthony D'Amelia

IPC分类号： A47G21/06 ,  A47G21/02 ,  A47F1/10

摘要： Recyclable and dispensable hygienic cutlery utensil. A preferred embodiment of the present invention includes a handle portion and head portion. The handle portion provides suitable area for gripping and includes a chamfer on its outer edge for facilitating a predictable release from a utensil dispenser. The head portion is formed into the shape of a common cutlery utensil such as: knife with large radius, tapered knife with large radius, spoon, set of tines (fork), and spoon-fork combination, to name a few. The head portion also includes an escapement feature in its outer edge for facilitating controlled release from the bottom of a stack of utensils. The escapement feature can include a notch or predetermined release radius. Typically in use, a set of utensils is stacked, forming a cartridge which is then inserted into an automated dispensing system.

公开(公告)号：US08272533B1

公开(公告)日：2012-09-25

申请号：US12831396

申请日：2010-07-07

申请人： Anthony D'Amelia ,  Mark V. Pierson

发明人： Anthony D'Amelia ,  Mark V. Pierson

IPC分类号： B65H3/00

CPC分类号： A47F1/10 ,  A47F2001/103

摘要： A device for dispensing cutlery utensils individually, having a housing containing a quantity of utensils with the housing having sides and product guides within. The front wall contains an opposing leaf escapement mechanism connected to it, to hold and singulate the utensils such that they dispense seriatim, without a user being required to physically touch or interface with any part of dispenser other than the actual desired utensil.

摘要翻译： 一种用于单独分配餐具的装置，具有容纳多个器具的壳体，所述壳体具有侧面和产品引导件。 前壁包含连接到其上的相对的叶片擒纵机构，以保持和分割器具，使得它们可以分配，而不需要用户物理地接触或与实际需要的器具以外的分配器的任何部分相接触。

公开(公告)号：US06955982B2

公开(公告)日：2005-10-18

申请号：US10715649

申请日：2003-11-18

申请人： Miguel A. Jimarez ,  Cynthia S. Milkovich ,  Mark V. Pierson

发明人： Miguel A. Jimarez ,  Cynthia S. Milkovich ,  Mark V. Pierson

IPC分类号： H01R12/04 ,  B23K1/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01R4/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H01L21/44 ,  B23K31/00 ,  B23K31/02 ,  B21D39/00

CPC分类号： H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/10126 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81013 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/0032 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00014

摘要： An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip carrier to a circuit card). The melting point of the first conductive body exceeds the melting point of the second conductive body. The second conductive body may include eutectic lead-tin alloy, while the first conductive body may include non-eutectic lead-tin alloy. A portion of the first conductive body is coated with, or volumetrically surrounded by, a material that is nonsolderable and nonconductive. The first and second conductive bodies are coupled mechanically and electrically by surface adhesion at an uncoated portion of the first conductive body, by application of a temperature that lies between the melting points of the first and second conductive bodies.

摘要翻译： 一种电结构和相关制造方法，用于减少将第一衬底的第一导体与第二衬底的第二导电体（例如，芯片耦合到芯片载体;芯片载体）的结构中的热诱导应变 到电路卡）。 第一导电体的熔点超过第二导电体的熔点。 第二导电体可以包括共晶铅锡合金，而第一导电体可以包括非共晶铅锡合金。 第一导电体的一部分被不可焊接和不导电的材料涂覆或体积地包围。 通过施加位于第一和第二导电体的熔点之间的温度，第一和第二导电体通过在第一导电体的未涂覆部分处的表面粘附机械和电连接。

公开(公告)号：US06922294B2

公开(公告)日：2005-07-26

申请号：US10428956

申请日：2003-05-02

申请人： Mark V. Pierson ,  Eugen Schenfeld

发明人： Mark V. Pierson ,  Eugen Schenfeld

IPC分类号： H04B10/12 ,  G02B6/26 ,  G02B6/43 ,  H04B10/13 ,  H04B10/135 ,  H04B10/14 ,  G02B7/02 ,  G02B6/34

CPC分类号： G02B6/43

摘要： An optical assembly comprising an optical cube. A first optical transmitter chip and a first optical receiver chip are mounted on one surface of the optical cube. A first continuous printed circuit board is soldered to electrical surfaces of the first optical transmitter chip and the first optical receiver chip opposite the optical cube. A second optical transmitter chip and a second optical receiver chip are mounted on an opposite surface of the optical cube. A second continuous printed circuit board is soldered to electrical surfaces of the second optical transmitter chip and the second optical receiver chip opposite the optical cube. The first optical transmitter chip is optically aligned with the second optical receiver chip through the optical cube. The second optical transmitter chip is optically aligned with the first optical receiver chip through the optical cube. The first and second printed circuit boards may be bent ninety degrees and soldered to another printed circuit board, or connected to an edge connector on another printed circuit board.

摘要翻译： 一种包括光学立方体的光学组件。 第一光发射机芯片和第一光接收芯片安装在光学立方体的一个表面上。 将第一连续印刷电路板焊接到与光学立方体相对的第一光发射器芯片和第一光接收器芯片的电表面。 第二光发射器芯片和第二光接收器芯片安装在光学立方体的相对表面上。 将第二连续印刷电路板焊接到与光学立方体相对的第二光发射器芯片和第二光接收器芯片的电表面。 第一光发射器芯片通过光学立方体与第二光接收器芯片光学对准。 第二光发射器芯片通过光学立方体与第一光接收器芯片光学对准。 第一和第二印刷电路板可以弯曲九十度并且焊接到另一个印刷电路板，或者连接到另一个印刷电路板上的边缘连接器。

公开(公告)号：US06805280B2

公开(公告)日：2004-10-19

申请号：US10041261

申请日：2002-01-08

申请人： Lisa J. Jimarez ,  Mark V. Pierson

发明人： Lisa J. Jimarez ,  Mark V. Pierson

IPC分类号： B23K120

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4623 ,  H05K2201/096

摘要： The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

摘要翻译： 本发明提供了一种附接多个芯的方法，其中芯具有导电表面的通孔以电连接到另一芯上的导电表面。 该方法提供将冶金膏施加到导电表面，从糊料中去除一部分助熔剂并连接两个芯。 本发明还提供了一种包括多个芯的结构，其中冶金膏将通孔与芯上的导电表面电连接到另一芯上的导电表面。

公开(公告)号：US06719871B2

公开(公告)日：2004-04-13

申请号：US09757185

申请日：2001-01-09

申请人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

发明人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC分类号： B32B3114

CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

公开(公告)号：US06517662B2

公开(公告)日：2003-02-11

申请号：US09397739

申请日：1999-09-16

申请人： Thomas M. Culnane ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Charles G. Woychik

发明人： Thomas M. Culnane ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Charles G. Woychik

IPC分类号： B29C6502

CPC分类号： H01L23/49572 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/1532

摘要： A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive composition which comprises a microporous film laden with a curable adhesive is disposed between the flexible substrate and the stiffener. A cover plate is adhesively bonded to the semiconductor chip and to the stiffener. A process of making the assembly involving disposition of the flexible substrate in a vacuum fixture upon which the adhesive composition and stiffener is placed followed by the application of heat and pressure to cure the curable adhesive is also described.

摘要翻译： 一种半导体芯片载体组件，其包括在其表面之一上具有与半导体芯片电连通的金属化路径的柔性基板。 加强件邻近所述柔性基底设置并通过粘合剂组合物与其结合。 将包含可固化粘合剂的微孔膜的粘合剂组合物设置在柔性基材和加强件之间。 盖板粘合到半导体芯片和加强件上。 还描述了将柔性基底设置在其中放置粘合剂组合物和加强件的真空固定装置中，随后施加热和压力以固化可固化粘合剂的方法。