公开(公告)号：US20180295720A1

公开(公告)日：2018-10-11

申请号：US15762791

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Adel A. Elsherbini ,  Javier Soto Gonzalez ,  Dilan Seneviratne ,  Shruti R. Jaywant ,  Sashi S. Kandanur ,  Srinivas Pietambaram ,  Nadine L. Dabby ,  Braxton Lathrop ,  Rajat Goyal ,  Vivek Raghunathan

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/00 ,  H05K3/34 ,  H05K3/28 ,  H05K3/42

CPC classification number: H05K1/0283 ,  H01L23/145 ,  H01L23/5387 ,  H05K1/038 ,  H05K1/111 ,  H05K1/189 ,  H05K3/0023 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/0055 ,  H05K3/18 ,  H05K3/205 ,  H05K3/284 ,  H05K3/341 ,  H05K3/429 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0133 ,  H05K2201/0329 ,  H05K2201/09263 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.

公开(公告)号：US20180255635A1

公开(公告)日：2018-09-06

申请号：US15762811

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Adel A. Elsherbini ,  Braxton Lathrop ,  Sasha N. Oster ,  Aleksandar Aleksov

IPC: H05K1/02 ,  H05K1/11 ,  G06F1/16

CPC classification number: H05K1/0283 ,  G06F1/163 ,  G06F1/1656 ,  H05K1/118 ,  H05K2201/0133

Abstract: Some forms relate to a stretchable computing device. The stretchable computing device includes a first layer that includes electrical interconnects at a first density wherein the first layer includes a first electronic component; a stretchable second layer electrically connected to the first layer, wherein the stretchable second layer includes electrical interconnects at a second density that is less than the first density, wherein the second layer includes a second electronic component; and a stretchable third layer electrically connected to the stretchable second layer, wherein the stretchable third layer includes electrical interconnects at a third density that is less than the second density.

公开(公告)号：US20180020982A1

公开(公告)日：2018-01-25

申请号：US15215529

申请日：2016-07-20

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Aleksandar Aleksov ,  Sasha N. Oster ,  Amit Sudhir Baxi ,  Feras Eid ,  Johanna M. Swan ,  Vincent S. Mageshkumar

IPC: A61B5/00 ,  A61B5/0205 ,  A61B5/1455 ,  A61B5/0408

CPC classification number: A61B5/6833 ,  A61B5/0205 ,  A61B5/024 ,  A61B5/04087 ,  A61B5/08 ,  A61B5/14551 ,  A61B5/7271 ,  A61B5/7405 ,  A61B5/742 ,  A61B5/7455 ,  A61B5/746 ,  A61B2560/0204 ,  A61B2560/0412 ,  A61B2560/0443

Abstract: Discussed generally herein are methods and devices including or providing a wellness monitoring system. The wellness monitoring system can include a first patch including a flexible, stretchable first substrate, a first adhesive on the first substrate, the first adhesive configured to attach the first patch to skin of a user, and first electronics on or at least partially in the first substrate, the first electronics to monitor a first biological parameter of the user, and a second patch including a flexible, stretchable second substrate, a second adhesive on the second substrate, the second adhesive configured to attach the second patch to skin of the user, and second electronics on or at least partially in the second substrate, the second electronics to monitor a second biological parameter of the user, the second biological parameter different from the first biological parameter.

公开(公告)号：US09865941B1

公开(公告)日：2018-01-09

申请号：US15281814

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Sasha Oster ,  Adel A. Elsherbini ,  Feras Eid ,  Aleksandar Aleksov ,  Amit Sudhir Baxi ,  Johanna M. Swan ,  Vincent S. Mageshkumar

IPC: A61B17/00 ,  H01R4/58 ,  H01R43/26 ,  H01R13/03 ,  A44B17/00 ,  A44B19/24

CPC classification number: H01R4/58 ,  A44B17/0041 ,  A44B19/24 ,  H01R13/03 ,  H01R43/26

Abstract: A system can include a first portion of a fabric fastener, a second portion of the fabric fastener, wherein the first portion and the second portion are configured to mechanically connect with each other and to resist separation from each other once connected, and wherein the first and second portions include a plurality of corresponding electrical contacts configured to form a plurality of individual electrical connections when the first portion is mechanically connected with the second portion.

公开(公告)号：US09735893B1

公开(公告)日：2017-08-15

申请号：US15216502

申请日：2016-07-21

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Sasha N. Oster ,  Feras Eid ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Kumar Ranganathan ,  Wen-Ling M. Huang

IPC: A61B5/11 ,  A61B5/01 ,  A61B5/00 ,  A61B5/0402 ,  A61B5/021 ,  A61N1/04 ,  A61M5/142 ,  A61B5/145 ,  H04B5/00 ,  H04B13/00 ,  A61N7/00

CPC classification number: H04B13/005 ,  A61B5/0024 ,  A61B5/01 ,  A61B5/0205 ,  A61B5/021 ,  A61B5/0402 ,  A61B5/0432 ,  A61B5/1102 ,  A61B5/1107 ,  A61B5/1121 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/4839 ,  A61B5/4869 ,  A61B5/6833 ,  A61F7/007 ,  A61M5/14248 ,  A61N1/0484 ,  A61N1/0492 ,  A61N1/3603 ,  A61N7/00 ,  H04B5/0012

Abstract: Discussed generally herein are methods and devices including or providing a patch system that can help in diagnosing a medical condition and/or provide therapy to a user. A body-area network can include a plurality of communicatively coupled patches that communicate with an intermediate device. The intermediate device can provide data representative of a biological parameter monitored by the patches to proper personnel, such as for diagnosis and/or response.

公开(公告)号：US20170200677A1

公开(公告)日：2017-07-13

申请号：US15469964

申请日：2017-03-27

Applicant: INTEL CORPORATION

Inventor： Qing Ma ,  Johanna M. Swan ,  Robert Starkston ,  John S. Guzek ,  Robert L. Sankman ,  Aleksandar Aleksov

IPC: H01L23/538 ,  H01L25/065 ,  H01L21/683 ,  H01L21/48 ,  H01L23/498 ,  H01L23/15 ,  H01L23/00

CPC classification number: H01L23/5386 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/08238 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4688 ,  H05K2201/017 ,  H05K2203/1469 ,  Y10T156/1057 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

公开(公告)号：US20170163178A1

公开(公告)日：2017-06-08

申请号：US14961116

申请日：2015-12-07

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Feras Eid ,  Adel A. Elsherbini ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Sasha Oster

IPC: H02N2/18 ,  F03G5/08

CPC classification number: F03G5/08 ,  H01L41/113 ,  H02N2/18

Abstract: A device for harvesting energy from fabric or clothing includes a piece of fabric or clothing. One or more piezoelectric harvesters are coupled with the piece of fabric or clothing. The piezoelectric harvesters are capable of producing electric energy in response to the movement of the piece of fabric or clothing. Additionally, the device includes one or more energy storage mediums coupled to the one or more piezoelectric harvesters. The energy storage mediums are capable of storing the energy produced by the one or more piezoelectric harvesters. Further, the method for harvesting energy from fabric or clothing involves moving a piece of fabric such that one or more piezoelectric harvesters generate electricity. The method for harvesting energy from fabric or clothing also involves storing the generated electricity in one or more energy storage mediums.

公开(公告)号：US20170142839A1

公开(公告)日：2017-05-18

申请号：US14943234

申请日：2015-11-17

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Srinivas Pietambaram ,  Rahul N. Manepalli

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/184 ,  H01L2224/04105 ,  H01L2924/18162 ,  H05K1/0283 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/185 ,  H05K3/007 ,  H05K3/4697 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2203/0191 ,  H05K2203/1469

Abstract: An embedded electronic package includes a stretchable body that includes at least one electronic component, wherein each electronic component includes a back side that is exposed from the stretchable body; and a plurality of meandering conductors that are electrically connected to one or more of the electronic components. In some forms, the embedded electronic package includes a stretchable body that includes an upper surface and a lower surface, wherein the stretchable body includes at least one electronic component, wherein each electronic component is fully embedded in the stretchable body and the same distance from the upper surface of the stretchable body; and a plurality of meandering conductors that are electrically connected to one or more of the electronic components.

公开(公告)号：US20150262968A1

公开(公告)日：2015-09-17

申请号：US14727205

申请日：2015-06-01

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Ravindranath V Mahajan ,  Omkar Karhade ,  Nitin Deshpande

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/677

CPC classification number: H01L24/83 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67709 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/15 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L24/92 ,  H01L24/96 ,  H01L2221/68309 ,  H01L2221/68313 ,  H01L2221/68331 ,  H01L2221/68363 ,  H01L2224/04105 ,  H01L2224/2101 ,  H01L2224/2919 ,  H01L2224/32237 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/8312 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The subject matter of the present description relates to methods for the precise integration of microelectronic dice within a multichip package which substantially reduce or eliminate any misalign caused by the movement of the microelectronic dice during the integration process. These methods may include the use of a temporary adhesive in conjunction with a carrier having at least one recess for microelectronic die alignment, the use of a precision molded carrier for microelectronic die alignment, the use of magnetic alignment of microelectronic dice on a reusable carrier, and/or the use of a temporary adhesive with molding processes on a reusable carrier.

Abstract translation: 本说明书的主题涉及用于在多芯片封装内精确地集成微电子管芯的方法，其基本上减少或消除了在整合过程期间由微电子管芯的移动引起的任何不对准。 这些方法可以包括使用临时粘合剂与具有用于微电子管芯对准的至少一个凹部的载体的使用，使用用于微电子管芯对准的精密模制载体，在可重复使用的载体上使用微电子骰子的磁对准， 和/或在可重复使用的载体上使用具有模制工艺的临时粘合剂。

公开(公告)号：US09076882B2

公开(公告)日：2015-07-07

申请号：US13908016

申请日：2013-06-03

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Ravindranath V Mahajan ,  Omkar Karhade ,  Nitin Deshpande

IPC: H01L21/00 ,  H01L23/00

CPC classification number: H01L24/83 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67709 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/15 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L24/92 ,  H01L24/96 ,  H01L2221/68309 ,  H01L2221/68313 ,  H01L2221/68331 ,  H01L2221/68363 ,  H01L2224/04105 ,  H01L2224/2101 ,  H01L2224/2919 ,  H01L2224/32237 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/8312 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The subject matter of the present description relates to methods for the precise integration of microelectronic dice within a multichip package which substantially reduce or eliminate any misalign caused by the movement of the microelectronic dice during the integration process. These methods may include the use of a temporary adhesive in conjunction with a carrier having at least one recess for microelectronic die alignment, the use of a precision molded carrier for microelectronic die alignment, the use of magnetic alignment of microelectronic dice on a reusable carrier, and/or the use of a temporary adhesive with molding processes on a reusable carrier.

Abstract translation: 本说明书的主题涉及用于在多芯片封装内精确地集成微电子管芯的方法，其基本上减少或消除了在整合过程期间由微电子管芯的移动引起的任何不对准。 这些方法可以包括使用临时粘合剂与具有用于微电子管芯对准的至少一个凹部的载体的使用，使用用于微电子管芯对准的精密模制载体，在可重复使用的载体上使用微电子骰子的磁对准， 和/或在可重复使用的载体上使用具有模制工艺的临时粘合剂。