公开(公告)号：US20190006457A1

公开(公告)日：2019-01-03

申请号：US15638044

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Kristof Darmawikarta ,  Robert Alan May ,  Sandeep Gaan

IPC: H01L49/02 ,  H01L23/522

Abstract: A semiconductor device may include a plurality of layers of a substrate. A die may be coupled to at least one of the plurality of layers of the substrate. A passive electrical component may be integrally formed within the layers of the substrate. The passive electrical component may be a resistor or a capacitor. One or more conductors may be configured to allow electrical communication between the passive electrical component and the die. The one or more conductors may be integrally formed within the plurality of layers of the substrate.

公开(公告)号：US10121679B1

公开(公告)日：2018-11-06

申请号：US15721384

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Kristof Darmawikarta ,  Arnab Sarkar ,  Hiroki Tanaka ,  Robert A. May ,  Sri Ranga Sai Boyapati

IPC: H01L23/532 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: Embodiments of the present disclosure may relate to a package substrate that may include a layer having a layer surface that is planarized and a via within the layer, where the via includes a via surface that is exposed on the layer surface, and where the via surface is planarized. The package substrate may further include a bond pad on the layer surface, where a first thickness of the bond pad includes a seed layer on the via surface, and where a second thickness of the bond pad includes a plating stack on the seed layer. Other embodiments may be described or claimed.

公开(公告)号：US20180188771A1

公开(公告)日：2018-07-05

申请号：US15398608

申请日：2017-01-04

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Sasha N. Oster ,  Aleksandar Aleksov ,  Braxton Lathrop ,  Racquel L. Fygenson

IPC: G06F1/16 ,  H05K3/06

CPC classification number: G06F1/163 ,  G06F1/1656 ,  H05K1/0283 ,  H05K1/038 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3463 ,  H05K2201/0314 ,  H05K2203/1311 ,  H05K2203/1383

Abstract: Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device. This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.

公开(公告)号：US20180026730A1

公开(公告)日：2018-01-25

申请号：US15676611

申请日：2017-08-14

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Sasha N. Oster ,  Feras Eid ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Kumar Ranganathan ,  Wen-Ling M. Huang

IPC: H04B13/00 ,  A61M5/142 ,  A61B5/00 ,  A61B5/145 ,  A61N1/04 ,  A61B5/11 ,  A61B5/0402 ,  A61B5/01 ,  H04B5/00 ,  A61N7/00 ,  A61B5/021

CPC classification number: H04B13/005 ,  A61B5/0024 ,  A61B5/01 ,  A61B5/0205 ,  A61B5/021 ,  A61B5/0402 ,  A61B5/0432 ,  A61B5/1102 ,  A61B5/1107 ,  A61B5/1121 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/4839 ,  A61B5/4869 ,  A61B5/6833 ,  A61F7/007 ,  A61M5/14248 ,  A61N1/0484 ,  A61N1/0492 ,  A61N1/3603 ,  A61N7/00 ,  H04B5/0012

Abstract: Discussed generally herein are methods and devices including or providing a patch system that can help in diagnosing a medical condition and/or provide therapy to a user. A body-area network can include a plurality of communicatively coupled patches that communicate with an intermediate device. The intermediate device can provide data representative of a biological parameter monitored by the patches to proper personnel, such as for diagnosis and/or response.

公开(公告)号：US20170361390A1

公开(公告)日：2017-12-21

申请号：US15676679

申请日：2017-08-14

Applicant: Intel Corporation

Inventor： Ting Zhong ,  Rajashree Raji Baskaran ,  Aleksandar Aleksov

IPC: B23K1/20 ,  B23K35/30 ,  B23K35/26 ,  B23K1/00 ,  B23K3/08 ,  B23K3/06 ,  B23K35/02 ,  B23K35/24 ,  B23K101/42

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K1/206 ,  B23K3/0623 ,  B23K3/08 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/26 ,  B23K35/302 ,  B23K35/3033 ,  B23K2101/42

Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.

公开(公告)号：US09775763B2

公开(公告)日：2017-10-03

申请号：US13719336

申请日：2012-12-19

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Brian S. Doyle ,  Ravindranath V. Mahajan

IPC: A61H1/02 ,  A61H3/00

CPC classification number: A61H1/024 ,  A61H1/0244 ,  A61H1/0266 ,  A61H1/0277 ,  A61H1/0281 ,  A61H1/0285 ,  A61H1/0288 ,  A61H1/0296 ,  A61H3/00 ,  A61H2201/1609 ,  A61H2201/1614 ,  A61H2201/1628 ,  A61H2201/1635 ,  A61H2201/164 ,  A61H2201/165 ,  A61H2201/5002 ,  A61H2201/501 ,  A61H2201/5097 ,  A61H2230/605

Abstract: Exoskeleton technology is described herein. Such technology includes but is not limited to exoskeletons, exoskeleton controllers, methods for controlling an exoskeleton, and combinations thereof. The exoskeleton technology may facilitate, enhance, and/or supplant the natural mobility of a user via a combination of sensor elements, processing/control elements, and actuating elements. User movement may be elicited by electrical stimulation of the user's muscles, actuation of one or more mechanical components, or a combination thereof. In some embodiments, the exoskeleton technology may adjust in response to measured inputs, such as motions or electrical signals produced by a user. In this way, the exoskeleton technology may interpret known inputs and learn new inputs, which may lead to a more seamless user experience.

公开(公告)号：US20170164461A1

公开(公告)日：2017-06-08

申请号：US14962692

申请日：2015-12-08

Applicant: Intel Corporation

Inventor： Braxton Lathrop ,  Sasha Oster ,  Aleksandar Aleksov ,  Nadine L. Dabby

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/12 ,  H05K1/03

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/11 ,  H05K3/0058 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/1275 ,  H05K3/281 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2203/0191 ,  H05K2203/1545

Abstract: Apparatus and methods are provided for flexible, stretchable, wearable electronics. In an example, an apparatus for providing flexible and stretchable conductors can include a first elastomer layer, conductive ink applied to the first elastomer layer, and an adhesive layer, in cooperation with the first elastomer layer, configured to encapsulate the conductive ink, the adhesive layer further configured to allow the apparatus to be attached to a second apparatus.

公开(公告)号：US09564408B2

公开(公告)日：2017-02-07

申请号：US14229405

申请日：2014-03-28

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Johanna M. Swan

IPC: H01L23/49 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/03 ,  H01L24/06 ,  H01L24/17 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/81801 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2924/00014

Abstract: An apparatus including a planar semiconductor substrate including a plurality of devices and a first pattern of electrical contacts formed on the first surface of the semiconductor substrate; and a plurality of layers of conductive material alternating between dielectric material on the first surface of the semiconductor substrate, the plurality of layers of conductive material including a wiring layer including a second pattern of electrical contacts, wherein the second surface of the semiconductor substrate includes openings to the first pattern of electrical contacts. A method including forming a space transformer including a semiconductor substrate including, on a device side, a device region, a first pattern of electrical contacts, and at least one routing layer and a pad layer including a second pattern of electrical contacts; and forming openings through the space transformer to the first pattern of electrical contacts on the semiconductor substrate.

Abstract translation: 一种包括形成在所述半导体衬底的所述第一表面上的多个器件的平面半导体衬底和电接触的第一图案的设备; 以及在所述半导体衬底的所述第一表面上的电介质材料之间交替的多层导电材料，所述多层导电材料包括包括第二电接触图案的布线层，其中所述半导体衬底的所述第二表面包括开口 到第一个电触点模式。 一种包括形成包括半导体衬底的空间变换器的方法，该半导体衬底在器件侧包括器件区域，第一电接触图案，以及至少一个布线层和包括第二电触点图案的衬垫层; 以及通过所述空间变压器形成到所述半导体衬底上的所述第一图形的电触点的开口。

公开(公告)号：US20160284630A1

公开(公告)日：2016-09-29

申请号：US14653033

申请日：2014-07-11

Applicant: INTEL CORPORATION

Inventor： Alejandro Levander ,  Tatyana Andryushchenko ,  David Staines ,  Mauro Kobrinsky ,  Aleksandar Aleksov ,  Dilan Seneviratne ,  Javier Soto Gonzalez ,  Srinivas Pietambaram ,  Rafiqul Islam

IPC: H01L23/498 ,  H01L21/56 ,  H01L25/00 ,  H01L23/31 ,  H01L21/78 ,  H01L21/683 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/4985 ,  B23B5/16 ,  B32B27/08 ,  B32B27/283 ,  B32B2307/54 ,  B32B2307/7265 ,  B32B2439/00 ,  B32B2457/00 ,  H01L21/4846 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/48 ,  H01L24/85 ,  H01L24/96 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/48227 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/85801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/0715 ,  H01L2924/15747 ,  H01L2924/15791 ,  H05K1/0283 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: Generally discussed herein are systems and methods that can include a stretchable and bendable device. According to an example a method can include (1) depositing a first elastomer material on a panel, (2) laminating trace material on the elastomer material, (3) processing the trace material to pattern the trace material into one or more traces and one or more bond pads, (4) attaching a die to the one or more bond pads, or (5) depositing a second elastomer material on and around the one or more traces, the bonds pads, and the die to encapsulate the one or more traces and the one or more bond pads in the first and second elastomer materials.

Abstract translation: 这里通常讨论的是可以包括可拉伸和可弯曲装置的系统和方法。 根据一个实例，一种方法可以包括（1）在面板上沉积第一弹性体材料，（2）在弹性体材料上层叠微量材料，（3）处理微量材料以将痕量材料图案化成一个或多个迹线 或更多的接合垫，（4）将管芯附接到所述一个或多个接合焊盘，或（5）在所述一个或多个迹线上和周围沉积第二弹性体材料，所述接合焊盘和所述管芯以将所述一个或多个 迹线和第一和第二弹性体材料中的一个或多个接合焊盘。

公开(公告)号：US09323327B2

公开(公告)日：2016-04-26

申请号：US13726078

申请日：2012-12-22

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Ravindranath V. Mahajan ,  Brian S. Doyle

IPC: G06F3/01 ,  G06F3/041 ,  G06F3/0481

CPC classification number: G06F3/016 ,  G06F3/014 ,  G06F3/0412 ,  G06F3/04812 ,  G06F3/0488

Abstract: A system and method for providing tactile feedback in a user interface. The system includes a tactile feedback assembly configured to communicate with a user interface of an electronic device. The tactile feedback assembly is configured to provide mechanical and/or nerve stimulation to a user during user interaction (e.g. navigation, input of data, etc.) of the user interface. The mechanical and/or nerve stimulation is configured to provide a user with tactile sensation (in the form of the sense of touch) in response to user interaction with the user interface, including, but not limited to, sense of texture and sense of pressure.

Abstract translation: 一种用于在用户界面中提供触觉反馈的系统和方法。 该系统包括被配置为与电子设备的用户界面通信的触觉反馈组件。 触觉反馈组件被配置为在用户界面的用户交互（例如，导航，数据输入等）期间向用户提供机械和/或神经刺激。 机械和/或神经刺激被配置为响应于用户与用户界面的交互而向用户提供触觉（以触觉的形式），包括但不限于纹理感和压力感 。