公开(公告)号：US20180315519A1

公开(公告)日：2018-11-01

申请号：US15756629

申请日：2016-09-27

申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

发明人： Motohiko SUGIURA ,  Issei OKADA ,  Yoshio OKA ,  Kenji OHKI

IPC分类号： H01B1/22 ,  H05K3/38 ,  H01B1/12 ,  H05K3/46

CPC分类号： C09D1/00 ,  C09D5/24 ,  C09D7/40 ,  H01B1/22 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12

摘要： A coating liquid for forming a conductive layer according to an embodiment of the present invention contains fine metal particles, a dispersion medium, and a dispersant. The coating liquid has a pH of 4 or more and 8 or less, an electrical conductivity of 100 μS/cm or more and 800 μS/cm or less, and a content of the fine metal particles of 20% by mass or more and 80% by mass or less. A method for manufacturing a conductive layer according to another embodiment of the present invention is a method for manufacturing a conductive layer using a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersion medium, and a dispersant. The method includes an application step of applying the coating liquid for forming a conductive layer, and a heating step of heating the coating liquid for forming a conductive layer after application. At the time of the application, the coating liquid for forming a conductive layer has a pH of 4 or more and 8 or less, an electrical conductivity of 100 μS/cm or more and 800 μS/cm or less, and a content of the fine metal particles of 20% by mass or more and 80% by mass or less.

公开(公告)号：US20180312703A1

公开(公告)日：2018-11-01

申请号：US16030846

申请日：2018-07-09

申请人： CAM Holding Corporation

发明人： Teresa Ramos ,  Lin Zhang ,  Lily Pay

IPC分类号： C09D11/03 ,  C09D5/00 ,  C09D5/24 ,  C09D11/033 ,  C09D7/40 ,  H01L31/18 ,  H01B1/22 ,  H01L31/0224 ,  C09D11/52

CPC分类号： C09D11/03 ,  B01F17/00 ,  C09D5/00 ,  C09D5/24 ,  C09D7/70 ,  C09D11/033 ,  C09D11/52 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/1884

摘要： Disclosed herein are purified surfactant formulations including purified short-chain fluorosurfactant and iodide additive and a two-part coating kit having the same and a silver nanowire formulation.

公开(公告)号：US20180308603A1

公开(公告)日：2018-10-25

申请号：US15763334

申请日：2016-09-23

申请人： DOWA Electronics Materials Co., Ltd.

发明人： Taku Okano ,  Noriaki Nogami ,  Yoshio Moteki

IPC分类号： H01B1/22 ,  H01B1/24 ,  C08L63/00 ,  C08K3/04 ,  C08K3/08

CPC分类号： H01B1/22 ,  C08K3/042 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2201/001 ,  C08L63/00 ,  H01B1/24

摘要： To provide a conductive paste including: a filler containing a silver powder and a graphite powder; a polymer; and a solvent, where a 1%-weight-reduction starting temperature of the graphite powder, which is determined through a thermogravimetry-differential thermal analysis method, is 300° C. or more but 640° C. or less.

公开(公告)号：US20180305562A1

公开(公告)日：2018-10-25

申请号：US15768131

申请日：2016-10-19

申请人： SOLVAY SA

发明人： Jung-Yul LEE

IPC分类号： C09D5/24 ,  H01B1/12 ,  H01B1/02 ,  H01B13/00 ,  H01B5/14 ,  C09D7/63 ,  C09D165/00

CPC分类号： C09D5/24 ,  C09D7/63 ,  C09D165/00 ,  H01B1/02 ,  H01B1/127 ,  H01B1/22 ,  H01B5/14 ,  H01B13/0036 ,  H01L51/0021 ,  H01L51/0037

摘要： The present invention concerns compositions comprising at least one metal nanowires, at least one π-conjugated conductive polymer, at least one particular neutralization agent, and at least one solvent. The compositions according to the present in vention can be used for forming a transparent conductor particularly useful in touch panel and display applications.

公开(公告)号：US20180304578A1

公开(公告)日：2018-10-25

申请号：US15768045

申请日：2016-10-13

申请人： Arkema France

发明人： Marc Audenaert ,  Denis Huze

IPC分类号： B32B5/26 ,  H01B1/22 ,  B32B27/34 ,  C08J5/04

CPC分类号： B32B5/26 ,  B32B5/022 ,  B32B5/024 ,  B32B5/026 ,  B32B27/34 ,  B32B2262/02 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2262/14 ,  B32B2264/0264 ,  B32B2307/202 ,  B32B2307/212 ,  B32B2419/00 ,  B32B2605/08 ,  B32B2605/18 ,  C08J5/042 ,  C08J5/24 ,  C08J2377/00 ,  C08K2003/0806 ,  C23C16/06 ,  H01B1/22 ,  C08K3/08 ,  C08L77/02

摘要： The present invention relates to a method for producing a conductive composite material, as well as the composite material capable of being obtained by said method. The conductive material is obtained from a composite polymer matrix, which is formed by aggregation of composite conductive particles consisting of particles of a polymer matrix, having a diamter d50 of between 1 and 4000 μm, coated with a layer of electrically conductive material consisting of at least one metal. The ratio of the thickness of the conductive layer to the diameter d50 of the polymer matrix particles is between 0.0025:100 and 1.5:100, said thickness being less than 300 nm.

公开(公告)号：US10079079B1

公开(公告)日：2018-09-18

申请号：US14727252

申请日：2015-06-01

申请人： Rhode Island Board of Education, State of Rhode Island and Providence Plantations

发明人： Nicholas Heeder ,  Arun Shukla

IPC分类号： H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01B13/00 ,  B05D3/00

CPC分类号： H01B1/24 ,  B01J2/22 ,  H01B1/20 ,  H01B1/22

摘要： A flexible, electrically conductive composite is disclosed that includes a plurality of particles of elastomeric material and a conductive material. The conductive material at least partially covers the plurality of particles of elastomeric material. A first portion of the composite has undergone a force that has deformed a first portion of the particles of elastomeric material and broken up the conductive coating material.

公开(公告)号：US10074454B2

公开(公告)日：2018-09-11

申请号：US15937980

申请日：2018-03-28

申请人： TESLA NANOCOATINGS, INC.

发明人： Jorma Antero Virtanen ,  Todd Hawkins

IPC分类号： H01B1/22 ,  H01B1/24 ,  C09D5/03 ,  C09D5/10 ,  C09D163/00 ,  C09D5/24 ,  B05D5/12 ,  C23F11/18 ,  C08K3/04 ,  C08K3/08 ,  C09D101/02 ,  C09D197/00 ,  C23C30/00 ,  C08K3/014 ,  B82Y30/00

CPC分类号： H01B1/22 ,  B05D5/12 ,  B82Y30/00 ,  C08K3/014 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K3/044 ,  C08K3/08 ,  C08K5/0008 ,  C08K2003/0843 ,  C08K2003/0862 ,  C08L97/005 ,  C09D5/038 ,  C09D5/10 ,  C09D5/103 ,  C09D5/106 ,  C09D5/24 ,  C09D7/70 ,  C09D101/02 ,  C09D163/00 ,  C09D197/005 ,  C23C30/005 ,  C23F11/18 ,  H01B1/24 ,  C08L1/02

摘要： The composition described herein for the prevention of corrosion comprises: sacrificial metal particles more noble than a metal substrate to which the composition contacts; carbonaceous material that can form electrical contact between the sacrificial metal particles; and means for providing an anticorrosion coating material for the metal substrate. The composition can form a coating on a metal substrate surface. A method for applying the composition for the prevention of corrosion is also described herein.

公开(公告)号：US10062473B2

公开(公告)日：2018-08-28

申请号：US14372789

申请日：2013-01-15

申请人： DOWA ELECTRONICS MATERIALS CO., LTD.

发明人： Kenichi Inoue ,  Kozo Ogi ,  Atsushi Ebara ,  Yuto Hiyama ,  Takahiro Yamada ,  Toshihiko Ueyama

IPC分类号： H01B1/22 ,  B22F1/02 ,  C22C9/00 ,  C22C9/04 ,  C22C9/06 ,  H01B1/02 ,  B22F1/00 ,  C22C1/04 ,  C22C5/06 ,  B22F9/08

CPC分类号： H01B1/22 ,  B22F1/0011 ,  B22F1/0074 ,  B22F1/025 ,  B22F9/082 ,  C22C1/0425 ,  C22C5/06 ,  C22C9/04 ,  C22C9/06 ,  H01B1/026 ,  Y10T428/2991

摘要： A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 μm), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.

公开(公告)号：US20180242451A1

公开(公告)日：2018-08-23

申请号：US15439754

申请日：2017-02-22

申请人： XEROX CORPORATION

发明人： Naveen CHOPRA ,  Barkev KEOSHKERIAN ,  Chad Steven SMITHSON ,  Kurt I. HALFYARD ,  Michelle N. CHRETIEN

IPC分类号： H05K1/09 ,  C09D11/52 ,  C09D11/30 ,  C09D11/03 ,  H05K1/03 ,  H01L23/00 ,  H01L23/498

CPC分类号： H05K1/097 ,  C09D11/03 ,  C09D11/037 ,  C09D11/30 ,  C09D11/52 ,  H01B1/02 ,  H01B1/16 ,  H01B1/22 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29239 ,  H01L2224/32227 ,  H01L2224/75155 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/14 ,  H05K3/3431 ,  H05K3/3457 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0257

摘要： The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

公开(公告)号：US10052690B2

公开(公告)日：2018-08-21

申请号：US15364843

申请日：2016-11-30

申请人： Murata Manufacturing Co., Ltd.

发明人： Shinichi Tsugimoto

IPC分类号： H01B1/22 ,  B22F1/00 ,  H01B1/00 ,  H01B5/14 ,  H05K1/09 ,  C03C3/04 ,  C03C4/14 ,  C03C8/02 ,  C03C8/18 ,  C09D1/00 ,  C09D5/24 ,  H05B3/12 ,  H05B3/84 ,  B22F7/04 ,  C22C29/00 ,  C03C14/00 ,  C03C17/04 ,  B22F9/08

CPC分类号： B22F1/0014 ,  B22F7/04 ,  B22F9/082 ,  B22F2007/047 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2301/255 ,  B22F2302/253 ,  B22F2302/256 ,  B22F2304/10 ,  C03C3/04 ,  C03C4/14 ,  C03C8/02 ,  C03C8/18 ,  C03C14/006 ,  C03C17/04 ,  C03C2204/00 ,  C03C2207/00 ,  C03C2214/08 ,  C03C2217/452 ,  C03C2217/479 ,  C09D1/00 ,  C09D5/24 ,  C22C29/00 ,  H01B1/00 ,  H01B1/22 ,  H01B5/14 ,  H05B3/12 ,  H05B3/84 ,  H05B2203/005 ,  H05B2203/011 ,  H05B2203/017 ,  H05K1/0212 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K1/167 ,  H05K2201/0272

摘要： A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder contains a noble metal powder such as an Ag powder and a base metal powder containing Cu and/or Ni, and the base metal powder has a specific surface area of less than 0.5 m2/g. The content of the base metal powder with respect to the total amount of the conductive powder is, in ratio by weight, 0.1 to 0.3 when the base metal powder contains Cu as its main constituent, 0.1 to 0.2 when the base metal powder contains Ni as its main constituent, and 0.1 to 0.25 when the base metal powder contains a mixed powder of Cu and Ni as its main constituent.