公开(公告)号：US10062498B2

公开(公告)日：2018-08-28

申请号：US14840405

申请日：2015-08-31

Applicant: CYNTEC CO., LTD.

Inventor： Chia-Cheng Chuang

IPC: H01F27/28 ,  H01F17/06 ,  H01F19/08 ,  H01F38/02 ,  H01F17/00

CPC classification number: H01F27/2895 ,  H01F17/062 ,  H01F19/08 ,  H01F27/2823 ,  H01F38/02 ,  H01F2017/0093

Abstract: A composite magnetic component is provided. The composite magnetic component includes a magnetic flux-guiding unit, a first coil structure and a second coil structure. The first coil structure and the second coil structure are wound around a first winding portion and a second winding portion of the magnetic flux-guiding unit, respectively. A first magnetic flux results from the first coil structure and the magnetic flux-guiding unit. A second magnetic flux results from the second coil structure and the magnetic flux-guiding unit. The first magnetic flux is orthogonal to the second magnetic flux within the magnetic flux-guiding unit.

公开(公告)号：US09959965B2

公开(公告)日：2018-05-01

申请号：US14941647

申请日：2015-11-15

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Tiao Liu ,  Lan-Chin Hsieh ,  Tsung-Chan Wu ,  Chi-Hsun Lee ,  Chih-Siang Chuang

IPC: H01F27/02 ,  H01F27/29 ,  H01F27/24 ,  H01F17/04 ,  H01F27/255 ,  H01F27/28 ,  H01F1/147

CPC classification number: H01F27/022 ,  H01F1/14741 ,  H01F1/14766 ,  H01F1/14791 ,  H01F17/045 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29

Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein the volume of the base is V1 and the volume of the pillar is V2; a coil wound on the pillar; and a magnetic body encapsulating the pillar, the coil and a portion of the base, wherein the ratio of V1 to V2 (V1/V2) is configured in a pre-determined range so as to reduce the total core loss of the inductor with the equivalent permeability of the inductor being between 28.511 and 52.949.

公开(公告)号：US09691710B1

公开(公告)日：2017-06-27

申请号：US14959768

申请日：2015-12-04

Applicant: CYNTEC CO., LTD.

Inventor： Joseph D. S. Deng ,  Chia-Hsien Shen ,  Shu-Wei Chang ,  Kuan-Chih Huang

IPC: H01L21/00 ,  H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81

Abstract: A semiconductor package includes a substrate, a plurality of pin pads, a radio frequency (RF) pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna and a conductive solder. The RF pad is used to receive or transmit an RF signal on the top side of the substrate. The SMD component is mounted on the RF pad. The mold compound on the top side of the substrate covers the semiconductor component and the SMD component. The PCB antenna is located on the mold compound. Wherein, the conductive solder and the SMD component are stacked between the RF pad and a feeding structure of the PCB antenna.

公开(公告)号：US09544989B2

公开(公告)日：2017-01-10

申请号：US14945073

申请日：2015-11-18

Applicant: CYNTEC CO., LTD.

Inventor： Chih-Tse Chen ,  Joseph D. S. Deng ,  Shih-Hsien Tseng

IPC: H01H9/28 ,  H05K5/00 ,  H05K1/02 ,  H05K9/00 ,  H05K1/00 ,  H05K7/00 ,  H05K1/11 ,  H05K1/18 ,  H02B5/00

CPC classification number: H05K1/0216 ,  H05K1/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K5/00 ,  H05K5/0026 ,  H05K7/00 ,  H05K9/0022 ,  H05K2201/08 ,  H05K2201/1003

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.

Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 任何两个相邻的以太网变压器分别布置有具有第二特定长度的间隙。

公开(公告)号：US09514964B2

公开(公告)日：2016-12-06

申请号：US14821812

申请日：2015-08-10

Applicant: Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

Abstract translation: 公开了一种形成导电结构的方法，所述方法包括以下步骤：形成具有彼此分离的多个金属部件的金属框架; 在所述多个金属部件的顶表面上形成绝缘层; 以及在所述绝缘层上形成导电图案层，用于与所述多个金属部件的至少一部分进行电连接。

公开(公告)号：US09451701B2

公开(公告)日：2016-09-20

申请号：US14594083

申请日：2015-01-10

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

公开(公告)号：US09251944B2

公开(公告)日：2016-02-02

申请号：US13969486

申请日：2013-08-16

Applicant: Lan-Chin Hsieh ,  Cheng-Chang Lee ,  Chih-Hung Chang ,  Chih-Siang Chuang ,  Tsung-Chan Wu ,  Roger Hsieh

Inventor： Lan-Chin Hsieh ,  Cheng-Chang Lee ,  Chih-Hung Chang ,  Chih-Siang Chuang ,  Tsung-Chan Wu ,  Roger Hsieh

IPC: H01F17/06 ,  H01F27/24 ,  H01F17/04 ,  H01F3/14 ,  H01F38/02 ,  H01F3/10

CPC classification number: H01F27/24 ,  H01F3/14 ,  H01F17/04 ,  H01F27/2823 ,  H01F38/023 ,  H01F2003/106

Abstract: A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.

Abstract translation: 可变耦合电感器包括第一芯，两个导线，第二芯和磁结构。 第一芯包括两个第一突出部分，第二突出部分和两个凹槽，其中第二突出部分位于两个第一突出部分之间，并且每个槽位于第一突出部分和第二突出部分之一之间。 每个导线设置在一个凹槽中。 第二芯设置在第一芯上。 在第一突出部和第二芯之间形成有第一间隙，在第二突出部和第二芯之间形成有第二间隙。 磁性结构设置在第二突出部和第二芯之间，并相对于第二突出部的中心线对称分布。

公开(公告)号：US09117580B2

公开(公告)日：2015-08-25

申请号：US13959441

申请日：2013-08-05

Applicant: CYNTEC CO., LTD.

Inventor： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh ,  Yu-Ching Kuo ,  Chia-Hui Lai

IPC: H01F27/02 ,  H01F27/06 ,  H01F27/29 ,  H01F5/00 ,  H01F27/28 ,  H01F3/08 ,  H01F17/04

CPC classification number: H01F27/24 ,  H01F3/08 ,  H01F17/045 ,  H01F27/022 ,  H01F27/255 ,  H01F27/2823 ,  H01F27/2828 ,  H01F2017/048

Abstract: A choke includes a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located between the first and second boards, a winding space located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section having a first axis and a second axis substantially perpendicularly intersecting with each other at a center of the cross section of the pillar, and wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second axis, each of the first substantially straight edges being a joint of and in direct contact with one of the arc edges and one of the second substantially straight edges.

Abstract translation: 扼流器包括由相同材料制成的单件式芯，单件式芯具有第一板，第二板和位于第一板和第二板之间的支柱，位于第一板之间的绕组空间，第二板 板和支柱，其中所述支柱具有非圆形和非矩形横截面，所述横截面具有在所述柱的横截面的中心处彼此基本垂直相交的第一轴线和第二轴线，并且其中， 柱的横截面包括两个弧形边缘，基本上平行于第一轴线的四个第一基本上直的边缘和基本上平行于第二轴线的两个第二基本上直的边缘，每个第一基本上直的边缘是直接接触的接头 其中弧形边缘中的一个和第二基本上直的边缘中的一个。

公开(公告)号：US09111954B2

公开(公告)日：2015-08-18

申请号：US13180292

申请日：2011-07-11

Applicant: Da-Jung Chen ,  Kaipeng Chiang ,  Yu-Chao Fang ,  Yi-Cheng Lin

Inventor： Da-Jung Chen ,  Kaipeng Chiang ,  Yu-Chao Fang ,  Yi-Cheng Lin

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10 ,  H01L23/64 ,  H01L23/552 ,  H01L25/07 ,  H02M3/155 ,  H02M7/00 ,  H01L23/00

CPC classification number: H01L23/645 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1904 ,  H01L2924/19042 ,  H01L2924/19102 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/155 ,  H02M7/003 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.

Abstract translation: 电力转换模块包括电路载板，半导体模块和电感模块。 电路载板具有多个接合焊盘。 半导体模块设置在电路承载板的第一表面上。 电感器模块具有多个引脚。 引脚沿着第一方向从电感器模块延伸并与电路载体板上的对应焊盘连接，使得在电感器模块和电路载体板之间限定容纳半导体模块的插座。

公开(公告)号：US08878627B2

公开(公告)日：2014-11-04

申请号：US13097072

申请日：2011-04-29

Applicant: Shih-Hsien Tseng

Inventor： Shih-Hsien Tseng

IPC: H01P5/12 ,  H03H7/48 ,  H03H1/00 ,  H03H7/21

CPC classification number: H03H7/48 ,  H03H7/21 ,  H03H2001/0021 ,  Y10T29/49099

Abstract: A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.

Abstract translation: 在本发明中，单片功率分配器用于将一对输入差分信号分成两对输出差分信号。 单片功率分配器具有两个输入端子，用于接收一对输入差分信号，并且它具有集成在一个单个芯片中的两个1/2功率分配器，以将一对输入差分信号分成两对输出差分信号 功率。 并且，单片功率分配器具有四个输出端子以输出两对输出差分信号。 在一个实施例中，第一个逐个功率分配器和第二个逐个功率分配器在基板的相同表面上制成。 在另一个实施例中，第一个逐个功率分配器和第二个逐个功率分配器在衬底的相对表面上制成。 单片功率分配器可以基于功率分配器电路的倒数特性用作功率组合器。