公开(公告)号：US09978623B2

公开(公告)日：2018-05-22

申请号：US14822392

申请日：2015-08-10

Applicant: Brooks Automation, Inc.

Inventor： Daniel Babbs ,  William Fosnight ,  Robert C. May ,  William Weaver

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67766 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67213 ,  H01L21/67225 ,  H01L21/67376 ,  H01L21/67379 ,  H01L21/67393 ,  H01L21/67742 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S414/14

Abstract: A substrate processing system including a processing section arranged to hold a processing atmosphere therein, a carrier having a shell forming an internal volume for holding at least one substrate for transport to the processing section, the shell being configured to allow the internal volume to be pumped down to a predetermined vacuum pressure that is different than an exterior atmosphere outside the substrate processing system, and a load port communicably connected to the processing section to isolate the processing atmosphere from the exterior atmosphere, the load port being configured to couple with the carrier to pump down the internal volume of the carrier and to communicably connect the carrier to the processing section, for loading the substrate into the processing section through the load port.

公开(公告)号：US09947599B2

公开(公告)日：2018-04-17

申请号：US15492428

申请日：2017-04-20

Applicant: Applied Materials, Inc.

Inventor： Yoichi Suzuki ,  Michael Wenyoung Tsiang ,  Kwangduk Douglas Lee ,  Takashi Morii ,  Yuta Goto

IPC: H01L21/66 ,  C23C16/50 ,  C23C16/52 ,  C23C16/56 ,  H01L21/324 ,  H01L21/02 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L22/20 ,  C23C16/46 ,  C23C16/50 ,  C23C16/52 ,  C23C16/56 ,  H01L21/02274 ,  H01L21/324 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/67742 ,  H01L22/12

Abstract: The present disclosure generally relates to a method for performing semiconductor device fabrication, and more particularly, to improvements in lithographic overlay techniques. The method for improved overlay includes depositing a material on a substrate, heating a substrate in a chamber using thermal energy, measuring a local stress pattern of each substrate, wherein measuring the local stress pattern measures an amount of change in a depth of the deposited material on the substrate, plotting a plurality of points on a k map to determine a local stress pattern of the substrate, adjusting the thermal energy applied to the points on the k map, determining a sensitivity value for each of the points on the k map, and applying a correction factor to the applied thermal energy to adjust the local stress pattern.

公开(公告)号：US20180040492A1

公开(公告)日：2018-02-08

申请号：US15676687

申请日：2017-08-14

Applicant: Lam Research Corporation

Inventor： Scott Wong ,  Damon Tyrone Genetti ,  Derek John Witkowicki ,  Alex Paterson ,  Richard H. Gould ,  Austin Ngo ,  Marc Estoque

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/687

CPC classification number: H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67303 ,  H01L21/6732 ,  H01L21/67369 ,  H01L21/67379 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67389 ,  H01L21/67742 ,  H01L21/68707

Abstract: A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first support column is disposed on the first lateral side proximal to the front side. A second support column is disposed on the second lateral side proximal to the front side. A third support column is disposed on the first lateral side proximal to back side and a fourth support column is disposed on the second lateral side proximal to the back side. Each of the support columns includes a plurality of support fingers distributed lengthwise and directed inward. A first hard stop column is disposed parallel to the third support column and a second hard stop column is disposed parallel to the fourth support column. A shell structure connected to the base plate is configured to enclose the first, second third and fourth support columns, top plate and first and second hard stop columns and includes a front opening disposed on the front side of the base plate. A door is mated to the front opening and includes retention assembly for securing consumable parts in the pod, when received in the pod.

公开(公告)号：US20180033659A1

公开(公告)日：2018-02-01

申请号：US15414326

申请日：2017-01-24

Applicant: Applied Materials, Inc.

Inventor： Chun YAN ,  Xinyu BAO

IPC: H01L21/67 ,  B08B15/00 ,  C30B33/00 ,  C30B25/12 ,  C30B25/08 ,  C30B25/14

CPC classification number: H01L21/67201 ,  B08B15/00 ,  B08B15/02 ,  B08B2215/003 ,  C23C16/45508 ,  C23C16/4551 ,  C23C16/45565 ,  C23C16/45574 ,  C23C16/45576 ,  C23C16/4558 ,  C30B25/08 ,  C30B25/12 ,  C30B25/14 ,  C30B33/00 ,  H01L21/67017

Abstract: Embodiments disclosed herein generally relate to a system, method, and apparatus for controlling substrate outgassing such that hazardous gasses are eliminated from a surface of a substrate after a III-V epitaxial growth process or an etch clean process, and prior to additional processing. An oxygen containing gas is flowed to a substrate in a load lock chamber, and subsequently a non-reactive gas is flowed to the substrate in the load lock chamber. As such, hazardous gases and outgassing residuals are decreased and/or removed from the substrate such that further processing may be performed.

公开(公告)号：US20180033611A1

公开(公告)日：2018-02-01

申请号：US15219512

申请日：2016-07-26

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Han-Wen Liao

IPC: H01L21/02 ,  H01J37/317 ,  H01L29/66

CPC classification number: H01L21/02071 ,  H01J37/317 ,  H01J37/32899 ,  H01J2237/317 ,  H01L21/02057 ,  H01L21/02068 ,  H01L21/30604 ,  H01L21/3065 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67213 ,  H01L29/66545 ,  H01L29/78

Abstract: A cluster tool includes a polyhedral transfer chamber, at least one processing chamber, at least one load lock chamber, and an electron beam (e-beam) source. The processing chamber is connected to the polyhedral transfer chamber. The processing chamber is configured to perform a manufacturing procedure to a wafer present therein. The load lock chamber is connected to the polyhedral transfer chamber. The e-beam source is configured to performing an e-beam treatment to the wafer after the wafer is performed the manufacturing procedure.

公开(公告)号：US20180019142A1

公开(公告)日：2018-01-18

申请号：US15673030

申请日：2017-08-09

Applicant: Lam Research Corporation

Inventor： Scott Wong ,  Damon Tyrone Genetti ,  Derek John Witkowicki ,  Alex Paterson ,  Richard H. Gould ,  Austin Ngo ,  Marc Estoque

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/687

CPC classification number: H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67303 ,  H01L21/6732 ,  H01L21/67369 ,  H01L21/67379 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67389 ,  H01L21/67742 ,  H01L21/68707

Abstract: A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first support column is disposed on the first lateral side proximal to the front side. A second support column is disposed on the second lateral side proximal to the front side. A third support column is disposed on the first lateral side proximal to back side and a fourth support column is disposed on the second lateral side proximal to the back side. Each of the support columns includes a plurality of support fingers distributed lengthwise and directed inward. A first hard stop column is disposed parallel to the third support column and a second hard stop column is disposed parallel to the fourth support column. A shell structure connected to the base plate is configured to enclose the first, second third and fourth support columns, top plate and first and second hard stop columns and includes a front opening disposed on the front side of the base plate. A door is mated to the front opening and includes retention assembly for securing consumable parts in the pod, when received in the pod.

公开(公告)号：US09823652B2

公开(公告)日：2017-11-21

申请号：US14380586

申请日：2013-02-12

Applicant: HITACHI KOKUSAI ELECTRIC INC.

Inventor： Kazuyoshi Yamamoto

IPC: G05B19/418 ,  H01L21/67 ,  H01J37/32 ,  H01L21/02 ,  G05B23/02

CPC classification number: G05B19/41875 ,  G05B23/0267 ,  G05B2219/24068 ,  G05B2219/2602 ,  H01J37/32082 ,  H01J37/32926 ,  H01L21/02 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67288 ,  Y02P90/14

Abstract: A substrate processing system includes a substrate processing apparatus configured to process a substrate, and a management device configured to display specified information transmitted from the substrate processing apparatus on a display unit. The substrate processing apparatus includes a processing environment measuring unit configured to measure information on a substrate processing environment according to time and a trouble information notifying unit configured to notify information on a trouble of the substrate processing apparatus. The management device includes a storage unit configured to store measurement information measured by the processing environment measuring unit and notification information notified by the trouble information notifying unit. The display unit is configured to display the measurement information and the notification information which are stored in the storage unit and correlated with each other.

公开(公告)号：US20170323786A1

公开(公告)日：2017-11-09

申请号：US15654186

申请日：2017-07-19

Applicant: Lam Research Corporation

Inventor： Hu Kang ,  Shankar Swaminathan ,  Jun Qian ,  Wanki Kim ,  Dennis Hausmann ,  Bart J. van Schravendijk ,  Adrien LaVoie

IPC: H01L21/02 ,  C23C16/34 ,  H01L21/762 ,  H01L21/67 ,  C23C16/04 ,  C23C16/56 ,  C23C16/455 ,  C23C16/40 ,  H01L21/768 ,  H01L21/285

CPC classification number: H01L21/02274 ,  C23C16/045 ,  C23C16/345 ,  C23C16/402 ,  C23C16/45523 ,  C23C16/4554 ,  C23C16/56 ,  H01L21/02164 ,  H01L21/022 ,  H01L21/02211 ,  H01L21/02219 ,  H01L21/0228 ,  H01L21/28562 ,  H01L21/67201 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76826 ,  H01L21/76837

Abstract: Provided herein are methods and apparatus for filling one or more gaps on a semiconductor substrate. The disclosed embodiments are especially useful for forming seam-free, void-free fill in both narrow and wide features. The methods may be performed without any intervening etching operations to achieve a single step deposition. In various implementations, a first operation is performed using a novel PEALD fill mechanism to fill narrow gaps and line wide gaps. A second operation may be performed using PECVD methods to continue filling the wide gaps.

公开(公告)号：US20170278681A1

公开(公告)日：2017-09-28

申请号：US15080961

申请日：2016-03-25

Applicant: Lam Research Corporation

Inventor： Chengzhu Qi ,  Yukinori Sakiyama ,  Bin Luo ,  Douglas Keil ,  Pramod Subramonium ,  Chunhai Ji ,  Joseph Lindsey Womack

IPC: H01J37/32 ,  H01L21/02 ,  C23C16/50 ,  H01L21/687

CPC classification number: H01J37/32715 ,  C23C16/4585 ,  C23C16/50 ,  H01J37/32467 ,  H01J37/32623 ,  H01J37/32642 ,  H01J37/32733 ,  H01L21/02274 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68771

Abstract: A carrier ring configured to support a substrate during transport to or from a pedestal of a process tool and surrounding the substrate during processing is defined by, an inner annular portion having a first thickness, the inner annular portion defined to be adjacent a substrate support region of the pedestal; a middle annular portion surrounding the inner annular portion, the middle annular portion having a second thickness greater than the first thickness, such that a transition from a top surface of the inner annular portion to a top surface of the middle annular portion defines a first step; an outer annular portion surrounding the middle annular portion, the outer annular portion having a third thickness greater than the second thickness, such that a transition from the top surface of the middle annular portion to a top surface of the outer annular portion defines a second step.

公开(公告)号：US20170271187A1

公开(公告)日：2017-09-21

申请号：US15267698

申请日：2016-09-16

Applicant: PIOTECH CO., LTD.

Inventor： Ren ZHOU ,  Xuyen Pham ,  Brian Lu ,  Sean Chang ,  Shicai Fang ,  Jie Lian ,  Enguo Men

IPC: H01L21/673 ,  H01L21/687 ,  H01L21/677

CPC classification number: H01L21/67201

Abstract: Disclosed is a load lock chamber which includes a chamber body including: at least one pair of cavities, defined in a layer structure of the chamber body to carry one or more wafer substrates; at least one internal conduit, defined between and coupled with the paired cavities, such that the paired cavities are communicated with each other and capable of conducting gas refilling and exhaustion; and a plurality of wafer supports for carrying the wafer substrates, the plurality of wafer supports being securely received in the paired cavities and able to calibrate with a machine arm frontend finger, wherein the wafer support includes grooves defined thereon for calibrating the machine arm frontend finger.