公开(公告)号：US20080076373A1

公开(公告)日：2008-03-27

申请号：US11905063

申请日：2007-09-27

申请人： Kouji Takahashi ,  Kosuke Ota

发明人： Kouji Takahashi ,  Kosuke Ota

IPC分类号： H04B1/06

CPC分类号： H03G3/3078

摘要： In a wireless receiver apparatus including a gain control amplifier for controlling a gain of a reception signal, a maintaining device compulsorily maintains the gain of the gain control amplifier at a predetermined fixed value only in a predetermined specified interval. The maintaining device includes a latch circuit for maintaining a gain set value immediately prior to the specified interval. A start timing of the specified interval is determined by an edge of a predetermined timer start signal, and a duration of the specified interval is determined on the basis of a count of a predetermined timer clock signal and a count of a predetermined timer count set bus signal.

摘要翻译： 在包括用于控制接收信号的增益的增益控制放大器的无线接收机装置中，保持装置仅在预定的指定间隔内强制地将增益控制放大器的增益保持在预定的固定值。 保持装置包括用于在紧接指定间隔之前维持增益设定值的锁存电路。 指定间隔的开始定时由预定定时器启动信号的边缘确定，并且基于预定定时器时钟信号的计数和预定定时器计数总线的计数来确定指定间隔的持续时间 信号。

公开(公告)号：US07276793B2

公开(公告)日：2007-10-02

申请号：US11054025

申请日：2005-02-08

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L23/48

CPC分类号： H05K1/188 ,  H01L21/4821 ,  H01L21/4832 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/165 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05557 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/187 ,  H05K3/06 ,  H05K3/202 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01046 ,  H01L2924/3512

摘要： A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the insulating resin 44 and sealed. With this arrangement, fractures of the conductive paths 40 embedded in the insulating resin 44 are suppressed.

摘要翻译： 提供一种半导体器件，其中由晶体形成的导电路径40沿着XY轴比沿着Z轴更好地嵌入绝缘树脂44中，并且导电路径40的背表面通过绝缘树脂44暴露 并密封。 通过这种布置，抑制了嵌入绝缘树脂44中的导电通路40的断裂。

公开(公告)号：US07271282B1

公开(公告)日：2007-09-18

申请号：US10019287

申请日：2000-07-19

申请人： Yasuyuki Kawahara ,  Kouji Takahashi ,  Makiko Takii

发明人： Yasuyuki Kawahara ,  Kouji Takahashi ,  Makiko Takii

IPC分类号： C07C69/74 ,  C07C69/34 ,  C07C69/75

CPC分类号： C07C69/75 ,  C07C2601/14 ,  C07C2601/16 ,  C10M105/36 ,  C10M129/72 ,  C10M171/008 ,  C10M2207/282 ,  C10M2207/2825 ,  C10M2207/34 ,  C10M2211/022 ,  C10M2211/06 ,  C10N2240/00 ,  C10N2240/22 ,  C10N2240/30 ,  C10N2240/50 ,  C10N2240/52 ,  C10N2240/54 ,  C10N2240/56 ,  C10N2240/58 ,  C10N2240/60 ,  C10N2240/66

摘要： A diester represented by the formula wherein A represents a cyclohexane ring, cyclohexene ring or benzene ring, X is H or methyl group, RX and RY are the same or different and each is C3-C18 branched-chain alkyl group, C1-C18 straight-chain alkyl group, C2-C18 straight-chain alkenyl or C3-C10 cycloalkyl, provided that when A is a benzene ring, RX and RY are different from each other and —COORX and —COORY are attached to two adjacent carbon atoms of the benzene ring, and having the following properties: 1) a total acid number of 0.05 mgKOH/g or less, 2) a sulfated ash content of 10 ppm or less, 3) a sulfur content of 20 ppm or less, 4) a phosphorus content of 20 ppm or less, 5) a peroxide value of 1.0 meq/kg or less, 6) a carbonyl value of 10 or less; 7) a volume resistivity of 1×1011Ω·cm or more, 8) a hydroxyl value of 3 mgKOH/g or less, and 9) a water content of 100 ppm or less, a process for preparing the same and a refrigerator lubricating oil comprising the diester.

摘要翻译： 由下式表示的二酯其中A表示环己烷环，环己烯环或苯环，X为H或甲基，R X和R Y相同或不同 并且各自为C 3 -C 18支链烷基，C 1 -C 18直链烷基，C 2 -C 18直链烯基或C 3 -C 10环烷基，条件是当A为苯环时，R X' SUP>和R Y'彼此不同，-COOR X和-COOR Y连接到苯环的两个相邻碳原子上 ，具有以下特性：1）总酸值为0.05mgKOH / g以下，2）硫酸灰分含量为10ppm以下，3）硫含量为20ppm以下，4）磷含量 20ppm以下，5）过氧化值为1.0meq / kg以下，6）羰基值为10以下; 7）体积电阻率为1×10 11Ω或更大，8）羟值为3mgKOH / g以下，9）水含量为100ppm以下，制备方法 和含有二酯的冰箱润滑油。

公开(公告)号：US07138296B2

公开(公告)日：2006-11-21

申请号：US10854946

申请日：2004-05-26

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L21/44

CPC分类号： H01L24/32 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48669 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48769 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85469 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device is described. A board that includes a flat back face, corresponding to a resin sealing area, and a front face that has projections is provided. The projections are formed of a metal that is integral with the board and include (a) a bonding pad provided in an area surrounded by an area that contacts an upper die, (b) a wiring that is integrated with the bonding pad and which extends to a semiconductor element mounting area, and (c) an electrode provided in one body with the wiring. A semiconductor element is mounted on the semiconductor element area and electrically connected to the bonding pad. The board is placed on a lower die and resin is filled into a space formed by the board and upper die. The board is divided into multiple devices such that the projections are separated by removing the board exposed at the back face of the resin.

摘要翻译： 对半导体装置的制造方法进行说明。 提供了包括对应于树脂密封区域的平坦背面和具有突起的前表面的板。 突起由与板成一体的金属形成，并且包括（a）设置在由与上模接触的区域包围的区域中的接合焊盘，（b）与焊盘一体化的布线，并且延伸 涉及半导体元件安装区域，以及（c）在一个主体中设置有布线的电极。 半导体元件安装在半导体元件区域上并电连接到接合焊盘。 将板放在下模上，将树脂填充到由板和上模形成的空间中。 板被分成多个装置，使得通过移除在树脂的背面露出的板来分离突起。

公开(公告)号：US20050146052A1

公开(公告)日：2005-07-07

申请号：US11054025

申请日：2005-02-08

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/98 ,  H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H01L25/16 ,  H05K1/18 ,  H05K3/06 ,  H05K3/20

CPC分类号： H05K1/188 ,  H01L21/4821 ,  H01L21/4832 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/165 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05557 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/187 ,  H05K3/06 ,  H05K3/202 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01046 ,  H01L2924/3512

摘要： A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the insulating resin 44 and sealed. With this arrangement, fractures of the conductive paths 40 embedded in the insulating resin 44 are suppressed.

摘要翻译： 提供一种半导体器件，其中由晶体形成的导电路径40沿着XY轴比沿着Z轴更好地嵌入绝缘树脂44中，并且导电路径40的背表面通过绝缘树脂44暴露 并密封。 通过这种布置，抑制了嵌入绝缘树脂44中的导电通路40的断裂。

公开(公告)号：US06894375B2

公开(公告)日：2005-05-17

申请号：US10652184

申请日：2003-08-29

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L23/28 ,  G11B5/48 ,  H01L21/48 ,  H01L23/12 ,  H01L23/29 ,  H01L23/36 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H01L23/02 ,  H01L23/10

CPC分类号： H01L23/3135 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/4334 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10416 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a flexible sheet become substantially within a same plane, so that it is readily affixed to a second supporting member (24). In addition, the top surface of the heat radiation electrode (15) is made protrusive beyond the top surfaces of the pads (14) to reduce the distance between the semiconductor chip (16) and the heat radiation electrode (15). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

摘要翻译： 散热电极（15）从绝缘树脂（13）的背面露出，金属板（23）固定在该放热电极（15）上。 该金属板（23）的后表面和柔性片的后表面基本上在相同的平面内，从而容易地固定在第二支撑构件（24）上。 此外，散热电极（15）的顶表面被突出超过焊盘（14）的顶表面，以减小半导体芯片（16）和散热电极（15）之间的距离。 因此，可以通过散热电极（15），金属板（23）和第二支撑构件（24）有效地散发由半导体芯片产生的热量。

公开(公告)号：US20050038283A1

公开(公告)日：2005-02-17

申请号：US10952925

申请日：2004-09-30

申请人： Yasuyuki Kawahara ,  Kouji Takahashi ,  Makiko Takii

发明人： Yasuyuki Kawahara ,  Kouji Takahashi ,  Makiko Takii

IPC分类号： C07C69/75 ,  C07C69/80 ,  C10M105/36 ,  C10M129/72 ,  C10M171/00 ,  C07C69/76 ,  C07C69/74

CPC分类号： C07C69/75 ,  C07C2601/14 ,  C07C2601/16 ,  C10M105/36 ,  C10M129/72 ,  C10M171/008 ,  C10M2207/282 ,  C10M2207/2825 ,  C10M2207/34 ,  C10M2211/022 ,  C10M2211/06 ,  C10N2240/00 ,  C10N2240/22 ,  C10N2240/30 ,  C10N2240/50 ,  C10N2240/52 ,  C10N2240/54 ,  C10N2240/56 ,  C10N2240/58 ,  C10N2240/60 ,  C10N2240/66

摘要： A diester represented by the formula wherein A represents a cyclohexane ring, cyclohexene ring or benzene ring, X is H or methyl group, RX and RY are the same or different and each is C3-C18 branched-chain alkyl group, C1-C18 straight-chain alkyl group, C2-C18 straight-chain alkenyl or C3-C18 cycloalkyl, provided that when A is a benzene ring, RX and RY are different from each other and —COORX and —COORY are attached to two adjacent carbon atoms of the benzene ring, and having the following properties: 1) a total acid number of 0.05 mgKOH/g or less, 2) a sulfated ash content of 10 ppm or less, 3) a sulfur content of 20 ppm or less, 4) a phosphorus content of 20 ppm or less, 5) a peroxide value of 1.0 meq/kg or less, 6) a carbonyl value of 10 or less; 7) a volume resistivity of 1×1011 Ω·cm or more, 8) a hydroxyl value of 3 mgKOH/g or less, and 9) a water content of 100 ppm or less, a process for preparing the same and a refrigerator lubricating oil comprising the diester.

摘要翻译： 由下式表示的二酯其中A表示环己烷环，环己烯环或苯环，X为H或甲基，R X和R Y相同或不同，各自为C 3 -C 18支链烷基 基团，C 1 -C 18直链烷基，C 2 -C 18直链烯基或C 3 -C 18环烷基，条件是当A为苯环时，R X和R Y彼此不同且为-COOR 和-COOR 连接在苯环的两个相邻碳原子上，具有以下性质：1）总酸值为0.05mgKOH / g以下，2）硫酸盐灰分为10ppm 或更少，3）硫含量为20ppm以下，4）磷含量为20ppm以下，5）过氧化值为1.0meq / kg以下，6）羰基值为10以下; 7）体积电阻率为1×10 11Ω·cm以上，8）羟值为3mgKOH / g以下，9）水含量为100ppm以下，其制备方法和冰箱 包含二酯的润滑油。

公开(公告)号：US06646331B2

公开(公告)日：2003-11-11

申请号：US09809857

申请日：2001-03-16

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L2302

CPC分类号： H01L23/3135 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/4334 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10416 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a flexible sheet become substantially within a same plane, so that it is readily affixed to a second supporting member (24). In addition, the top surface of the heat radiation electrode (15) is made protrusive beyond the top surfaces of the pads (14) to reduce the distance between the semiconductor chip (16) and the heat radiation electrode (15). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

摘要翻译： 散热电极（15）从绝缘树脂（13）的背面露出，金属板（23）固定在该放热电极（15）上。 该金属板（23）的后表面和柔性片的后表面基本上在相同的平面内，从而容易地固定在第二支撑构件（24）上。 此外，散热电极（15）的顶表面被突出超过焊盘（14）的顶表面，以减小半导体芯片（16）和散热电极（15）之间的距离。 因此，可以通过散热电极（15），金属板（23）和第二支撑构件（24）有效地散发由半导体芯片产生的热量。

公开(公告)号：US06562660B1

公开(公告)日：2003-05-13

申请号：US09671220

申请日：2000-09-27

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L2144

CPC分类号： H05K1/188 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/20 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2224/45147

摘要： After a trench 54 is formed in a first conductive foil 60A, the circuit elements are mounted, and the insulating resin is applied on the laminated conductive foil 60 as the support substrate. After being inverted, a second conductive foil 60B is etched on the insulating resin 50 as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths 51 and the circuit elements 52 are supported by the insulating resin 50, without the use of the support substrate. And the interconnects L1 to L3 for the circuit are formed, and can be prevented from slipping because of the curved structure and a visor 58.

摘要翻译： 在第一导电箔60A中形成沟槽54之后，安装电路元件，并且将绝缘树脂施加在作为支撑基板的层叠导电箔60上。 倒置之后，第二导电箔60B被蚀刻在绝缘树脂50上，作为用于分离成导电路径的支撑基板。 因此，可以制造其中导电通路51和电路元件52由绝缘树脂50支撑的电路装置，而不使用支撑基板。 并且形成用于电路的互连L1至L3，并且可以防止由于弯曲结构和遮阳板58而滑动。

公开(公告)号：US06251523B1

公开(公告)日：2001-06-26

申请号：US09329427

申请日：1999-06-10

申请人： Kouji Takahashi ,  Hideki Okamoto

发明人： Kouji Takahashi ,  Hideki Okamoto

IPC分类号： B32B1706

CPC分类号： B32B17/10036 ,  B32B17/10174 ,  B32B17/10761 ,  C03C17/007 ,  C03C17/42 ,  C03C2217/452 ,  C03C2217/478 ,  C03C2217/732 ,  C03C2217/76 ,  C03C2217/77 ,  C03C2218/113 ,  C03C2218/365 ,  G02B1/11 ,  G02B1/12 ,  Y10T428/31612

摘要： There is provided a glass plate suitable for windows of automobile which shows small reflectivity at high incident angle and gives improved visibility. A film comprising the chain silica fine particles and silica of 5 to 30% by weight based on the weight of said chain silica fine particles and having a thickness of 110 to 250 nm is coated on at least one of the glass substrate surfaces, and dents and projections are formed on the surface of said film, by which a glass plate for an automobile which shows small reflectivity at high incident angle is provided.

摘要翻译： 提供了一种适用于汽车窗户的玻璃板，其在高入射角度下显示出较小的反射率，并提高了可见度.1。一种薄膜，其包含基于所述链状二氧化硅细粉末重量的5至30重量％的链状二氧化硅细颗粒和二氧化硅 颗粒并且具有110至250nm的厚度涂覆在至少一个玻璃基板表面上，并且在所述膜的表面上形成凹陷和突起，通过该表面，在高事件处显示小的反射率的汽车用玻璃板 提供角度。