公开(公告)号：US10018576B2

公开(公告)日：2018-07-10

申请号：US14586842

申请日：2014-12-30

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Robert Floyd Payne

IPC: G01V3/10 ,  G01N22/00

CPC classification number: G01N22/00

Abstract: A dielectric waveguide (DWG) may be used to identify a composition of a material that is in contact with the DWG. A radio frequency (RF) signal is transmitted into a dielectric waveguide located in contact with the material. The RF signal is received after it passes through the DWG. An insertion loss of the DWG is determined. The presence of the material may be inferred when the insertion loss exceeds a threshold value. The composition of the material may be inferred based on a correlation with the insertion loss. Alternatively, a volume of the material may be inferred based on a correlation with the insertion loss.

公开(公告)号：US20180181076A1

公开(公告)日：2018-06-28

申请号：US15393096

申请日：2016-12-28

Applicant: Texas Instruments Incorporated

Inventor： Bradley Allen Kramer ,  Benjamin Stassen Cook ,  Juan Alejandro Herbsommer

IPC: G04F5/14 ,  H01S5/183

CPC classification number: G04F5/14 ,  H01S5/005 ,  H01S5/022 ,  H01S5/02438 ,  H01S5/02453 ,  H01S5/0687 ,  H01S5/183 ,  H03B17/00 ,  H03L7/26

Abstract: In described examples, an apparatus includes: a physics cell including: a laser source configured to emit light towards an atomic chamber containing an atomic gas; a photodetector configured to receive emissions from the atomic chamber; and a coil for generating a magnetic field in the atomic chamber; and an electronics circuit, including: a controller circuit coupled to the photodetector output and having control outputs to a digital to analog converter circuit; the digital to analog converter circuit having a coil current output to adjust the magnetic field, a modulation control output to control a modulation of the light, and having an output to control a voltage controlled oscillator; and a radio-frequency output circuit having a voltage controlled oscillator coupled to the output of the digital to analog converter circuit and outputting a radio frequency signal to the laser source in the physics cell.

公开(公告)号：US09646906B2

公开(公告)日：2017-05-09

申请号：US14849026

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Django Trombley ,  Steven Alfred Kummerl ,  Paul Emerson

IPC: H01L21/288 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H05K1/09 ,  H05K1/16 ,  H01L23/495

CPC classification number: H01L23/3121 ,  H01L21/288 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/5227 ,  H01L24/09 ,  H01L2224/08268 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/13055 ,  H01L2924/146 ,  H05K1/092 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0179 ,  H05K2201/0999 ,  H05K2201/10151

Abstract: A method forming packaged semiconductor devices includes providing a completed semiconductor package having a die with bond pads coupled to package pins. Sensor precursors including an ink and a liquid carrier are additively printed directly on the die or package to provide precursors for electrodes and a sensing material between the sensor electrodes. Sintering or curing removes the liquid carrier such that an ink residue remains to provide the sensor electrodes and sensing material. The sensor electrodes electrically coupled to the pins or bond pads or the die includes a wireless coupling structure coupled to the bond pads and the method includes additively printing an ink then sintering or curing to form a complementary wireless coupling structure on the completed semiconductor package coupled to the sensor electrodes so that sensing signals sensed by the sensor are wirelessly transmitted to the bond pads after being received by the wireless coupling structure.

公开(公告)号：US09601820B2

公开(公告)日：2017-03-21

申请号：US14579842

申请日：2014-12-22

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Benjamin S. Cook

IPC: H01P3/16 ,  H01P1/20 ,  H01P11/00 ,  H01P3/12 ,  H01P1/211

CPC classification number: H01P3/16 ,  H01P1/2002 ,  H01P1/211 ,  H01P3/122 ,  H01P11/006

Abstract: A dielectric waveguide interconnect system has a dielectric waveguide (DWG) a core surrounded by a cladding along the length of the DWG. One or more periodic structures are embedded along the length of the DWG such that the core of the DWG is integral to each of the one or more periodic structures.

公开(公告)号：US09590699B1

公开(公告)日：2017-03-07

申请号：US14970315

申请日：2015-12-15

Applicant: Texas Instruments Incorporated ,  Texas Instruments Deutschland GMBH

Inventor： Swaminathan Sankaran ,  Bradley Allen Kramer ,  Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Lutz Naumann ,  Mark W. Morgan ,  Baher Haroun

IPC: H04B5/00 ,  H04W4/00

CPC classification number: H04B5/0031 ,  H04B5/0075 ,  H04W4/80

Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module.

Abstract translation: 提供了一种系统，其中一组模块各自具有衬底，其上安装有射频（RF）发射器和/或耦合到位于衬底上的近场通信（NFC）耦合器）的RF接收器。 每个模块具有围绕并包围衬底的壳体。 壳体在壳体的表面上具有端口区域。 每个模块具有位于NFC耦合器和壳体上的端口区域之间的场约束器，其被配置成将通过端口区域从NFC耦合器发出的电磁能引导到相邻模块的端口区域。

公开(公告)号：US20170053854A1

公开(公告)日：2017-02-23

申请号：US15346822

申请日：2016-11-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Yong Lin ,  Rongwei Zhang ,  Abram Castro ,  Matthew David Romig

IPC: H01L23/495 ,  H01L25/00 ,  H01L21/48 ,  H01L25/065

CPC classification number: H01L23/4952 ,  H01L21/2885 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4867 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49572 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/0612 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1511 ,  H01L2924/1711 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/0665

Abstract: A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.

Abstract translation: 引线框架表面改性的方法包括提供至少一个预制金属引线框架或封装基板（基板）单元，其包括具有管芯焊盘和围绕管芯焊盘的多个接触区域的母材。 包括在固化步骤上形成固体的固体的材料或去除液体载体的烧结步骤的材料的油墨被加成沉积，其包括至少一个（i）芯片垫的区域 和（ii）在至少第一接触区域（第一接触区域）的一个区域。 油墨被烧结或固化以除去液体载体，使得残留基本上固体的油墨残余物。

公开(公告)号：US09529334B2

公开(公告)日：2016-12-27

申请号：US14674197

申请日：2015-03-31

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Benjamin S. Cook ,  Phillip Nadeau ,  Simon Joshua Jacobs ,  Django Earl Trombley

IPC: H03L7/26 ,  G04F5/14 ,  G01N29/44 ,  G01N29/36

CPC classification number: G04F5/145 ,  G01N29/36 ,  G01N29/44 ,  G04F5/14 ,  H03L7/26

Abstract: Described examples include a millimeter wave atomic clock apparatus, chip scale vapor cell, and fabrication method in which a low pressure dipolar molecule gas is provided in a sealed cavity with a conductive interior surface forming a waveguide. Non-conductive apertures provide electromagnetic entrance to, and exit from, the cavity. Conductive coupling structures formed on an outer surface of the vapor cell near the respective non-conductive apertures couple an electromagnetic field to the interior of the cavity for interrogating the vapor cell using a transceiver circuit at a frequency that maximizes the rotational transition absorption of the dipolar molecule gas in the cavity to provide a reference clock signal for atomic clock or other applications.

Abstract translation: 所描述的实例包括毫米波原子钟装置，芯片尺度蒸汽池及其制造方法，其中低密度偶极子分子气体被设置在具有形成波导的导电内表面的密封腔中。 非导电孔径为腔提供电磁入口并从腔排出。 形成在相应不导电孔隙附近的蒸气室的外表面上的导电耦合结构将电磁场耦合到空腔的内部，以便使用收发器电路以使得偶极子的旋转跃迁吸收最大化的频率 在腔中分配气体，为原子钟或其他应用提供参考时钟信号。

公开(公告)号：US09496171B2

公开(公告)日：2016-11-15

申请号：US14848941

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Matthew David Romig ,  Steven Alfred Kummerl ,  Wei-Yan Shih

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L24/27 ,  H01L21/4867 ,  H01L21/76838 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L2223/6627 ,  H01L2224/24998 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29026 ,  H01L2224/29076 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.

Abstract translation: 一种形成封装半导体器件的方法包括提供一种第一半导体管芯（第一管芯），其上具有接合焊盘，其面朝上安装在封装衬底上或引线框架（衬底）的管芯焊盘上，其中衬底包括端子或接触焊盘 （基板焊盘）。 形成第一电介质层，包括印刷第一电介质前体层，该第一电介质前体层包括具有从衬底焊盘延伸到接合焊盘的第一液体载体溶剂的第一油墨。 印刷第一互连前体层，其包括在从衬底焊盘延伸到接合焊盘的第一介电层上方具有第二液体载体的第二油墨。 烧结或固化第一互连前体层至少去除第二液体载体以形成包括将各个衬底焊盘连接到各个焊盘的墨残余物的导电互连。

公开(公告)号：US20160064313A1

公开(公告)日：2016-03-03

申请号：US14938422

申请日：2015-11-11

Applicant: Texas Instruments Incorporated

Inventor： Marie Denison ,  Brian Ashley Carpenter ,  Osvaldo Jorge Lopez ,  Juan Alejandro Herbsommer ,  Jonathan Noquil

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L21/50 ,  H01L21/561 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/38 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/84 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40145 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/014 ,  H01L2924/20752

Abstract: A electronic multi-output device having a substrate including a pad and pins. A composite first chip has a first and a second transistor integrated so that the first terminals of the transistors are merged into a common terminal on one chip surface. Patterned second and third terminals are on the opposite chip surface. The common first terminal is attached to the substrate pad. The second terminals are connected by discrete first and second metal clips to respective substrate pins. A composite second chip has a third and a fourth transistor integrated so that the second terminals of the transistors are merged into a common terminal on one chip surface. Patterned first and third terminals are on the opposite chip surface. The second chip is flipped to be vertically attached with its first terminals to the first and second clips, respectively. The third terminals are connected by discrete clips to respective substrate pins. The common second terminal is connected by a common clip to a substrate pin.

Abstract translation: 一种电子多输出装置，具有包括垫和销的基板。 复合第一芯片具有集成的第一和第二晶体管，使得晶体管的第一端子在一个芯片表面上合并成公共端子。 图案化的第二和第三端子位于相对的芯片表面上。 公共第一端子附接到衬底垫。 第二端子通过分立的第一和第二金属夹连接到相应的衬底引脚。 复合第二芯片具有集成的第三和第四晶体管，使得晶体管的第二端子在一个芯片表面上合并成公共端子。 图案化的第一和第三端子在相对的芯片表面上。 第二芯片被翻转以分别与其第一端子垂直地附接到第一和第二夹子。 第三端子通过离散夹子连接到相应的衬底引脚。 公共第二端子通过公共夹子连接到衬底引脚。

公开(公告)号：US20160006101A1

公开(公告)日：2016-01-07

申请号：US14754401

申请日：2015-06-29

Applicant: Texas Instruments Incorporated

Inventor： Robert Floyd Payne ,  Juan Alejandro Herbsommer ,  Gerd Schuppener

IPC: H01P3/16 ,  G02B6/44

CPC classification number: H01P3/16 ,  G02B6/4416 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01P3/121 ,  H01P3/165 ,  H01P5/00 ,  H01P5/087 ,  H01P5/107 ,  H01P5/184 ,  H01P11/001 ,  H01P11/002 ,  H01Q1/50 ,  H01Q19/108 ,  H01Q19/30 ,  H04B1/40 ,  Y10T29/49016 ,  Y10T29/49826

Abstract: A communication cable includes one or more conductive elements surrounded by a dielectric sheath. The sheath member has a first dielectric constant value. A dielectric core member is placed longitudinally adjacent to and in contact with an outer surface of the sheath member. The core member has a second dielectric constant value that is higher than the first dielectric constant value. A cladding surrounds the sheath member and the dielectric core member. The cladding has a third dielectric constant value that is lower than the second dielectric constant value. A dielectric wave guide is formed by the dielectric core member surrounded by the sheath and the cladding.

Abstract translation: 通信电缆包括由电介质护套包围的一个或多个导电元件。 护套构件具有第一介电常数值。 电介质芯构件被纵向地邻近鞘构件的外表面并与其接触。 芯构件具有比第一介电常数值高的第二介电常数值。 包层围绕护套构件和电介质芯构件。 包层具有低于第二介电常数值的第三介电常数值。 电介质波导由被护套和包层包围的介质芯构件形成。