公开(公告)号：US20040106321A1

公开(公告)日：2004-06-03

申请号：US10719937

申请日：2003-11-21

Inventor： Andrew Harvey Barr ,  Jeremy Ian Wilson ,  Irving McKenzie Birmingham

IPC: H01R012/24

CPC classification number: H05K1/028 ,  H01B7/0009 ,  H01B7/0823 ,  H05K1/0224 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09745

Abstract: An embodiment of a cable system includes a cable that has a conductor, a power layer and dielectric material. The conductor is operative to carry a signal, the dielectric material is located at least partially between the conductor and the power layer, and the power layer is operative as ground. The power layer is formed of a conductive material and includes a first region and an adjacent second region. The first region includes a greater amount of the conductive material than the second region so that the power layer is less resistant to bending along the second region than along the first region. Methods and other systems are also provided.

公开(公告)号：US20040080054A1

公开(公告)日：2004-04-29

申请号：US10684423

申请日：2003-10-15

Applicant: HITACHI CABLE, LTD.

Inventor： Akira Chinda ,  Akira Matsuura

IPC: H01L021/44 ,  H01L023/48

CPC classification number: H01L23/49811 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H05K1/113 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/4069 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2203/0733 ,  Y02P70/613 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a writing board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principle plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.

Abstract translation: 在其中开口限定在薄膜状绝缘基板的预定位置的写板中，在绝缘基板的主平面上设置设置有覆盖开口的连接端子的电布线和要连接的导电构件 其中电线的连接端子设置在开口内部; 具有从绝缘基板的电气布线配置的表面的厚度的导电部件的厚度比绝缘基板的厚度薄。

公开(公告)号：US20040052035A1

公开(公告)日：2004-03-18

申请号：US10601767

申请日：2003-06-24

Inventor： Pasi Lehtonen ,  Kimmo Huhtala ,  Marko Kuusikko

IPC: H02B001/00

CPC classification number: H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/5171

Abstract: The invention relates to a method of producing an electronic unit of a radio system and an electronic unit of a radio system. The electronic unit comprises a mechanical part, a circuit board attached to the mechanical part and an electronic component connected to the circuit board. The method comprises mounting (1702) the electronic component in a cavity provided for the electronic component in the mechanical part; placing (1704) the circuit board on the electronic component and the mechanical part; connecting (1706) the electronic component and the circuit board together using electric coupling members for aligning them with respect to each other and for forming an electrical connection between electric connecting means of the circuit board and electric connecting means of the electronic component; and attaching (1708) the electronic component and the circuit board to each other and to the mechanical part automatically so that the electronic component will be in contact with the mechanical part.

Abstract translation: 本发明涉及一种无线电系统的电子单元的制造方法和无线电系统的电子单元。 电子单元包括机械部件，附接到机械部件的电路板和连接到电路板的电子部件。 该方法包括将电子部件安装（1702）到设置在机械部件中的电子部件的空腔中; 将电路板（1704）放置在电子部件和机械部件上; 使用电耦合构件将电子部件和电路板连接（1706），以使它们相对于彼此对准，并且用于在电路板的电连接装置和电子部件的电连接装置之间形成电连接; 并将电子部件和电路板自动地连接（1708）到机械部件，使得电子部件将与机械部件接触。

公开(公告)号：US20040048420A1

公开(公告)日：2004-03-11

申请号：US10601464

申请日：2003-06-23

Inventor： Ronald Brooks Miller

IPC: H01L021/44

CPC classification number: H01P3/087 ,  H01P3/084 ,  H05K1/0219 ,  H05K1/0272 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/09809 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: An air dielectric printed circuit board fabrication method is disclosed based on the principles of suspended substrate transmission lines as used in microwave assemblies. The transmission line conductor is on a thin dielectric layer suspended in air between two conductive planes. The ground in the area around the transmission line may be cut back either by milling or by photo-etching to preclude shorting the transmission line.

Abstract translation: 基于微波组件中使用的悬置衬底传输线的原理，公开了一种空气介电印刷电路板制造方法。 传输线导体位于悬挂在两个导电平面之间的空气中的薄介电层上。 传输线周围区域的接地可以通过铣削或光蚀刻来切割，以防止传输线短路。

公开(公告)号：US20040042179A1

公开(公告)日：2004-03-04

申请号：US10229788

申请日：2002-08-27

Inventor： Patrick Kevin Murphy

IPC: H05K007/20

CPC classification number: H05K7/20509 ,  H05K3/0061 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/09745 ,  H05K2201/10598

Abstract: A heatsink for a printed circuit board (PCB) overlies most or all of the board. It is clamped tightly to the board with its board-facing surface in close proximity to the heat-generating components on the board. A pliant, thermally-conductive dielectric layer is sandwiched between the PCB and the facing surface of the heatsink. Lands at various heights are formed on the heatsink surface facing the PCB to be in good heat-conducting proximity to the surfaces of heat-generating circuit components of various heights on the PCB.

Abstract translation: 印刷电路板（PCB）的散热片覆盖了大部分或全部电路板。 它被紧紧地夹在板上，其面板表面靠近板上的发热部件。 一个柔韧的导热介电层夹在PCB和散热片的相对表面之间。 在面对PCB的散热器表面上形成各种高度的地面，以使其与PCB上各种高度的发热电路部件的表面接近良好的导热性。

公开(公告)号：US20040027054A1

公开(公告)日：2004-02-12

申请号：US10637624

申请日：2003-08-11

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yoshimi Uda ,  Kazuya Ishiwata ,  Shinsaku Kubo ,  Yasuyuki Watanabe

IPC: H01J001/62 ,  H01J063/04

CPC classification number: H05K1/0271 ,  H01J29/02 ,  H01J31/127 ,  H01J2329/0489 ,  H01J2329/861 ,  H05K1/092 ,  H05K3/248 ,  H05K2201/035 ,  H05K2201/09745 ,  H05K2203/0514 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/53204 ,  Y10T29/53209

Abstract: As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 nullm. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

Abstract translation: 作为具有微细线且能够抑制基板中的裂纹产生和细线剥离的基板，本发明公开了一种在细线上布置多个凹槽的结构，特别是其中多个 凹槽不超过200毫米。 还公开了沿着与细线的长度方向交叉的方向配置多个凹部的结构。

公开(公告)号：US20040018373A1

公开(公告)日：2004-01-29

申请号：US10340031

申请日：2003-01-10

Inventor： Tomoe Suzuki ,  Shinji Yuri ,  Kazuhisa Sato ,  Kozo Yamasaki

IPC: B32B003/10 ,  H01B013/00

CPC classification number: H05K1/056 ,  B32B15/08 ,  B32B27/38 ,  H05K3/0052 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0909 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49165 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0581 ,  Y10T428/12 ,  Y10T428/12361 ,  Y10T428/15 ,  Y10T428/24298 ,  Y10T428/24314 ,  Y10T428/24917

Abstract: The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.

Abstract translation: 本发明提供一种制造印刷布线基板的方法，其可以制造印刷布线基板，每个印刷布线基板具有均匀厚度的树脂电介质层和优异的表面平坦度，同时在切割步骤中保持良好的切割性能。 制造了包括具有第一主表面和第二主表面的金属板以及设置在第一和第二主表面上的树脂电介质层的多印刷布线基板。 金属板具有第一凹部和第二凹部。 第一凹陷部分在第一主表面处被打开，并且沿着预定的切割线不连续地布置。 第二凹陷部分在第二主表面处被打开，并且沿着预定切割线不连续地布置。 多个印刷线路基板被沿着预定的切割线切割成多个印刷布线基板。

公开(公告)号：US06683387B1

公开(公告)日：2004-01-27

申请号：US09593816

申请日：2000-06-15

Applicant: Terri J. Brownfield

Inventor： Terri J. Brownfield

IPC: H01L2348

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/19041 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A carrier member is provided that has a plurality of landing pads thereon where at least one of the landing pads has a depression therein to hold at least one solder terminal of a device to be mounted thereto. Embodiments include a ceramic or a bismaleimide-triazine epoxy laminate carrier having an array of landing pads formed by depositing a eutectic solder, where each landing pad in the comer of the array has a depression therein.

Abstract translation: 提供一种载体构件，其上具有多个着陆垫，其中至少一个着陆垫具有凹陷以保持待安装的装置的至少一个焊接端子。 实施方案包括具有通过沉积共晶焊料形成的着陆焊盘阵列的陶瓷或双马来酰亚胺 - 三嗪环氧树脂层压载体，其中阵列的角落中的每个着陆垫具有凹陷。

公开(公告)号：US06674647B2

公开(公告)日：2004-01-06

申请号：US10040740

申请日：2002-01-07

Applicant: Mark V. Pierson ,  Ajit K. Trivedi

Inventor： Mark V. Pierson ,  Ajit K. Trivedi

IPC: H05K710

CPC classification number: H05K3/3436 ,  B23K26/0006 ,  B23K26/361 ,  B23K2101/42 ,  B23K2103/16 ,  H01L23/49816 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81026 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3457 ,  H05K2201/09745 ,  H05K2201/10992 ,  H05K2203/0278 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

Abstract: Self-aligning combination of a substrate with a chip is provided, using reverse patterns of raised recesses and raised shapes on the respective substrate and chip surfaces. High-force contact bump production is avoided. Reliable contact between a chip and substrate is achieved, with minimized skewing after chip placement.

Abstract translation: 提供了基板与芯片的自对准组合，在相应的基板和芯片表面上使用凸起凹槽和凸起形状的反向图案。 避免了大力接触凸块生产。 实现芯片和基板之间的可靠接触，并且在芯片放置之后使偏移最小化。

公开(公告)号：US20030232489A1

公开(公告)日：2003-12-18

申请号：US10421921

申请日：2003-04-24

Inventor： Masahiko Mizutani ,  Sadamichi Takakusaki ,  Motoichi Nezu ,  Kazutoshi Motegi ,  Mitsuru Noguchi

IPC: H01L021/301 ,  H01L021/46 ,  H01L021/78 ,  H01L021/44

CPC classification number: H05K3/0052 ,  H01L2924/01023 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09745 ,  H05K2203/0228 ,  H05K2203/1572 ,  H05K2203/302

Abstract: In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substrates 10 are manufactured from a single metal substrate 10Anull by dicing. In some embodiments, the method includes: preparing a metal substrate 10Anull having an insulating layer 11 formed on the top surface thereof; forming a plurality of conductive patterns 12 on the top surface of insulating layer 11; forming grooves 20 in lattice form on the rear surface of metal substrate 10Bnull; mounting hybrid integrated circuits onto conductive patterns 12; and separating individual circuit substrates 10 with, for example, a rotatable cutter.

Abstract translation: 在优选实施例中，提供了一种制造混合集成电路器件的方法，其中通过切割由单个金属衬底10A'制造多个电路衬底10。 在一些实施例中，该方法包括：制备在其顶表面上形成有绝缘层11的金属基底10A'; 在绝缘层11的顶表面上形成多个导电图案12; 在金属基板10B'的后表面上形成格子状的槽20; 将混合集成电路安装到导电图案12上; 并且用例如可旋转切割器分离各个电路基板10。