公开(公告)号：US08481366B2

公开(公告)日：2013-07-09

申请号：US13094668

申请日：2011-04-26

申请人： Masahiko Harayama ,  Kouichi Meguro ,  Junichi Kasai

发明人： Masahiko Harayama ,  Kouichi Meguro ,  Junichi Kasai

IPC分类号： H01L21/00

CPC分类号： G06F21/34 ,  H01L21/4842 ,  H01L21/566 ,  H01L23/3121 ,  H01L23/49551 ,  H01L23/49811 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85

摘要： A semiconductor device is provided that includes a semiconductor chip and a resin section that molds the semiconductor chip and has a first through-hole. A through electrode that is electrically coupled to the semiconductor chip, extends through the resin section, and extends between a top edge and a bottom edge of an inner surface of the first through-hole. A cavity which extends between planes corresponding to an upper surface and a lower surface of the resin section is formed inside the first through-hole.

摘要翻译： 提供了一种半导体器件，其包括半导体芯片和模制半导体芯片并具有第一通孔的树脂部分。 电耦合到半导体芯片的通孔延伸穿过树脂部分，并且在第一通孔的内表面的顶边缘和底边之间延伸。 在第一通孔的内部形成有在与树脂部的上表面和下表面对应的面之间延伸的空腔。

公开(公告)号：US08039943B2

公开(公告)日：2011-10-18

申请号：US12239566

申请日：2008-09-26

申请人： Masahiko Harayama ,  Kouichi Meguro ,  Junichi Kasai

发明人： Masahiko Harayama ,  Kouichi Meguro ,  Junichi Kasai

IPC分类号： H01L23/48

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L21/566 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is provided that includes a semiconductor chip and a resin section that molds the semiconductor chip and has a first through-hole. A through electrode that is electrically coupled to the semiconductor chip, extends through the resin section, and extends between a top edge and a bottom edge of an inner surface of the first through-hole. A cavity which extends between planes corresponding to an upper surface and a lower surface of the resin section is formed inside the first through-hole.

摘要翻译： 提供一种半导体器件，其包括半导体芯片和模制半导体芯片并具有第一通孔的树脂部分。 电耦合到半导体芯片的通孔延伸穿过树脂部分，并且在第一通孔的内表面的顶边缘和底边之间延伸。 在第一通孔的内部形成有在与树脂部的上表面和下表面对应的面之间延伸的空腔。

公开(公告)号：US6025650A

公开(公告)日：2000-02-15

申请号：US961243

申请日：1997-10-30

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Junichi Kasai

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L29/41

CPC分类号： H01L21/6835 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49548 ,  H01L24/49 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165

摘要： This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device comprises a semiconductor chip having a plurality of pads, a resin portion sealing said semiconductor chip and a terminal portion in which a prescribed number of pole terminals electrically connected to said pads provided in said semiconductor chip are provided, said pole terminals being exposed from said resin portion. According to the invention, a cost for production is reduced and a reliability and electrical characteristics can be improved.

摘要翻译： 本发明涉及一种半导体器件，其中多个外部端子以平坦表面的格子状排列。 半导体器件包括具有多个焊盘的半导体芯片，密封所述半导体芯片的树脂部分和设置有电连接到设置在所述半导体芯片中的所述焊盘的规定数量的极端子的端子部分，所述极端子露出 从所述树脂部分。 根据本发明，生产成本降低，并且可以提高可靠性和电气特性。

公开(公告)号：US06856017B2

公开(公告)日：2005-02-15

申请号：US09442038

申请日：1999-11-17

申请人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

发明人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10 ,  H01L29/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/04

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

摘要翻译： 一种包括芯片的装置和密封芯片的树脂封装，树脂封装具有位于树脂封装的安装侧表面上的树脂突起。 金属膜分别设置在树脂突起上。 连接部件电连接芯片的电极焊盘和金属膜。

公开(公告)号：US09508651B2

公开(公告)日：2016-11-29

申请号：US12039511

申请日：2008-02-28

申请人： Masanori Onodera ,  Junichi Kasai

发明人： Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L23/48 ,  H01L23/538 ,  H01L21/683 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L24/08 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/5388 ,  H01L24/03 ,  H01L24/17 ,  H01L24/19 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/02333 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/83005

摘要： A semiconductor device includes a semiconductor chip, a bump electrode, a molding portion, a redistribution layer and an outer connection electrode. The bump electrode is provided on an upper face of the semiconductor chip. The molding portion encapsulates an entire side face of the semiconductor chip and seals the bump electrode so that a part of the bump electrode is exposed. The redistribution layer is provided on an upper face of the molding portion and is electrically coupled to the semiconductor chip via the bump electrode. The outer connection electrode is provided on an upper face of the redistribution layer and is electrically coupled to the bump electrode via the redistribution layer.

摘要翻译： 半导体器件包括半导体芯片，凸块电极，成型部分，再分配层和外部连接电极。 凸起电极设置在半导体芯片的上表面上。 模制部分封装半导体芯片的整个侧面并且密封凸起电极，以使凸起电极的一部分露出。 再分配层设置在模制部分的上表面上，并且经由凸块电极电耦合到半导体芯片。 外部连接电极设置在再分布层的上表面上，并且经由再分配层电连接到凸块电极。

公开(公告)号：US07144754B2

公开(公告)日：2006-12-05

申请号：US10856777

申请日：2004-06-01

申请人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

发明人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L21/50

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

摘要翻译： 一种包括芯片的装置和密封芯片的树脂封装，树脂封装具有位于树脂封装的安装侧表面上的树脂突起。 金属膜分别设置在树脂突起上。 连接部件电连接芯片的电极焊盘和金属膜。

公开(公告)号：US6072239A

公开(公告)日：2000-06-06

申请号：US744048

申请日：1996-11-06

申请人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

发明人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10 ,  H01L29/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/04

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H05K3/305 ,  H05K3/3442 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L24/45 ,  H01L24/49 ,  H01L24/78 ,  H01L29/0657 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  H05K3/303 ,  H05K3/3436 ,  Y02P70/613

摘要： A device includes a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic films.

摘要翻译： 一种器件包括芯片和密封芯片的树脂封装，树脂封装具有位于树脂封装的安装侧表面上的树脂突起。 金属膜分别设置在树脂突起上。 连接部件电连接芯片的电极焊盘和金属膜。

公开(公告)号：US08274158B2

公开(公告)日：2012-09-25

申请号：US12877661

申请日：2010-09-08

申请人： Junichi Kasai ,  Junji Tanaka ,  Naomi Masuda

发明人： Junichi Kasai ,  Junji Tanaka ,  Naomi Masuda

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/05 ,  H01L22/24 ,  H01L23/544 ,  H01L24/06 ,  H01L24/17 ,  H01L24/81 ,  H01L2223/5442 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/17051 ,  H01L2224/81121 ,  H01L2224/8121 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/20106 ,  H01L2924/351 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/53022 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective one of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump.

摘要翻译： 公开了用于评估FCB封装中电极接合的结构，方法和系统。 在一个实施例中，一种方法包括将具有第一形状的多个第一电极的半导体芯片安装到具有第二形状的第二电极的安装部分，其中第二形状与第一形状不同， 所述多个第一电极和所述第二电极使用第一焊料凸块，产生所述第一焊料凸块的X射线图像，以及基于所述多个第一电极和所述第二电极中的相应一个的接合，基于 第一焊锡凸块的X射线图像。

公开(公告)号：US07816788B2

公开(公告)日：2010-10-19

申请号：US12122556

申请日：2008-05-16

申请人： Junichi Kasai ,  Junji Tanaka ,  Naomi Masuda

发明人： Junichi Kasai ,  Junji Tanaka ,  Naomi Masuda

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/05 ,  H01L22/24 ,  H01L23/544 ,  H01L24/06 ,  H01L24/17 ,  H01L24/81 ,  H01L2223/5442 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/17051 ,  H01L2224/81121 ,  H01L2224/8121 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/20106 ,  H01L2924/351 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/53022 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective on of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump.

摘要翻译： 公开了用于评估FCB封装中电极接合的结构，方法和系统。 在一个实施例中，一种方法包括将具有第一形状的多个第一电极的半导体芯片安装到具有第二形状的第二电极的安装部分，其中第二形状与第一形状不同， 所述多个第一电极和所述第二电极使用第一焊料凸块，产生所述第一焊料凸块的X射线图像，以及基于所述多个第一电极和所述第二电极中的相应一个的接合，基于 第一焊锡凸块的X射线图像。

公开(公告)号：US20090038300A1

公开(公告)日：2009-02-12

申请号：US11921409

申请日：2006-05-30

申请人： Kenta Naito ,  Satoru Senbayashi ,  Yuichi Hamada ,  Junichi Kasai ,  Yoshinobu Tamura ,  Masashi Gabe

发明人： Kenta Naito ,  Satoru Senbayashi ,  Yuichi Hamada ,  Junichi Kasai ,  Yoshinobu Tamura ,  Masashi Gabe

IPC分类号： F01N3/10

CPC分类号： F01N3/2086 ,  B01D53/323 ,  B01D2258/012 ,  B01D2259/818 ,  F01N3/0275 ,  F01N2240/04 ,  Y02T10/26

摘要： In order to remove by burning captured PM by using microscopic luminescent discharge that repeats generation and extinction randomly in time and space on the surface of an insulating filter with a minimum power consumption and to enhance the capturing efficiency and combustion-removal efficiency of PM in exhaust gas from diesel engines or the like, at least one electrode pair (13) are arranged on or in the vicinity of the surface of an insulating capturing member (12) for capturing particulate matter (41) in exhaust gas, a predetermined voltage (Vs) is applied between the electrode pair (12) to generate a microscopic luminescent discharge (42) that repeats generation and extinction randomly in time and space on the surface of the insulating capturing member (12), and the microscopic luminescent discharge (42) generated by the application of this predetermined voltage (Vs) is used to remove by burning the particulate matter (41) captured on the insulating capturing member (12).

摘要翻译： 为了通过使用在最小功耗下在绝缘过滤器的表面上随时随机地发生和消光的微观发光放电来焚烧捕获的PM，并且提高废气中PM的捕集效率和燃烧除去效率， 来自柴油发动机等的气体，至少一个电极对（13）布置在用于捕获废气中的颗粒物质（41）的绝缘捕获构件（12）的表面附近或其附近，预定电压（Vs ）被施加在电极对（12）之间以产生在绝缘捕获构件（12）的表面上随时间地重复产生和消光的微观发光放电（42），并且产生微观发光放电（42） 通过施加该预定电压（Vs）来通过燃烧捕获在绝缘捕获构件（12）上的颗粒物质（41）来去除。