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    Optoelectronic component with protective circuit
    32.
    发明授权
    Optoelectronic component with protective circuit 有权
    带保护电路的光电元件

    公开(公告)号：US09418972B2

    公开(公告)日：2016-08-16

    申请号：US14429390

    申请日：2013-09-27

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Peter Nagel ,  Stefan Illek

    IPC: H01L25/16 ,  H01L27/15 ,  H01L23/34 ,  H01L25/00 ,  H01L29/866 ,  H01L33/62 ,  H01L33/00

    CPC classification number: H05B33/083 ,  H01L23/34 ,  H01L25/162 ,  H01L25/167 ,  H01L25/50 ,  H01L27/15 ,  H01L29/866 ,  H01L33/0079 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05B33/089 ,  H01L2924/00

    Abstract: An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein each diode has two electrical connections, each electrical connection is led to a contact area, the contact areas are arranged on an underside of the first carrier, and a second carrier, wherein at least two zener diodes are arranged in the second carrier, the zener diodes have further electrical connections, each further electrical connection is led to a further contact area, the further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and is fixedly connected to the second carrier, and the zener diodes antiparallelly connect to the diodes.

    Abstract translation: 光电子部件包括具有至少两个发光二极管的至少一个第一载体，其中每个二极管具有两个电连接，每个电连接被引导到接触区域，接触区域布置在第一载体的下侧，并且 第二载体，其中在所述第二载体中布置至少两个齐纳二极管，所述齐纳二极管具有另外的电连接，每个进一步的电连接被引导到另一接触区域，所述另外的接触区域布置在所述第二载体的顶侧 第一载体由第二载体的顶侧的下侧承载，并固定地连接到第二载体，并且齐纳二极管反平行地连接到二极管。

    Optoelectronic Semiconductor Component and Method for Producing Same
    33.
    发明申请
    Optoelectronic Semiconductor Component and Method for Producing Same 有权
    光电子半导体元件及其制造方法

    公开(公告)号：US20160005722A1

    公开(公告)日：2016-01-07

    申请号：US14769779

    申请日：2014-01-22

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Stefan Illek ,  Matthias Sabathil

    IPC: H01L25/16 ,  H01L33/54 ,  H01L33/48 ,  H01L33/62

    CPC classification number: H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip with a first surface and a second surface. The component also includes a protective chip which has a protective diode, a first surface and a second surface. The semiconductor chip and the protective chip are embedded in a molded body. A first electrical contact and a second electrical contact are arranged on the first surface of the semiconductor chip. A third electrical contact and a fourth electrical contact are arranged on the first surface of the protective chip. The first electrical contact is electrically connected to the third electrical contact. In addition, the second electrical contact is electrically connected to the fourth electrical contact.

    Abstract translation: 光电子半导体部件包括具有第一表面和第二表面的光电子半导体芯片。 该部件还包括具有保护二极管，第一表面和第二表面的保护芯片。 半导体芯片和保护芯片嵌入成型体中。 在半导体芯片的第一表面上布置有第一电接触和第二电接触。 在保护芯片的第一表面上布置有第三电接触和第四电接触。 第一电触头电连接到第三电触点。 此外，第二电触点电连接到第四电触头。

    OPTOELECTRONIC COMPONENT WITH PROTECTIVE CIRCUIT
    35.
    发明申请
    OPTOELECTRONIC COMPONENT WITH PROTECTIVE CIRCUIT 有权
    带保护电路的光电元件

    公开(公告)号：US20150214203A1

    公开(公告)日：2015-07-30

    申请号：US14429390

    申请日：2013-09-27

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Peter Nagel ,  Stefan Illek

    IPC: H01L25/16 ,  H01L25/00 ,  H01L29/866 ,  H01L23/34 ,  H01L33/62 ,  H01L27/15

    CPC classification number: H05B33/083 ,  H01L23/34 ,  H01L25/162 ,  H01L25/167 ,  H01L25/50 ,  H01L27/15 ,  H01L29/866 ,  H01L33/0079 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05B33/089 ,  H01L2924/00

    Abstract: An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein each diode has two electrical connections, each electrical connection is led to a contact area, the contact areas are arranged on an underside of the first carrier, and a second carrier, wherein at least two zener diodes are arranged in the second carrier, the zener diodes have further electrical connections, each further electrical connection is led to a further contact area, the further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and is fixedly connected to the second carrier, and the zener diodes antiparallelly connect to the diodes.

    Abstract translation: 光电子部件包括具有至少两个发光二极管的至少一个第一载体，其中每个二极管具有两个电连接，每个电连接被引导到接触区域，接触区域布置在第一载体的下侧，并且 第二载体，其中在所述第二载体中布置至少两个齐纳二极管，所述齐纳二极管具有另外的电连接，每个进一步的电连接被引导到另一接触区域，所述另外的接触区域布置在所述第二载体的顶侧 第一载体由第二载体的顶侧的下侧承载，并固定地连接到第二载体，并且齐纳二极管反平行地连接到二极管。

    METHOD OF PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR CHIPS, AND OPTOELECTRONIC SEMICONDUCTOR CHIP
    37.
    发明申请
    METHOD OF PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR CHIPS, AND OPTOELECTRONIC SEMICONDUCTOR CHIP 有权
    生产多光子半导体晶体管的方法和光电子半导体芯片

    公开(公告)号：US20140319547A1

    公开(公告)日：2014-10-30

    申请号：US14364099

    申请日：2012-11-12

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Patrick Rode ,  Lutz Hoeppel ,  Norwin von Malm ,  Stefan Illek ,  Albrecht Kieslich ,  Siegfried Herrmann

    IPC: H01L31/18 ,  H01L33/00

    CPC classification number: H01L31/1876 ,  H01L33/005 ,  H01L33/36 ,  H01L33/382 ,  H01L2933/0016

    Abstract: A method of producing a plurality of optoelectronic semiconductor chips includes a) providing a layer composite assembly having a principal plane which delimits the layer composite assembly in a vertical direction, and includes a semiconductor layer sequence having an active region that generates and/or detects radiation, wherein a plurality of recesses extending from the principal plane in a direction of the active region are formed in the layer composite assembly; b) forming a planarization layer on the principal plane such that the recesses are at least partly filled with material of the planarization layer; c) at least regionally removing material of the planarization layer to level the planarization layer; and d) completing the semiconductor chips, wherein for each semiconductor chip at least one semiconductor body emerges from the semiconductor layer sequence.

    Abstract translation: 一种制造多个光电子半导体芯片的方法包括：a）提供具有在垂直方向上限定层复合组件的主平面的层复合组件，并且包括具有产生和/或检测辐射的有源区的半导体层序列 其特征在于，在所述层复合组件中形成有从所述主面向所述有源区的方向延伸的多个凹部， b）在所述主平面上形成平坦化层，使得所述凹部至少部分地被所述平坦化层的材料填充; c）至少在区域上去除平坦化层的材料以平整平坦化层; 以及d）完成半导体芯片，其中对于每个半导体芯片，至少一个半导体体从半导体层序列中排出。

    Optoelectronic component with protective circuit
    40.
    发明授权
    Optoelectronic component with protective circuit 有权

    公开(公告)号：US10426006B2

    公开(公告)日：2019-09-24

    申请号：US15210174

    申请日：2016-07-14

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Peter Nagel ,  Stefan Illek

    IPC: H01L25/16 ,  H05B33/08 ,  H01L27/15 ,  H01L23/34 ,  H01L25/00 ,  H01L29/866 ,  H01L33/62 ,  H01L33/00

    Abstract: An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein the diodes have electrical connections, the electrical connections are led to contact areas, and the contact areas are arranged on an underside of the first carrier; and a second carrier, wherein further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and fixedly connects to the second carrier, and an electronic circuit for open-loop and/or closed-loop control of the power supply of the diodes is integrated in the second carrier.

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