公开(公告)号：US5520320A

公开(公告)日：1996-05-28

申请号：US231068

申请日：1994-04-22

Applicant: Kevin McKean ,  Frederic Rotman ,  Robert W. Connors

Inventor： Kevin McKean ,  Frederic Rotman ,  Robert W. Connors

IPC: B23K1/08 ,  H05K3/34 ,  B23K35/38

CPC classification number: H05K3/3468 ,  B23K1/085 ,  B23K2201/36 ,  H05K2203/086 ,  H05K2203/111

Abstract: The present invention relates to a wave soldering process wherein an inert gas atmosphere is injected inside the wave soldering machine, the inert gas atmosphere having a temperature which might be controlled. Particularly, the atmosphere can be heated at the same or different temperatures before injection, for example in the preheating zones, in the machine. The atmosphere can also be cooled (or injected at ambient temperature) e.g. in the cooling zone. Various atmospheres can be used (similar or different from one zone to another). Also, maintaining the atmosphere under forced laminer flow conditions improves the quality of the solder joints. The thermal efficiency of the heat transfer between the atmosphere and the printed circuit boards is thus greatly enhanced, which means less solder defects, higher components density and decrease of energy consumption and inert gas flow rate.

Abstract translation: 本发明涉及一种波峰焊工艺，其中在波峰焊机内部注入惰性气体气氛，该惰性气体气氛具有可被控制的温度。 特别地，可以在注射之前，例如在机器中的预热区域中，以相同或不同的温度加热气氛。 气氛也可以冷却（或在环境温度下进行注射）。 在冷却区。 可以使用各种气氛（与一个区域相似或不同）。 此外，在强制层流机流动条件下保持气氛提高了焊点的质量。 因此大气和印刷电路板之间传热的热效率大大提高，这意味着更少的焊料缺陷，更高的组件密度以及能量消耗和惰性气体流量的降低。

公开(公告)号：US5499754A

公开(公告)日：1996-03-19

申请号：US339770

申请日：1994-11-15

Applicant: Stephen M. Bobbio ,  Nicholas G. Koopman ,  Sundeep Nangalia

Inventor： Stephen M. Bobbio ,  Nicholas G. Koopman ,  Sundeep Nangalia

IPC: B23K1/20 ,  B23K35/38 ,  H05K3/34 ,  C23F1/02 ,  B23K3/08

CPC classification number: B23K35/38 ,  B23K1/20 ,  B23K2201/36 ,  H05K3/3489

Abstract: A fluxless soldering sample pretreating system includes a sample chamber having an opening therein and a sample holder. A sample chamber extension extends outwardly from the opening to define a passageway from the sample chamber extension, through the opening, and into the sample chamber. A fluorine-containing gas is supplied into the sample chamber extension. Am energy source such as a microwave oven surrounds the sample chamber extension. The microwave oven produces microwave energy in the sample chamber extension to form a plasma therein and dissociate the fluorine-containing gas into atomic fluorine. A perforated aluminum plate extends transversely across the passageway and blocks the plasma from traversing the passageway from the sample chamber extension into the sample chamber, while allowing the atomic fluorine to traverse the passageway from the sample chamber extension into the sample holder. A second chamber extension, gas supply and microwave oven may be added to improve uniformity for large samples.

Abstract translation: 无助焊剂样品预处理系统包括其中具有开口的样品室和样品保持器。 样品室延伸部从开口向外延伸以限定从样品室延伸部穿过开口并进入样品室的通道。 向样品室延伸部供给含氟气体。 诸如微波炉的能量源围绕样品室延伸。 微波炉在样品室延伸部中产生微波能量，在其中形成等离子体，并将含氟气体解离为原子氟。 穿孔铝板横向延伸穿过通道，并阻止等离子体横穿从样品室延伸部进入样品室的通道，同时允许原子氟穿过从样品室延伸部分进入样品架的通道。 可以添加第二室延伸，气体供应和微波炉以改善大样品的均匀性。

公开(公告)号：US5407121A

公开(公告)日：1995-04-18

申请号：US155020

申请日：1993-11-19

Applicant: Nicholas G. Koopman ,  Sundeep Nangalia

Inventor： Nicholas G. Koopman ,  Sundeep Nangalia

IPC: B23K1/20 ,  B23K35/38 ,  H05K3/34

CPC classification number: B23K35/38 ,  B23K1/20 ,  B23K2201/36 ,  H05K3/3489

Abstract: A method of soldering a copper layer without the use of fluxing agents by exposing the copper layer to a fluorine-containing plasma. Solder is then placed onto the surface of the copper layer and reflowed. Reflow can take place at low temperatures, atmospheric pressure and in an inert or oxidizing atmosphere using standard solder reflow equipment.

Abstract translation: 一种通过将铜层暴露于含氟等离子体而不使用助熔剂来焊接铜层的方法。 然后将焊料放置在铜层的表面上并回流。 回流可以使用标准的回流焊设备在低温，大气压和惰性或氧化性气氛中进行。

公开(公告)号：US5311405A

公开(公告)日：1994-05-10

申请号：US100834

申请日：1993-08-02

Applicant: David A. Tribbey ,  Henry F. Liebman ,  Allen D. Hertz ,  Peter E. Albertson

Inventor： David A. Tribbey ,  Henry F. Liebman ,  Allen D. Hertz ,  Peter E. Albertson

IPC: B23K1/00 ,  H05K1/11 ,  H05K3/34 ,  H05K13/04 ,  H05K7/10

CPC classification number: H05K1/111 ,  B23K1/0016 ,  H05K13/0465 ,  H05K3/3442 ,  B23K2201/36 ,  H05K2201/0939 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2203/048 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702) portions for attaching to a corresponding pad on a substrate (102) by a reflow solder process (1200). A pad arrangement (100) is formed including two opposite pads (108), each pad (108) occupying a tri-oval-shaped area. The tri-oval-shaped area includes an elliptical area (110) substantially centered under the bottom portion (704) of the corresponding termination of the component (402) when the component (402) is aligned with the pad arrangement (100), and an arcuate area (112) contiguous with the elliptical area (110) and extending towards the opposite pad (108) in a central lengthwise direction. A solder paste (202) is applied to the elliptical area (110), and thereafter reflowed, whereby solder (302) in the solder paste (202) liquefies and flows onto the arcuate area (112), thereby facilitating alignment of the component (402) with the pad arrangement (100).

Abstract translation: 一种方法和装置将包括在组件（402）的每个端部处的端接件的无引线表面安装部件（402）对准和附接。 终端具有底部（704）和端部（702）部分，用于通过回流焊接工艺（1200）附接到衬底（102）上的对应衬垫。 形成包括两个相对的焊盘（108）的焊盘装置（100），每个焊盘（108）占据三椭圆形的区域。 当所述部件（402）与所述垫装置（100）对准时，所述三椭圆形区域包括基本上位于所述部件（402）的相应终端的底部（704）下方的中心的椭圆形区域（110），以及 与椭圆形区域（110）相邻并在中心纵向方向上朝向相对的垫（108）延伸的弧形区域（112）。 将焊膏（202）施加到椭圆形区域（110）上，然后回流焊接，由此焊膏（202）中的焊料（302）液化并流到弧形区域（112），从而有助于部件 402）。

公开(公告)号：US5295619A

公开(公告)日：1994-03-22

申请号：US63667

申请日：1993-05-20

Applicant: Hiroyuki Takahashi ,  Shinichi Fujino ,  Kazuhiro Sakamoto ,  Tomoyasu Hirano

Inventor： Hiroyuki Takahashi ,  Shinichi Fujino ,  Kazuhiro Sakamoto ,  Tomoyasu Hirano

IPC: B23K1/00 ,  H01L23/49 ,  H01R43/02 ,  H05K13/06 ,  H01L21/603

CPC classification number: B23K1/0008 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01R43/02 ,  H05K13/06 ,  B23K2201/32 ,  B23K2201/36 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85075 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L24/45 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041

Abstract: A method for bonding a solder wire is provided wherein a lower ball end of a material solder wire is first bonded to a first bonding portion of a workpiece. Then, the material solder wire is thermally cut to provide a solder wire segment held bonded to the first bonding portion and having an upper ball end. Finally, the upper ball end is bonded to a second bonding portion of the workpiece. All of the wire bonding process steps are performed in an oxygen-free atmosphere to prevent oxidation of the solder wire.

Abstract translation: 提供一种用于焊接焊接的方法，其中首先将材料焊丝的下球端接合到工件的第一接合部分。 然后，材料焊丝被热切割以提供保持接合到第一接合部分并具有上球端的焊丝段。 最后，将上球端接合到工件的第二接合部分。 所有的引线接合工艺步骤在无氧气氛中进行以防止焊丝的氧化。

公开(公告)号：US5289966A

公开(公告)日：1994-03-01

申请号：US942167

申请日：1992-09-08

Applicant: Yasuo Izumi ,  Syoji Sato ,  Hiroshi Yamauchi ,  Ryoji Inutsuka

Inventor： Yasuo Izumi ,  Syoji Sato ,  Hiroshi Yamauchi ,  Ryoji Inutsuka

IPC: B23K1/005 ,  B23K1/20 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K1/0056 ,  B23K1/203 ,  H05K3/3415 ,  H05K3/3494 ,  B23K2201/36 ,  H05K2201/10689 ,  H05K2203/043 ,  H05K2203/0475 ,  H05K2203/107 ,  H05K2203/111 ,  H05K2203/1476 ,  Y02P70/613

Abstract: A method is provided for electrically connecting a first electronic component which is not resistant to a reflowing temperature and a second electronic component which is resistant to the reflowing temperature to a substrate. The method includes the steps of applying cream solder to a first predetermined portion of the substrate so that the first electronic component is connected therewith and to a second predetermined portion of the substrate so that the second electronic component is connected therewith, mounting the second electronic component on the substrate, heating the second electronic component mounted on the substrate by reflowing so as to solder the second electronic component onto the substrate, forming a pre-soldered portion made of cream solder on the first predetermined portion of the substrate, applying flux to one of the first electronic component and the pre-soldered portion, mounting the first electronic component on the first predetermined portion of the substrate, melting the cream solder of the pre-soldered portion by heating the substrate locally, and soldering the first electronic component onto the substrate. Another method for electrically connecting an unwashable electronic component and a washable electronic component to a substrate includes similar steps to those of the method above.

Abstract translation: 提供了一种将不具有回流温度的第一电子部件和耐回流温度的第二电子部件电连接到基板的方法。 该方法包括以下步骤：将膏状焊料施加到基板的第一预定部分，使得第一电子元件与其连接并连接到基板的第二预定部分，使得第二电子元件与其连接，将第二电子元件 在基板上，通过回流加热安装在基板上的第二电子部件，以将第二电子部件焊接到基板上，在基板的第一预定部分上形成由膏状焊料制成的预焊部分，将焊剂施加到一个 将第一电子部件安装在基板的第一预定部分上，通过局部加热基板来熔化预焊部分的焊膏，并将第一电子部件焊接到第一电子部件上 基质。 将不可洗涤的电子部件和可洗涤电子部件电连接到基板的另一种方法包括与上述方法相似的步骤。

公开(公告)号：US5234865A

公开(公告)日：1993-08-10

申请号：US842236

申请日：1992-02-26

Applicant: Herbert Goebel ,  Franz Riedinger ,  Vesna Biallas

Inventor： Herbert Goebel ,  Franz Riedinger ,  Vesna Biallas

IPC: B23K1/00 ,  B23K1/14 ,  B23K1/20 ,  B23K101/40 ,  H01L21/60 ,  H01R4/02 ,  H01R43/02

CPC classification number: H01L24/83 ,  B23K1/20 ,  H01L24/01 ,  H01L24/29 ,  H01L24/33 ,  B23K2201/36 ,  H01L2224/29101 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253

Abstract: The invention relates to a method for soldering together a first, in particular electrical, component with a second, in particular electrical, component, where a solder preform is disposed between the components and is fixed by pressing it against edges of at least one depression in one of the components to prevent lateral dislocation and where subsequently the soldering process takes place, preferably in a soldering furnace. A special feature is that the depression is formed as grooves (10) extending in a closed loop (11), in particular in the shape of a circle.

Abstract translation: 本发明涉及一种用于将第一，特别是电气部件与第二特别是电气部件焊接在一起的方法，其中焊料预成型件设置在部件之间，并且通过将其压在至少一个凹部的边缘上来固定 防止横向位错的部件之一，并且随后进行焊接工艺，优选在焊接炉中。 特别的特征是凹陷形成为在闭环（11）中延伸的凹槽（10），特别是圆形。

公开(公告)号：US4855102A

公开(公告)日：1989-08-08

申请号：US171461

申请日：1988-03-21

Applicant: Ryoji Okada ,  Mitsuaki Haneda ,  Takeshi Araya ,  Susumu Hioki

Inventor： Ryoji Okada ,  Mitsuaki Haneda ,  Takeshi Araya ,  Susumu Hioki

IPC: C04B35/64 ,  B22F3/10 ,  B22F3/105 ,  B22F7/02 ,  B22F7/04 ,  B22F7/06 ,  B23K26/18 ,  B23K26/20 ,  B23K35/22 ,  H01L21/60 ,  H01L21/768

CPC classification number: H01L24/86 ,  B22F3/10 ,  B22F3/1055 ,  B22F7/02 ,  B22F7/06 ,  B23K26/009 ,  B23K26/18 ,  B23K26/24 ,  B23K26/342 ,  B23K35/226 ,  H01L24/11 ,  H01L24/13 ,  H01L24/80 ,  B22F2003/1052 ,  B23K2201/36 ,  H01L2224/11505 ,  H01L2224/13082 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  Y02P10/295

Abstract: A sintering method and fusion welding method of the present invention are characterized in that energy is radiated to the black component of starting materials so as to convert it from the state of an energy absorber to the state of an energy reflector (the state where metallic luster is exhibited). The methods can be utilized effectively for forming the electrode of a sensor or the bump of an electronic component. When applied to the production of the sensor and the electrode, the methods can produce these products by a simple production process and with extremely high producibility.

公开(公告)号：US3917148A

公开(公告)日：1975-11-04

申请号：US40804473

申请日：1973-10-19

Applicant: TECHNICAL DEVICES INC

Inventor： RUNYON ROBERT C

IPC: B23K20/00 ,  H01L21/00 ,  B23K3/02

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K2201/36 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78302 ,  H01L2224/78303 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/00015

Abstract: A weld tip for use is capillary bonding welding for electronic components includes a structural body member having a conically tapered end which forms the welding tip. A bore is provided in axial alignment with the center axis of the body member, the portion of the bore in the region of the tip forming the welding end being frusto-conical in shape, i.e., tapered with respect to the central axis, while the other end of the bonding tip includes a generally cylindrical bore. Positioned between the cylindrical bore and the tapered bore at the tip end is a second tapered bore, the latter being tapered to a greater degree than the bore at the tip end of the tool. The tip is formed by a chemical vapor deposition procedure utilizing an improved mandrel of a predetermined configuration such that preselected openings may be provided in the free end of the welding tip by cutting at preselected points along the axis of the mandrel. Thus, one mandrel may be used to provide welding tips having apertures in the working end thereof of different diameters. Typical materials which may be used as the structural material are tungsten, rhenium, molybdenum, and alloys thereof, tantalum carbide and columbium carbide, the preferred material being an alloy of tungsten and carbon wherein the carbon is present in an amount of between 0.40% and 0.50% by weight.

Abstract translation: 使用的焊接头是电子部件的毛细管接合焊接，包括具有形成焊接尖端的锥形端部的结构体部件。 孔被提供为与主体构件的中心轴线轴向对准，在形成焊接端的尖端区域中的孔的部分是截头圆锥形的，即相对于中心轴线呈锥形，而 接合末端的另一端包括大致圆柱形的孔。 位于圆柱形孔和尖端处的锥形孔之间的是第二锥形孔，后者与第一锥形孔相比锥度大于工具尖端处的孔。 尖端通过使用预定构造的改进的心轴的化学气相沉积程序形成，使得可以在沿着心轴的轴线的预选点处切割焊接尖端的自由端中的预选开口。 因此，可以使用一个心轴来提供在其工作端具有不同直径的孔的焊接尖端。 可用作结构材料的典型材料是钨，铼，钼及其合金，碳化钽和碳化铌，优选的材料是钨和碳的合金，其中碳的存在量为0.40％至 0.50重量％。

公开(公告)号：US3602684A

公开(公告)日：1971-08-31

申请号：US3602684D

申请日：1969-10-27

Applicant: HUGHES AIRCRAFT CO

Inventor： FRIESS RICHARD G

IPC: B23K20/26 ,  B23K20/00 ,  G05D23/24 ,  B23K11/24

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K2201/36 ,  G05D23/1913 ,  G05D23/24 ,  H01L24/48 ,  H01L2224/48 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/13034 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A pulsed thermocompression bonder is provided comprising a bonding or capillary tip and an electronics system to regulate the bonding or capillary tip temperature. A switch automatically provides a start bond signal when the operator lowers the bonder tip to bonding position to commence a bonding operation. The start bond signal activates an AC control circuit which causes current flow in a heating transformer until the tip is at predetermined bonding or operating temperature. The AC control circuit then stops current flow from being supplied to the heating transformer for a predetermined cooling time. In subsequent sequential periods iteratively the current is allowed to flow to the heating transformer until a predetermined temperature is reached and is cut off for the predetermined period of cooling. Adjustment means are provided to regulate offand-on current time so that once the predetermined desired temperature is reached an approximately constant desired temperature or flat heat curve is obtained until the end of the bonding operation. A sensing circuit connected to the bonder tip senses a rise in voltage due to an increase in tip resistance when the tip is being heated to the predetermined bonding temperature. After rising to desired predetermined temperature the sensing circuit (1) triggers a timing one shot multivibrator which sets and resets an on-off flip-flop circuit to regulate the heating cycle duration for a given bonding operation and (2) triggers an on-off one-shot multivibrator each time the predetermined temperature is reached in the heating cycle. The voltage outputs of the on-off flip-flop and one-shot multivibrator circuits are mixed and applied to the AC control circuit. The on-off one-shot multivibrator stops current flow to the heating transformer for the predetermined period upon each sensing of reaching the predetermined operating temperature during the bonding cycle. The on-off flip-flop as determined by the timing one shot multivibrator changes state and terminates the bonding cycle.