Patent search ap:("DEXERIALS CORPORATION") AND inv:"Yasushi AKUTSU" Page 4

31.

发明申请
CONNECTION BODY 审中-公开

公开(公告)号：US20170236795A1

公开(公告)日：2017-08-17

申请号：US15584609

申请日：2017-05-02

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA , Yasushi AKUTSU

IPC: H01L23/00

CPC classification number: H01L24/83 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/13019 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/13644 , H01L2224/13647 , H01L2224/14131 , H01L2224/14133 , H01L2224/14135 , H01L2224/16225 , H01L2224/27003 , H01L2224/27334 , H01L2224/2929 , H01L2224/29293 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/73204 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/81385 , H01L2224/81395 , H01L2224/81488 , H01L2224/81903 , H01L2224/83101 , H01L2224/8313 , H01L2224/83132 , H01L2224/83192 , H01L2224/83203 , H01L2224/83499 , H01L2224/83851 , H01L2224/83862 , H01L2224/83874 , H01L2924/381 , H01L2924/00 , H01L2924/0549 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/00014 , H01L2924/0665 , H01L2924/066 , H01L2924/069 , H01L2924/0635 , H01L2924/01006

Abstract: Even in case of conductive particles being clamped between stepped sections of substrate electrodes and electrode terminals, conductive particles sandwiched between each main surface of the substrate electrodes and electrode terminals are sufficiently compressed, ensuring electrical conduction. An electronic component is connected to a circuit substrate via an anisotropic conductive adhesive agent, on respective edge-side areas of substrate electrodes of the circuit substrate and electrode terminals of the electronic component, stepped sections are formed and abutted, conductive particles are sandwiched between each main surface and stepped sections of the substrate electrodes and electrode terminals; the conductive particles and stepped sections satisfy formula, a+b+c≦0.8 D (1), wherein a is height of the stepped section of the electrode terminals, b is height of the stepped section of the substrate electrodes, c is gap distance between each stepped sections and D is diameter of conductive particles.

32.

发明申请
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME 审中-公开
Title translation: 各向异性导电膜及其生产方法

公开(公告)号：US20170012015A1

公开(公告)日：2017-01-12

申请号：US15115813

申请日：2015-02-04

Applicant: DEXERIALS CORPORATION

Inventor： Reiji TSUKAO , Yasushi AKUTSU

IPC: H01L23/00 , B32B27/30 , B32B27/40 , B32B27/20 , B32B27/32 , B32B27/08 , B32B27/38

CPC classification number: H01L24/29 , B32B27/08 , B32B27/20 , B32B27/308 , B32B27/32 , B32B27/38 , B32B27/40 , B32B2307/202 , B32B2307/206 , B32B2307/706 , C09J4/00 , C09J163/00 , C09J201/00 , H01L24/00 , H01L2224/2919 , H01R11/01

Abstract: A first anisotropic conductive film 1A or a second anisotropic conductive film 1B has a first insulating resin layer 2 and a second insulating resin layer 3. The first insulating resin layer 2 is formed of a photopolymerized resin, and the second insulating resin layer 3 is formed of a polymerizable resin. Conductive particles 10 are disposed in a single layer on a surface of the first insulating resin layer 2 on a side of the second insulating resin layer 3. The first anisotropic conductive film further has a third insulating resin layer 4 formed of a polymerizable resin, and the second anisotropic conductive film 1B has an intermediate insulating resin layer 6. The intermediate insulating resin layer 6 is formed of a resin containing no polymerization initiator, and is in contact with the conductive particles 10. These anisotropic conductive films have favorable connection reliability.

Abstract translation: 第一各向异性导电膜1A或第二各向异性导电膜1B具有第一绝缘树脂层2和第二绝缘树脂层3.第一绝缘树脂层2由光聚合树脂形成，并且形成第二绝缘树脂层3 的可聚合树脂。导电粒子10在第一绝缘树脂层2的第二绝缘树脂层3侧的表面上设置在单层中。第一各向异性导电膜还具有由可聚合树脂形成的第三绝缘树脂层4和第二各向异性导电膜1B具有中间绝缘树脂层6.中间绝缘树脂层6由不含聚合引发剂的树脂形成，并与导电颗粒10接触。这些各向异性导电膜具有良好的连接可靠性。

33.

发明申请
ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING CONNECTION BODY, CONNECTION BODY AND ANISOTROPIC CONDUCTIVE FILM 审中-公开
Title translation: 对准方法，连接电子元件的方法，制造连接体的方法，连接体和各向异性导电膜

公开(公告)号：US20160351532A1

公开(公告)日：2016-12-01

申请号：US15117326

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU

IPC: H01L23/00 , C09J9/02 , C09J171/12

CPC classification number: H01L24/83 , C08K2201/001 , C09D163/00 , C09J7/00 , C09J7/10 , C09J9/02 , C09J171/12 , C09J2203/326 , C09J2205/102 , G02F1/13306 , G02F1/1339 , G02F1/134309 , G02F1/13439 , G02F1/1345 , G02F1/13452 , G02F2001/133302 , G02F2001/133354 , G02F2202/28 , H01L23/544 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/91 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/54486 , H01L2224/16225 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/73204 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/81203 , H01L2224/83101 , H01L2224/8313 , H01L2224/83132 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H05K1/0269 , H05K3/323 , H05K2203/166 , H01L2924/00 , H01L2924/00014 , H01L2924/0665

Abstract: An alignment mark at a position that overlaps an area in which an anisotropic conductive film is pasted, and to accurately perform alignment using an image captured by a camera. An alignment method in which an electronic component is mounted on the obverse surface of a transparent substrate with a conductive adhesive agent interposed therebetween, a substrate-side alignment mark and a component-side alignment mark are adjusted from the captured image, and the position at which the electronic component is mounted on the transparent substrate is aligned, wherein in the conductive adhesive agent, conductive particles are in a regular arrangement as viewed from a planar perspective, and in the captured image, the outside edges of the alignment marks exposed between the conductive particles are intermittently visible as line segments (S) along the imaginary line segments of the outside edges of the alignment mark.

Abstract translation: 在与各向异性导电膜被粘贴的区域重叠的位置处的对准标记，并且使用由照相机拍摄的图像来精确地进行对准。将电子部件安装在透明基板的具有导电性粘合剂的正面的基板侧对准标记和分量侧对准标记的对准方法中，从捕获图像和位置对准电子部件安装在透明基板上，其中在导电粘合剂中，从平面的角度看，导电颗粒处于规则的布置，并且在捕获的图像中，对准标记的外边缘在导电颗粒沿着对准标记的外边缘的假想线段间断地看作线段（S）。

34.

发明申请
CONNECTION BODY 有权
Title translation: 连接体

公开(公告)号：US20160351531A1

公开(公告)日：2016-12-01

申请号：US15114453

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA , Yasushi AKUTSU

IPC: H01L23/00

CPC classification number: H01L24/83 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/13019 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/13644 , H01L2224/13647 , H01L2224/14131 , H01L2224/14133 , H01L2224/14135 , H01L2224/16225 , H01L2224/27003 , H01L2224/27334 , H01L2224/2929 , H01L2224/29293 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/73204 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/81385 , H01L2224/81395 , H01L2224/81488 , H01L2224/81903 , H01L2224/83101 , H01L2224/8313 , H01L2224/83132 , H01L2224/83192 , H01L2224/83203 , H01L2224/83499 , H01L2224/83851 , H01L2224/83862 , H01L2224/83874 , H01L2924/381 , H01L2924/00 , H01L2924/0549 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/00014 , H01L2924/0665 , H01L2924/066 , H01L2924/069 , H01L2924/0635 , H01L2924/01006

Abstract: Even in case of conductive particles being clamped between stepped sections of substrate electrodes and electrode terminals, conductive particles sandwiched between each main surface of the substrate electrodes and electrode terminals are sufficiently compressed, ensuring electrical conduction. An electronic component is connected to a circuit substrate via an anisotropic conductive adhesive agent, on respective edge-side areas of substrate electrodes of the circuit substrate and electrode terminals of the electronic component, stepped sections are formed and abutted, conductive particles are sandwiched between each main surface and stepped sections of the substrate electrodes and electrode terminals; the conductive particles and stepped sections satisfy formula, a+b+c≦0.8 D (1), wherein a is height of the stepped section of the electrode terminals, b is height of the stepped section of the substrate electrodes, c is gap distance between each stepped sections and D is diameter of conductive particles.

Abstract translation: 即使在基板电极和电极端子的台阶部之间夹着导电粒子的情况下，夹在基板电极的每个主表面和电极端子之间的导电颗粒被充分地压缩，从而确保导电。电子部件通过各向异性导电粘合剂在电路基板的基板电极的各个边缘侧区域和电子部件的电极端子上连接到电路基板，台阶部形成并抵接，导电粒子夹在每个基板电极和电极端子的主表面和阶梯部分; 导电粒子和阶梯部分满足公式a + b +c≤0.8D（1）其中a是电极端子的阶梯部分的高度，b是基板电极的阶梯部分的高度，c是间隙距离在每个阶梯部分之间，D是导电颗粒的直径。

35.

发明公开
ANISOTROPIC CONDUCTIVE FILM 审中-公开

公开(公告)号：US20230159797A1

公开(公告)日：2023-05-25

申请号：US18098412

申请日：2023-01-18

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke SATO , Yasushi AKUTSU , Ryousuke ODAKA , Yusuke TANAKA

IPC: C09J9/02 , C09J7/10 , H05K3/32 , H04N23/54 , H01B1/22 , C09J11/04 , C09J163/00 , H01L27/146 , H01R4/04 , H05K1/18

CPC classification number: C09J9/02 , C09J7/10 , H05K3/323 , H04N23/54 , H01B1/22 , C09J11/04 , C09J163/00 , H01L27/14618 , H01R4/04 , H05K1/181 , C08K3/08

Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

36.

发明申请
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF 有权

公开(公告)号：US20210280548A1

公开(公告)日：2021-09-09

申请号：US17328336

申请日：2021-05-24

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA , Yasushi AKUTSU

IPC: H01L23/00 , H01R4/04 , H05K3/32 , B32B3/06 , B32B3/30 , B32B5/14 , B32B3/26

Abstract: An anisotropic conductive film includes a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer. The anisotropic conductive film has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles is asymmetric with respect to the conductive particle. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film, short circuits and conductive failure can be reduced.

37.

发明申请
ANISOTROPIC CONDUCTIVE FILM 审中-公开

公开(公告)号：US20200144214A1

公开(公告)日：2020-05-07

申请号：US16728554

申请日：2019-12-27

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU , Reiji TSUKAO

IPC: H01L23/00 , C09J9/02 , H01L23/29

Abstract: An anisotropic conductive film which can be used as a standard product as long as no problems arise in anisotropic conductive connections, even in a case where omissions are present in a prescribed disposition of conductive particles, includes a regular disposition region in which conductive particles are disposed regularly in an insulating resin binder, and has a length of 5 m or greater. A standard region including no sections with more than a prescribed number of consecutive omissions in conductive particles is present in the regular disposition region over a prescribed width in a short-side direction of the anisotropic conductive film and at least a prescribed length in a long-side direction of the anisotropic conductive film.

38.

发明申请
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM 审中-公开

公开(公告)号：US20190237426A1

公开(公告)日：2019-08-01

申请号：US16383234

申请日：2019-04-12

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU

IPC: H01L23/00

CPC classification number: H01L24/32 , H01L24/29 , H01L24/83 , H01L2224/29082 , H01L2224/29499 , H01L2224/32225 , H01L2224/83203 , H01L2224/83851

Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.

39.

发明申请
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF 审中-公开

公开(公告)号：US20190096844A1

公开(公告)日：2019-03-28

申请号：US16206628

申请日：2018-11-30

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi SARUYAMA , Yasushi AKUTSU

IPC: H01L23/00 , H01R4/04 , H05K3/32

Abstract: An anisotropic conductive film 1A includes a conductive particle array layer 4 in which a plurality of conductive particles 2 are arrayed in a prescribed manner and held in an insulating resin layer The anisotropic conductive film 1A has a direction in which a thick distribution, around the individual conductive particle, of the insulating resin layer 3 holding the array of the conductive particles 2 is asymmetric with respect to the conductive particle 2. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film 1A, short circuits and conductive failure can be reduced.