SEMICONDUCTOR DEVICE AND METHOD OF DRIVING THE SAME

    公开(公告)号:US20180350428A1

    公开(公告)日:2018-12-06

    申请号:US15873304

    申请日:2018-01-17

    Applicant: SK hynix Inc.

    Inventor: Dong-Ho KANG

    Abstract: A semiconductor device may include: a low-order bit storage block configured for storing N low-order bit signals contained in N access information signals based on an access address signal, the N access information signals indicating the numbers of accesses to N access target blocks, and generating an indication signal indicating whether a low-order bit signal corresponding to the current input access address signal among the N low-order bit signals has reached a predetermined value; a high-order bit storage block configured for storing M high-order bit signals contained in M access information signals among the N access information signals based on an allocation control signal; and a high-order bit control block configured for generating the allocation control signal corresponding to positions in which the M high-order bit signals are to be stored, based on the access address signal and the indication signal.

    SEMICONDUCTOR MEMORY DEVICE
    44.
    发明申请

    公开(公告)号:US20180261285A1

    公开(公告)日:2018-09-13

    申请号:US15861701

    申请日:2018-01-04

    Abstract: A semiconductor memory device for suppressing a decrease of durability caused by erasure of a block unit or programming of a word unit is provided. A resistance change memory 100 includes a memory array 110 and a controller 120. The memory array 110 stores data by a reversible and nonvolatile variable resistance element. When erasing a selected block of the memory array 110 in response to an external erasure command, the controller 120 sets an EF flag indicating the selected block is in an erasure state without changing block data. The controller 120 further includes a reading unit. The reading unit outputs data of a selected word or data indicating the erasure based on the EF flag when reading the selected word of the memory array 110 in response to an external reading command.

    Integrated circuit using shaping and timing circuitries

    公开(公告)号:US10074410B2

    公开(公告)日:2018-09-11

    申请号:US15282532

    申请日:2016-09-30

    Applicant: ARM Limited

    Abstract: Various implementations described herein may refer to and may be directed to an integrated circuit using shaping and timing circuitries. In one implementation, an integrated circuit may include memory that is accessed based on a voltage level on a first control line, and may include a control driver circuitry coupled to the first and a second control line that drives a first and a second control signal toward first or second voltage levels. The integrated circuit may include a shaper circuitry coupled to the control lines that includes a first clamping transistor that couples the first control line to a timed supply node in response to the driving of the second control signal toward the first voltage. The integrated circuit may include a timing circuitry coupled to the first shaper circuitry that includes a header transistor that couples the timed supply node to a voltage supply source.

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