公开(公告)号：US08076998B2

公开(公告)日：2011-12-13

申请号：US12466704

申请日：2009-05-15

申请人： Kang-Wook Bong ,  Han Kim ,  Dae-Hyun Park

发明人： Kang-Wook Bong ,  Han Kim ,  Dae-Hyun Park

IPC分类号： H03H7/00

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure that blocks a noise of a certain frequency band can include 4 or more conductive plates, a first stitching via, which electrically connects any two of the conductive plates with each other by having a part of the first stitching via pass through a planar surface that is different from a planar surface of the conductive plates, a second stitching via, which electrically connects another two of the conductive plates with each other by having a part of the second stitching via pass through a planar surface that is different from a planar surface of the conductive plates, and a stitching via chain, which electrically connects the first stitching via and the second stitching via with each other.

摘要翻译： 公开了电磁带隙结构。 根据本发明的实施例，阻挡一定频带噪声的电磁带隙结构可以包括4个或更多个导电板，第一缝合通孔，其通过以下方式将任何两个导电板彼此电连接： 第一缝合线的一部分穿过不同于导电板的平坦表面的平面表面;第二缝合通孔，其通过具有第二缝合通孔的一部分将另外两个导电板彼此电连接 穿过不同于导电板的平坦表面的平坦表面，以及缝合通孔链，其将第一缝合通孔和第二缝合通孔彼此电连接。

公开(公告)号：US20100127790A1

公开(公告)日：2010-05-27

申请号：US12466704

申请日：2009-05-15

申请人： Kang-Wook Bong ,  Han Kim ,  Dae-Hyun Park

发明人： Kang-Wook Bong ,  Han Kim ,  Dae-Hyun Park

IPC分类号： H04B3/28

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure that blocks a noise of a certain frequency band can include 4 or more conductive plates, a first stitching via, which electrically connects any two of the conductive plates with each other by having a part of the first stitching via pass through a planar surface that is different from a planar surface of the conductive plates, a second stitching via, which electrically connects another two of the conductive plates with each other by having a part of the second stitching via pass through a planar surface that is different from a planar surface of the conductive plates, and a stitching via chain, which electrically connects the first stitching via and the second stitching via with each other.

摘要翻译： 公开了电磁带隙结构。 根据本发明的实施例，阻挡一定频带噪声的电磁带隙结构可以包括4个或更多个导电板，第一缝合通孔，其通过以下方式将任何两个导电板彼此电连接： 第一缝合线的一部分穿过不同于导电板的平坦表面的平面表面;第二缝合通孔，其通过具有第二缝合通孔的一部分将另外两个导电板彼此电连接 穿过不同于导电板的平坦表面的平坦表面，以及缝合通孔链，其将第一缝合通孔和第二缝合通孔彼此电连接。

公开(公告)号：US20090322450A1

公开(公告)日：2009-12-31

申请号：US12270403

申请日：2008-11-13

申请人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H01P1/203 ,  H01P3/08

CPC分类号： H01P1/20345 ,  H01P1/2005 ,  H05K1/0236 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers.

摘要翻译： 公开了一种电磁带隙结构及其印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括放置在两个导电层之间的多个导电层; 以及缝合通孔，其经配置以在所述导电层的任何两个导电层之间形成电连接。 这里，缝合通孔可以包括第一通孔，第一通孔的一个端部构造成两个导电板中的任何一个; 第二通孔，所述第二通孔的一端部被配置为所述两个导电板中的另一个; 以及在两个导电层之间放置在与导电板不同的平面上的连接图案，并且被配置为在第一通孔的另一端部和第二通孔的另一端部之间形成电连接。 可以形成第一通孔和第二通孔中的任何一个以穿透与两个导电层中的至少一个相同的平面表面。

公开(公告)号：US20090084582A1

公开(公告)日：2009-04-02

申请号：US12010750

申请日：2008-01-29

申请人： Han Kim ,  Hyung-Sik Choi ,  Dae-Hyun Park

发明人： Han Kim ,  Hyung-Sik Choi ,  Dae-Hyun Park

IPC分类号： H05K1/00

CPC分类号： H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2201/09745

摘要： A printed circuit board having a stepped conduction layer is disclosed. In one embodiment of the invention, a printed circuit board is provided in which at least one conduction layer configured for use as a signal transmission layer is divided into at least two base regions and at least one connecting region connecting any adjacent two of the base regions, where the connecting region is stepped to a lower height than those of the base regions. The stepped conduction layer in the printed circuit board can be used to resolve the problem of mixed signals in a printed circuit board equipped with various parts and components, including an analog circuit and digital circuit, etc.

摘要翻译： 公开了一种具有台阶导电层的印刷电路板。 在本发明的一个实施例中，提供一种印刷电路板，其中被配置为用作信号传输层的至少一个导电层被分成至少两个基极区域和连接任何相邻的两个基极区域的至少一个连接区域 ，其中连接区域被阶梯到比基部区域的高度更低的高度。 可以使用印刷电路板中的阶梯式导电层来解决配备有各种部件的印刷电路板中的混合信号的问题，包括模拟电路和数字电路等。

公开(公告)号：US20090015354A1

公开(公告)日：2009-01-15

申请号：US12216629

申请日：2008-07-08

申请人： Han Kim ,  Dae-Hyun Park

发明人： Han Kim ,  Dae-Hyun Park

IPC分类号： H01P1/00 ,  H05K1/11 ,  H05K3/42

CPC分类号： H01Q15/008 ,  H01P1/2005 ,  H01Q15/006 ,  H05K1/0236 ,  H05K1/0237 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09663 ,  H05K2201/09718 ,  Y10T29/49165

摘要： An electromagnetic bandgap structure and a printed circuit board including it as well as a method of manufacturing thereof that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. The electromagnetic bandgap structure in accordance with an embodiment of the present invention can include: a first metal layer; a first dielectric layer, stacked on the first metal layer; a metal plate, stacked on the first dielectric layer; a second dielectric layer, stacked on the metal plate and the first dielectric layer; a second metal layer, stacked on the second dielectric layer; and a via, directed from the metal plate to the first metal layer and the second metal layer. The via can be connected to the first metal layer and is not connected the second metal layer.

摘要翻译： 公开了电磁带隙结构和包括它的印刷电路板及其制造方法，其可以解决模拟电路和数字电路之间的混合信号问题。 根据本发明的实施例的电磁带隙结构可以包括：第一金属层; 第一介电层，堆叠在第一金属层上; 金属板，堆叠在第一介电层上; 第二电介质层，堆叠在所述金属板和所述第一介电层上; 第二金属层，堆叠在第二介电层上; 以及从金属板引导到第一金属层和第二金属层的通孔。 通孔可以连接到第一金属层，并且不连接到第二金属层。

公开(公告)号：US08432706B2

公开(公告)日：2013-04-30

申请号：US12654541

申请日：2009-12-22

申请人： Han Kim ,  Chang-Sup Ryu

发明人： Han Kim ,  Chang-Sup Ryu

IPC分类号： H05K1/11

CPC分类号： H05K1/0237 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01Q1/526 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/183 ,  H05K9/0009 ,  H05K9/0052 ,  H05K2201/09681 ,  H05K2201/10371

摘要： A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

摘要翻译： 公开了印刷电路板和电子产品。 根据本发明的实施例，印刷电路板包括：第一板，其上安装有电子部件;第二板，其位于第一板的上侧，并且覆盖至少一部分 第一板的上表面，并且其中EBG结构插入到第二板中，使得从第一板向上辐射的噪声被屏蔽。 因此，印刷电路板可以容易地吸收各种频率，容易应用而没有任何天线效应，并且在制造中是成本有效的。

公开(公告)号：US08368488B2

公开(公告)日：2013-02-05

申请号：US12155941

申请日：2008-06-11

申请人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： H01P1/203

CPC分类号： H05K1/116 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2224/0401

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构层叠有第一金属层，第一介电层，金属板，第二介电层和第二金属层，并且可以串联奇数个通孔 通过第一金属层和金属板之间的金属线连接。 该电磁带隙结构可以具有小尺寸和低带隙频率。

公开(公告)号：US20110315440A1

公开(公告)日：2011-12-29

申请号：US13137632

申请日：2011-08-30

申请人： Han Kim

发明人： Han Kim

IPC分类号： H05K1/11

CPC分类号： H01P1/2005 ,  H01Q15/006 ,  H01Q15/008 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/0969

摘要： An electromagnetic bandgap structure and a printed circuit board that have a mushroom type structure. The electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, layer-built on the first metal layer; a mushroom type structure having a metal plate layer-built on the first dielectric layer and a via of which one end is connected to the metal plate; a second dielectric layer, layer-built on the metal plate and the first dielectric layer; and a second metal layer, layer-built on the second dielectric layer, wherein the other end of the via is placed in a hole formed on the first metal layer and is connected to the first metal layer through a metal line.

摘要翻译： 具有蘑菇型结构的电磁带隙结构和印刷电路板。 电磁带隙结构包括第一金属层; 第一电介质层，其被构建在第一金属层上; 具有建立在第一电介质层上的金属板层的蘑菇型结构和其一端连接到金属板的通孔; 第二电介质层，层叠在金属板和第一介电层上; 以及第二金属层，其构造在所述第二电介质层上，其中所述通孔的另一端位于形成在所述第一金属层上的孔中，并且通过金属线连接到所述第一金属层。

公开(公告)号：US20110197409A1

公开(公告)日：2011-08-18

申请号：US13064847

申请日：2011-04-20

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H01G7/00

CPC分类号： H05K1/162 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric layer, placed between the two conductive layers, the method including: removing an upper conductive layer and the first dielectric layer excluding a lower conductive layer of the two conductive layers to allow a cavity to be formed between the two conductive layers, the lower conductive layer being supposed to be used as any one of electrodes of the cavity capacitor; stacking a dielectric material on the cavity to allow a second dielectric layer having a lower stepped portion than the first dielectric layer to be formed in the cavity; and stacking a conductive material on an upper part of the second dielectric layer and side parts of the cavity to allow the upper conductive layer to be used as the other electrode of the cavity capacitor.

摘要翻译： 一种嵌入在印刷电路板中的空腔电容器的方法，包括分别用作功率层和接地层的两个导电层和放置在两个导电层之间的第一介电层，所述方法包括： 上导电层和除了两个导电层的下导电层之外的第一电介质层，以允许在两个导电层之间形成腔，下导电层假定用作空腔电容器的任一电极; 在所述空腔上堆叠电介质材料以允许在所述空腔中形成具有比所述第一电介质层更低的台阶部分的第二电介质层; 并且在第二电介质层的上部和空腔的侧部上堆叠导电材料，以允许上部导电层用作空腔电容器的另一个电极。

公开(公告)号：US07888599B2

公开(公告)日：2011-02-15

申请号：US12203081

申请日：2008-09-02

申请人： Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Woo Lim Chae ,  Han Kim

发明人： Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Woo Lim Chae ,  Han Kim

IPC分类号： H05K1/00

CPC分类号： H05K1/162 ,  H05K3/0047 ,  H05K3/427 ,  H05K2201/0187 ,  H05K2201/09645 ,  H05K2201/09836 ,  H05K2201/09981 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49156

摘要： Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.

摘要翻译： 公开了一种包括嵌入式电容器的PCB及其制造方法。 长的嵌入式电容器通过绝缘层形成，使得高电容和各种电容设计成为可能。