摘要:
In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
摘要:
A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.
摘要:
A modularized circuit component. The modularized circuit component includes a device having an identifying feature, an electrical terminal, and at least one of a mechanical plug and a mechanical receptacle. The modularized circuit component further includes a support block having an identifying feature that is substantially the same as the identifying feature of the device, at least one of a mechanical plug and a mechanical receptacle to interface with the at least one of a mechanical plug and a mechanical receptacle of the device, and an electrical terminal configured to interface with a circuit board. The identifying feature of the device and of the support block may comprise a texture, a color, a shape, or the like. In some embodiments, the device included in the modularized circuit component is a circuit protection device such as a fuse or a relay.
摘要:
Numerous embodiments of a carrier substrate having thermochromatic materials are described. In one embodiment of the present invention, a carrier substrate has a visible surface, and a thermochromatic material is disposed near the carrier substrate. The thermochromatic material produces a visual change of the visible surface when an activation temperature of the thermochromatic material is reached.
摘要:
Fluorescent functional dyes represented by the following formulas: wherein R1 is hydrogen or methyl; R2, R3, R4, R5, and R6 are each independently selected from the group consisting of hydrogen, alkyl, aryl, alkoxy, aralkyl, alkaryl, halo, and trifluoromethyl; and L is a straight chain or branched chain alkylene containing 3 to about 15 carbon atoms, the alkylene group optionally containing one or more catenary heteroatoms.
摘要翻译:由下式表示的荧光功能性染料:其中R 1是氢或甲基; R 2,R 3,R 4,R 5和R 6, 各自独立地选自氢,烷基,芳基,烷氧基,芳烷基,烷芳基,卤素和三氟甲基; 并且L是含有3至约15个碳原子的直链或支链亚烷基,该亚烷基任选地含有一个或多个链状杂原子。
摘要:
The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same. According to the invention, since a desired circuit is composed by disposing a specific number of chip components according to a specified rule, it is not necessary to heat the buried chip components at high temperature when forming a module, chip components are obtained in specified values, and the circuit characteristics, functions, and dimensional precision are stably obtained exactly as designed, and moreover since the chip components are disposed according to a specified rule, it is easy to automate insertion of chip components and increase its operation speed, even if the size of the chip components is reduced, and the circuit composition may be flexibly and easily changed only by changing the inserting position and type of chip components.
摘要:
An inspection apparatus for a base substrate of a multi-layered board irradiates light to the base substrate of a multilayered board to which a protective film is attached. An image of a surface, to which the protective film is attached, is picturized by a camera, so that an acceptability of a state of a via hole is inspected on the basis of a difference between a light reflectivity of the via hole and a light reflectivity of the protective film. The protective film is colored so as to lower its light reflectivity so that the difference between the light reflectivity of the via hole and that of the protective film is clearly generated. Accordingly, on the basis of the image picturized by the camera, the size of the via hole, dusts therein and the acceptability of the via hole can be accurately inspected.
摘要:
A method of color-coding a blade and a bladed system is disclosed. The bladed system has a plurality of slots. In particular, the method facilitates selecting at least one slot for inserting therein the blade. One of a plurality of core colors is associated with each slot of the bladed system, whereas each core color indicates which type of blade can be inserted in the corresponding slot. One of the core colors is associated with the blade. In the bladed system, a slot which has an associated core color which matches the core color of the blade is selected. The blade is inserted in the selected slot.
摘要:
A method and product for identifying the origin of products having fiberglass components or constituents wherein the glass fibers are coated with a fluorescent agent that glows when subsequently subjected to UV or appropriate wavelength light. Thus by selecting a unique color or pattern a manufacturer can readily identify his products.
摘要:
An insulation layer is formed on a ground layer. The insulation layer includes first and second regions for forming wiring layers. The impedance of a wiring layer formed on the second region is lower than that of a wiring layer formed on the first region. A signal line pattern is formed on the wiring layer on the first region of the insulation layer. A power supply plane is formed on the wiring layer on the second region of the insulation layer in order to feed power to the signal line pattern through a termination resistor connected to the signal line pattern.