公开(公告)号：US06445063B1

公开(公告)日：2002-09-03

申请号：US09420672

申请日：1999-10-19

申请人： Jerrold L. King ,  Jerry M. Brooks

发明人： Jerrold L. King ,  Jerry M. Brooks

IPC分类号： H01L2302

CPC分类号： H01L25/0657 ,  H01L25/105 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/00 ,  H01L2224/48

摘要： A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a PCB board. One or more multi-conductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devices and external circuitry. One embodiment of the multi-conductor insulating assembly includes tape (such as Kapton™ tape) on which conductors are applied. One surface of the tape is preferably adhesive so as to stick to the integrated circuit devices. When properly aligned, the conductors make contact with the terminals of the integrated circuit devices and with a multi-conductor port. There may be multiple layers of conductors where different terminals aligned in a stack are to receive different signals. Another embodiment of the multi-conductor insulating assembly includes an epoxy onto which conductors are applied. In yet another embodiment, multi-conductor insulating assembly tape is sandwiched between integrated circuit semiconductor devices. Contact pads on the tape are aligned with bond pads on the integrated circuit semiconductor devices.

摘要翻译： 集成电路半导体器件的堆叠组件包括由PCB板支撑的集成电路半导体器件的堆叠。 一个或多个多导体绝缘组件提供集成电路半导体器件的端子与外部电路之间的接口。 多导体绝缘组件的一个实施例包括其上施加导体的带（例如Kapton TM带）。 带的一个表面优选是粘合剂，以便粘附到集成电路器件。 当正确对准时，导体与集成电路器件的端子和多导体端口接触。 可能存在多层导体，其中不同的端子在堆叠中对齐以接收不同的信号。 多导体绝缘组件的另一实施例包括在其上施加导体的环氧树脂。 在另一个实施例中，多导体绝缘组装带夹在集成电路半导体器件之间。 磁带上的接触焊盘与集成电路半导体器件上的接合焊盘对准。

公开(公告)号：US06238228B1

公开(公告)日：2001-05-29

申请号：US09505384

申请日：2000-02-16

申请人： David J. Corisis ,  Jerry M. Brooks ,  Terry R. Lee

发明人： David J. Corisis ,  Jerry M. Brooks ,  Terry R. Lee

IPC分类号： H01R1362

CPC分类号： H05K7/1023 ,  H01R12/7029 ,  H01R12/7064 ,  H01R12/707 ,  H05K3/301

摘要： A semiconductor package for vertically surface mounting to a printed circuit board having retention apparatus for holding the package thereto.

摘要翻译： 一种用于垂直表面安装到具有用于保持包装的保持装置的印刷电路板的半导体封装。

公开(公告)号：US06222265B1

公开(公告)日：2001-04-24

申请号：US09466454

申请日：1999-12-17

申请人： Salman Akram ,  Jerry M. Brooks

发明人： Salman Akram ,  Jerry M. Brooks

IPC分类号： H01L2334

CPC分类号： H01L25/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H05K1/144 ,  Y10S438/928 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

公开(公告)号：US6148509A

公开(公告)日：2000-11-21

申请号：US141004

申请日：1998-08-26

申请人： Aaron Schoenfeld ,  Jerry M. Brooks

发明人： Aaron Schoenfeld ,  Jerry M. Brooks

IPC分类号： H01L23/495 ,  H01R43/00

CPC分类号： H01L23/49541 ,  H01L23/4951 ,  H01L23/49568 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49169

摘要： An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.

摘要翻译： 本发明的超导芯片（LOC）引线框架包括构造成覆盖在集成电路（IC）裸片的前侧表面上的双面胶带的交叉引线的组件。 每个引线的附接表面可粘合地附接到带上，并且至少一些引线被构造成延伸穿过模具的前侧表面从一个边缘基本上延伸到另一个边缘，例如相邻或相对的边缘。 结果，模具的前侧表面的大部分区域通过带子可粘附到引线上，因此模具可以以改进的方式支撑在IC封装中，并且可以将热量从模具 通过引线框架以改进的方式。

公开(公告)号：US6134111A

公开(公告)日：2000-10-17

申请号：US060562

申请日：1998-04-15

申请人： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

发明人： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC分类号： H01L23/367 ,  H01L23/433 ,  H05K1/02 ,  H05K3/30 ,  H05K7/02

CPC分类号： H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613

摘要： A high density vertical surface mount package and thermal carrier therefor including a heat sink.

公开(公告)号：US6087720A

公开(公告)日：2000-07-11

申请号：US294185

申请日：1999-04-19

申请人： David J. Corisis ,  Jerry M. Brooks

发明人： David J. Corisis ,  Jerry M. Brooks

IPC分类号： H01L23/495 ,  H01L23/50 ,  H01L23/48 ,  H01L29/44

CPC分类号： H01L23/49541 ,  H01L23/49506 ,  H01L23/50 ,  H01L24/06 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/85207 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost of tooling changes by permitting the use of current tooling. The present invention utilizes an extended lead finger that extends along the periphery of a semiconductor device to provide a power source or ground so that any number of bond pads may be used in any position without requiring additional leads or tooling changes.

公开(公告)号：US6084297A

公开(公告)日：2000-07-04

申请号：US146643

申请日：1998-09-03

申请人： Jerry M. Brooks ,  Steven G. Thummel

发明人： Jerry M. Brooks ,  Steven G. Thummel

IPC分类号： H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/16 ,  H01L23/552 ,  H01L23/053 ,  H01L23/02 ,  H01L23/48

CPC分类号： H01L23/24 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/16 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/30107 ,  H01L2924/3011

摘要： A ball grid array (BGA) package includes a central cavity for receiving a semiconductor die therein. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically-conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging. A ground or other reference voltage plane, which is also electrically connected to at least one trace through the anisotropically-conductive adhesive layer, may extend over the adhesive layer and frame the cavity, or also extend over the cavity to provide an enclosure for the die. In the former case, an encapsulant is applied over the die and electrical connections to the traces.

摘要翻译： 球栅阵列（BGA）封装包括用于在其中接收半导体管芯的中心腔。 模具搁置在基底层压板上，其模具侧面包括延伸到空腔中的痕迹，其至少由各向异性导电粘合剂层构成。 芯片上的接合焊盘通过引线键合电连接，或者在倒装芯片配置的模具的情况下，焊料球或导电粘合元件与迹线电连接。 导体又通过导电通孔与基底层压板的相对侧的导电元件位置电连接，通过电介质层，导电元件部位承载焊球或其它离散的导电结合元件，用于连接到更高级的封装。 还通过各向异性导电粘合剂层电连接到至少一个迹线的接地或其它参考电压平面可以在粘合剂层上延伸并且框架空腔，或者也在空腔上延伸以提供用于模具的外壳 。 在前一种情况下，将密封剂施加在管芯上并且与迹线电连接。

公开(公告)号：US6071139A

公开(公告)日：2000-06-06

申请号：US52446

申请日：1998-03-31

申请人： David J. Corisis ,  Jerry M. Brooks ,  Terry R. Lee

发明人： David J. Corisis ,  Jerry M. Brooks ,  Terry R. Lee

IPC分类号： H05K3/30 ,  H05K7/10 ,  H01R13/62

CPC分类号： H05K7/1023 ,  H05K3/301 ,  H01R12/7029 ,  H01R12/7064 ,  H01R12/707

摘要： A semiconductor package for vertically surface mounting to a printed circuit board having retention apparatus for holding the package thereto.

公开(公告)号：US5897340A

公开(公告)日：1999-04-27

申请号：US914718

申请日：1997-08-19

申请人： Jerry M. Brooks ,  Larry D. Kinsman ,  Timothy J. Allen

发明人： Jerry M. Brooks ,  Larry D. Kinsman ,  Timothy J. Allen

IPC分类号： H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/4951 ,  H01L2924/0002

摘要： A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

公开(公告)号：US5729049A

公开(公告)日：1998-03-17

申请号：US618359

申请日：1996-03-19

申请人： David J. Corisis ,  Larry D. Kinsman ,  Jerry M. Brooks

发明人： David J. Corisis ,  Larry D. Kinsman ,  Jerry M. Brooks

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/12 ,  H01L23/50

CPC分类号： H01L23/49506 ,  H01L23/49544 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14

摘要： A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.