公开(公告)号：US20080142932A1

公开(公告)日：2008-06-19

申请号：US11834402

申请日：2007-08-06

申请人： Gottfried Beer ,  Edward Fuergut

发明人： Gottfried Beer ,  Edward Fuergut

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L23/29 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/04105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device with a plastic housing composition includes a semiconductor chip and an internal wiring. The plastic housing composition is electrically conductive and electrically connected to a first contact pad of the internal wiring. A first side of the semiconductor chip is electrically insulated from the plastic housing composition by an insulation layer.

摘要翻译： 具有塑料外壳组合物的半导体器件包括半导体芯片和内部布线。 塑料外壳组合物是导电的并且电连接到内部布线的第一接触焊盘。 半导体芯片的第一面通过绝缘层与塑料外壳组合物电绝缘。

公开(公告)号：US20080105966A1

公开(公告)日：2008-05-08

申请号：US11869354

申请日：2007-10-09

申请人： Gottfried Beer ,  Christoph Kienmayer ,  Klaus Pressel ,  Werner Simbuerger

发明人： Gottfried Beer ,  Christoph Kienmayer ,  Klaus Pressel ,  Werner Simbuerger

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/66 ,  G01S7/032 ,  G01S19/36 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/44 ,  H01Q9/0407 ,  H01Q9/0457 ,  H01Q19/00 ,  H01Q21/0087 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principle surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principle surface.

摘要翻译： 半导体模块包括塑料外壳中的部件。 半导体模块包括塑料封装模塑料和半导体芯片。 模块中还设置有包括塑料封装模塑料的上侧和半导体芯片的至少一个活性上侧的第一主表面，包括塑料封装模塑料的背面的第二主表面和多层 导体轨道结构设置在第一主表面上，第二金属层设置在第二主表面上。

公开(公告)号：US20070230876A1

公开(公告)日：2007-10-04

申请号：US11693446

申请日：2007-03-29

申请人： Gottfried Beer ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Jean Schmitt

发明人： Gottfried Beer ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Jean Schmitt

IPC分类号： G02B6/36

CPC分类号： G02B6/4202 ,  G02B6/4232

摘要： A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.

摘要翻译： 用于通过铰接接头彼此连接的两个结构单元之间传输数据的设备具有较长的使用寿命，其允许高传输速率与特别小的尺寸相结合。 第一结构单元包括第一光电子部件，第二结构单元包括第二光电子部件，第一光电子部件经由至少一根光纤连接到第二光电部件。 通过模制的互连装置（MID）插头连接使光纤的一端与第一光电子部件接触，另一端通过另一个MID插头连接与第二光电子部件接触。

公开(公告)号：US20060273437A1

公开(公告)日：2006-12-07

申请号：US11437826

申请日：2006-05-22

申请人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

发明人： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

IPC分类号： H01L23/02

CPC分类号： H01L31/0203 ,  H01L24/97 ,  H01L31/02327 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optoelectronic semiconductor assembly includes at least the following components: a semiconductor chip with an optical sensor region on its active topside, a wiring substrate on which the semiconductor chip is arranged, electrical connecting elements extending between the semiconductor chip and the wiring substrate, and an optically transparent cover an optically transparent plastic encapsulation compound that embeds at least the semiconductor chip and electrical connecting elements. The optically transparent encapsulation compound can be formed via a compression molding process.

摘要翻译： 光电子半导体组件至少包括以下部件：半导体芯片，其主动顶面上具有光学传感器区域，其上布置有半导体芯片的布线基板，在半导体芯片和布线基板之间延伸的电连接元件，以及 光学透明地覆盖至少嵌入半导体芯片和电连接元件的光学透明塑料封装化合物。 光学透明的封装化合物可以通过压缩成型工艺形成。

公开(公告)号：US20050018977A1

公开(公告)日：2005-01-27

申请号：US10890258

申请日：2004-07-14

申请人： Gottfried Beer ,  Nikolaus Schunk

发明人： Gottfried Beer ,  Nikolaus Schunk

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/4246 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An optoelectronic module and a connecting piece for the module with respect to an optical fiber and with respect to a circuit board can have a semiconductor chip in the form of an optical transmitter chip, which has a light-wave-emitting top side and has a rear side contact as a cathode on its rear side. Further semiconductor chips are embedded in a plastics composition with the optical transmitter chip in such a way that a coplanar overall top side is formed from the plastics composition and the active top side.

摘要翻译： 相对于光纤并相对于电路板的光电模块和用于模块的连接件可以具有光发射器芯片形式的半导体芯片，该发射器芯片具有发光的顶侧，并且具有 后侧接触件作为其后侧的阴极。 另外的半导体芯片以这样的方式嵌入到具有光发射机芯片的塑料组合物中，使得由塑料组合物和有源顶侧形成共面整体顶侧。

公开(公告)号：US08872315B2

公开(公告)日：2014-10-28

申请号：US13570783

申请日：2012-08-09

申请人： Khalil Hosseini ,  Joachim Mahler ,  Ivan Nikitin ,  Gottfried Beer

发明人： Khalil Hosseini ,  Joachim Mahler ,  Ivan Nikitin ,  Gottfried Beer

IPC分类号： H01L23/48

CPC分类号： H01L24/27 ,  H01L23/14 ,  H01L23/49579 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/2741 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8382 ,  H01L2224/8384 ,  H01L2224/83856 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/00

摘要： A semiconductor device includes an electrically conducting carrier and a semiconductor chip disposed over the carrier. The semiconductor device also includes a porous diffusion solder layer provided between the carrier and the semiconductor chip.

摘要翻译： 半导体器件包括导电载体和设置在载体上的半导体芯片。 半导体器件还包括设置在载体和半导体芯片之间的多孔扩散焊料层。

公开(公告)号：US08658468B2

公开(公告)日：2014-02-25

申请号：US13570986

申请日：2012-08-09

申请人： Gottfried Beer ,  Irmgard Escher-Poeppel

发明人： Gottfried Beer ,  Irmgard Escher-Poeppel

IPC分类号： H01L21/00

CPC分类号： H01L24/96 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76879 ,  H01L23/3128 ,  H01L24/18 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2919 ,  H01L2224/83856 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer.

摘要翻译： 公开了一种制造半导体芯片模块和半导体芯片封装的方法。 一个实施例提供第一层，第二层和基层。 第一层设置在基层上，第二层设置在第一层上。 多个半导体芯片被施加在第二层上方，并且具有施加的半导体芯片的第二层与第一层分离。

公开(公告)号：US20120319304A1

公开(公告)日：2012-12-20

申请号：US13595049

申请日：2012-08-27

申请人： Klaus Pressel ,  Gottfried Beer

发明人： Klaus Pressel ,  Gottfried Beer

IPC分类号： H01L29/02 ,  H01L21/56

CPC分类号： G01P1/023 ,  B81B7/02 ,  B81B2207/092 ,  B81B2207/095 ,  B81C1/0023 ,  B81C2203/0154 ,  G01L9/0042 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H04R1/04 ,  H04R2201/003 ,  H01L2224/82 ,  H01L2224/29099 ,  H01L2924/00

摘要： A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.

摘要翻译： 半导体器件及其制造方法。 一个实施例提供了半导体芯片。 封装材料覆盖半导体芯片。 金属层在半导体芯片和封装材料之上。 电压产生单元和显示单元中的至少一个刚性地附接到至少一个封装材料和金属层。

公开(公告)号：US08334202B2

公开(公告)日：2012-12-18

申请号：US12611609

申请日：2009-11-03

申请人： Jens Pohl ,  Hans-Joachim Barth ,  Gottfried Beer ,  Rainer Steiner ,  Werner Robl ,  Mathias Vaupel

发明人： Jens Pohl ,  Hans-Joachim Barth ,  Gottfried Beer ,  Rainer Steiner ,  Werner Robl ,  Mathias Vaupel

IPC分类号： H01L23/48

CPC分类号： H01L23/5389 ,  H01L21/486 ,  H01L21/76873 ,  H01L21/76879 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/82 ,  H01L24/97 ,  H01L2221/1089 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

摘要： A method for fabricating a device includes providing a substrate including at least one contact and applying a dielectric layer over the substrate. The method includes applying a first seed layer over the dielectric layer, applying an inert layer over the seed layer, and structuring the inert layer, the first seed layer, and the dielectric layer to expose at least a portion of the contact. The method includes applying a second seed layer over exposed portions of the structured dielectric layer and the contact such that the second seed layer makes electrical contact with the structured first seed layer. The method includes electroplating a metal on the second seed layer.

摘要翻译： 一种用于制造器件的方法包括提供包括至少一个接触的衬底并在衬底上施加电介质层。 该方法包括在电介质层上施加第一种子层，在种子层上施加惰性层，以及构造惰性层，第一种子层和电介质层以暴露至少一部分接触。 该方法包括在结构化介电层和触点的暴露部分上施加第二种子层，使得第二籽晶层与结构化的第一籽晶层电接触。 该方法包括在第二种子层上电镀金属。

公开(公告)号：US08258624B2

公开(公告)日：2012-09-04

申请号：US11837211

申请日：2007-08-10

申请人： Gottfried Beer ,  Irmgard Escher-Poeppel

发明人： Gottfried Beer ,  Irmgard Escher-Poeppel

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/96 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76879 ,  H01L23/3128 ,  H01L24/18 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2919 ,  H01L2224/83856 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer.