公开(公告)号：US5948193A

公开(公告)日：1999-09-07

申请号：US886032

申请日：1997-06-30

Applicant: Michael A. Cohn ,  Jon A. Casey ,  Christopher N. Collins ,  Robert A. Rita ,  Robert J. Sullivan ,  Adrienne M. Tirch ,  Leslie J. Wiands ,  Ryan W. Wuthrich

Inventor： Michael A. Cohn ,  Jon A. Casey ,  Christopher N. Collins ,  Robert A. Rita ,  Robert J. Sullivan ,  Adrienne M. Tirch ,  Leslie J. Wiands ,  Ryan W. Wuthrich

IPC: C04B35/622 ,  B28B1/30 ,  B32B18/00 ,  H01G4/30 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46 ,  B32B31/26

CPC classification number: B32B18/00 ,  H01L21/4857 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2237/12 ,  C04B2237/343 ,  C04B2237/704 ,  H05K1/0306 ,  H05K3/4629

Abstract: Greensheets having enhanced flexibility and strength are prepared from a greensheet casting composition comprising alumina or other ceramic having a mean particle size of less than about 1 micron and being substantially unimodal, a binder resin, a solvent system and a plasticizer. The greensheets may be formed having a thickness of about 50 microns using conventional greensheet fabricating devices. The greensheets are particularly suitable as dielectric layers for internal layer capacitors in a multilayer ceramic substrate. A preferred co-sintering heating profile to avoid blistering of the MLC package is also provided to form the capacitor containing MLC.

Abstract translation: 具有增强的柔韧性和强度的格式纸由包含氧化铝或平均粒径小于约1微米并且基本上单峰的其它陶瓷，粘合剂树脂，溶剂体系和增塑剂的毛坯铸塑组合物制备。 可以使用常规的毛坯制造装置形成厚度为约50微米的毛坯。 毛坯特别适合作为多层陶瓷基板中的内层电容器的介电层。 还提供了优选的共烧结加热曲线，以避免MLC封装的起泡，以形成包含MLC的电容器。

公开(公告)号：US5916374A

公开(公告)日：1999-06-29

申请号：US21046

申请日：1998-02-09

Applicant: Jon A. Casey ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  John U. Knickerbocker ,  David C. Long ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  Krishna G. Sachdev ,  David E. Speed ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Bruce E. Tripp ,  James C. Utter

Inventor： Jon A. Casey ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  John U. Knickerbocker ,  David C. Long ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  Krishna G. Sachdev ,  David E. Speed ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Bruce E. Tripp ,  James C. Utter

IPC: B08B3/02 ,  B41F35/00 ,  G03F1/82 ,  G03F7/12 ,  G03F7/42 ,  H01L21/00 ,  H05K3/12 ,  H05K3/26 ,  B08B3/04

CPC classification number: H01L21/67028 ,  B08B3/02 ,  B41F35/005 ,  G03F1/82 ,  G03F7/425 ,  B41P2235/26 ,  B41P2235/50 ,  G03F7/12 ,  H05K3/1216 ,  H05K3/26

Abstract: A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.

Abstract translation: 一种清洁方法和相关设备，用于使用在面罩的两侧同时施加的高压下的碱性洗涤剂水溶液来清洗半导体掩模掩模，随后进行干燥步骤，其使用空气刀将掩模表面吹出任何残余的清洁剂溶液。

公开(公告)号：US5800761A

公开(公告)日：1998-09-01

申请号：US727097

申请日：1996-10-08

Applicant: Jon A. Casey ,  Michael A. Cohn ,  Michael E. Cropp ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

Inventor： Jon A. Casey ,  Michael A. Cohn ,  Michael E. Cropp ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

IPC: B29C33/68 ,  B29C37/00 ,  H01L21/48 ,  H01L21/68 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  B29D7/01

CPC classification number: H01L21/6836 ,  B29C33/68 ,  B29C37/0067 ,  H01L21/4807 ,  H01L23/49894 ,  H05K3/0097 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/1536 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T428/25 ,  Y10T428/30 ,  Y10T428/31855 ,  Y10T428/31942

Abstract: An interface layer for separating first and second microelectronic ceramic substrates during firing includes a thermally degradable binder, preferably a polymer, that degrades at temperatures above room temperature and below a firing temperature for the microelectronic ceramic substrates, and a separating material, such as boron nitride or graphite. The method of making the interface layer includes mixing the binder, one or more solvents for the binder, a plasticizer and the separating material for a sufficient period of time to form a homogeneous mass, then casting the material in a thin sheet to form the interface layer.

Abstract translation: 用于在焙烧期间分离第一和第二微电子陶瓷衬底的界面层包括可降解的粘合剂，优选聚合物，其在高于室温且低于微电子陶瓷衬底的烧制温度的温度下降解;以及分离材料，例如氮化硼 或石墨。 制造界面层的方法包括将粘合剂，用于粘合剂的一种或多种溶剂，增塑剂和分离材料混合足够长的时间以形成均匀的质量，然后将该材料浇铸成薄片以形成界面 层。

公开(公告)号：US5635000A

公开(公告)日：1997-06-03

申请号：US577180

申请日：1995-12-22

Applicant: Jon A. Casey ,  Cynthia J. Calli ,  Darren T. Cook ,  David B. Goland ,  John U. Knickerbocker ,  Mark J. LaPlante ,  David C. Long ,  Daniel S. Mackin ,  Kathleen M. McGuire ,  Keith C. O'Neil ,  Kevin M. Prettyman ,  Michael T. Puchalski ,  Joseph C. Saltarelli ,  Candace A. Sullivan

Inventor： Jon A. Casey ,  Cynthia J. Calli ,  Darren T. Cook ,  David B. Goland ,  John U. Knickerbocker ,  Mark J. LaPlante ,  David C. Long ,  Daniel S. Mackin ,  Kathleen M. McGuire ,  Keith C. O'Neil ,  Kevin M. Prettyman ,  Michael T. Puchalski ,  Joseph C. Saltarelli ,  Candace A. Sullivan

IPC: H01L21/48 ,  H01L21/683 ,  H05K1/03 ,  H05K3/40 ,  B32B31/04 ,  B32B31/28

CPC classification number: H05K3/4061 ,  H01L21/4867 ,  H01L21/6833 ,  H05K1/0306 ,  H05K2203/105 ,  Y10T156/1056 ,  Y10T156/1158 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T428/239 ,  Y10T428/31 ,  Y10T428/31786

Abstract: The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.

Abstract translation: 本发明一般涉及使用静电粘附进行筛选的新装置和方法。 更具体地，本发明包括在半导体衬底的筛选过程中使用静电电荷的装置。 基本上，使用静电荷将背衬层附着在生坯陶瓷片上，同时处理生坯陶瓷片。

公开(公告)号：US5541005A

公开(公告)日：1996-07-30

申请号：US438825

申请日：1995-05-11

Applicant: Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katherine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

Inventor： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katherine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

IPC: B28B11/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/522 ,  H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  B22F3/105

CPC classification number: H05K1/142 ,  H01L21/4807 ,  H01L23/15 ,  H05K3/46 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09972 ,  Y10T428/12049 ,  Y10T428/12146 ,  Y10T428/16 ,  Y10T428/163 ,  Y10T428/166 ,  Y10T428/192

Abstract: A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

Abstract translation: 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

公开(公告)号：US5468445A

公开(公告)日：1995-11-21

申请号：US281716

申请日：1994-07-28

Applicant: Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

Inventor： Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

IPC: C04B37/00 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/46 ,  B22F7/08

CPC classification number: H05K1/092 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract translation: 一种用于陶瓷的新型金属填充通孔组合物。 可以将通孔组合物配制成具有接近于陶瓷材料的体积收缩率，从而克服了烧结时通孔（特别是铜填充的通孔）和陶瓷之间体积收缩失配的问题。 该新型通孔组合物表现出增强的对陶瓷的附着力。 还公开了通过控制新型通孔组合物的收缩并提高粘合性的烧结方法。

公开(公告)号：US5336444A

公开(公告)日：1994-08-09

申请号：US890898

申请日：1992-05-29

Applicant: Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

Inventor： Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

IPC: C04B37/00 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/46 ,  H01B1/00 ,  H01B1/02

CPC classification number: H05K1/092 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract translation: 一种用于陶瓷的新型金属填充通孔组合物。 可以将通孔组合物配制成具有接近于陶瓷材料的体积收缩率，从而克服了烧结时通孔（特别是铜填充的通孔）和陶瓷之间体积收缩失配的问题。 该新型通孔组合物表现出增强的对陶瓷的附着力。 还公开了通过控制新型通孔组合物的收缩并提高粘合性的烧结方法。

公开(公告)号：US5277725A

公开(公告)日：1994-01-11

申请号：US881448

申请日：1992-05-11

Applicant: John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

Inventor： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC: H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  C04B37/00 ,  B05D5/12

CPC classification number: H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

Abstract translation: 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

公开(公告)号：US08421217B2

公开(公告)日：2013-04-16

申请号：US13419949

申请日：2012-03-14

Applicant: Jon A. Casey ,  John S. Corbin, Jr. ,  David Danovitch ,  Isabelle Depatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

Inventor： Jon A. Casey ,  John S. Corbin, Jr. ,  David Danovitch ,  Isabelle Depatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

IPC: H01L23/12 ,  H01L23/34

CPC classification number: H01L23/04 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H01L24/28 ,  H01L24/31 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Abstract translation: 一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。 该系统采用盖子和多个热界面材料。 该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。

公开(公告)号：US20120175766A1

公开(公告)日：2012-07-12

申请号：US13419949

申请日：2012-03-14

Applicant: Jon A. Casey ,  John S. Corbin, JR. ,  David Danovitch ,  Isabelle Dépatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

Inventor： Jon A. Casey ,  John S. Corbin, JR. ,  David Danovitch ,  Isabelle Dépatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

IPC: H01L23/34

CPC classification number: H01L23/04 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H01L24/28 ,  H01L24/31 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Abstract translation: 一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。 该系统采用盖子和多个热界面材料。 该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。