公开(公告)号：US20070175024A1

公开(公告)日：2007-08-02

申请号：US11701502

申请日：2007-02-02

申请人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae

发明人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae

IPC分类号： H05K3/30

CPC分类号： H05K3/303 ,  H01L2224/95146 ,  H05K13/0404 ,  H05K13/0469 ,  H05K2201/10636 ,  H05K2203/0776 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53265 ,  Y10T29/53539

摘要： A pickup device comprising a pickup surface to which an electronic component retaining liquid is to be applied and capable of adjusting a wet area of the electronic component retaining liquid on the pickup surface is prepared, and the electronic component retaining liquid is applied to the pickup surface in a first step. The electronic component is retained on the pickup surface via the electronic component retaining liquid in a state where the wet area is extended in a second step.

摘要翻译： 准备拾取装置，该拾取装置包括拾取表面，待拾取表面上的电子部件保留液体，并且能够调整电子部件保持液在拾取表面上的湿润区域，并将电子部件保持液施加到拾取表面 在第一步。 在第二步骤中，在湿区域延伸的状态下，电子部件经由电子部件保持液保持在拾取面上。

公开(公告)号：US20070224735A1

公开(公告)日：2007-09-27

申请号：US11750617

申请日：2007-05-18

申请人： Seiji Karashima ,  Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Takashi Ichiryu

发明人： Seiji Karashima ,  Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Takashi Ichiryu

IPC分类号： H01L21/82

CPC分类号： G02B6/4249 ,  G02B6/3608 ,  G02B6/3636 ,  G02B6/3668 ,  G02B6/3676 ,  G02B6/3692 ,  G02B6/4214 ,  H05K1/0274 ,  H05K2203/167

摘要： A fabrication method for an optical transmission channel board includes a first step of forming on a substrate a layer containing an electrically conductive material, and a second step of patterning said layer containing an electrically conductive material formed on said substrate, and thereby forming circuit patterns at least a part of which is used as an electric circuit and at least a part of which positionally regulates an optical transmission channel.

摘要翻译： 用于光传输通道板的制造方法包括在衬底上形成含有导电材料的层的第一步骤，以及第二步骤，使包含形成在所述衬底上的导电材料的层的图案化，从而形成电路图案 其中至少一部分用作电路，其中至少一部分位置地调节光传输通道。

公开(公告)号：US07242823B2

公开(公告)日：2007-07-10

申请号：US11041101

申请日：2005-01-21

申请人： Seiji Karashima ,  Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Takashi Ichiryu

发明人： Seiji Karashima ,  Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Takashi Ichiryu

IPC分类号： G02B6/12 ,  H01L29/00

CPC分类号： G02B6/4249 ,  G02B6/3608 ,  G02B6/3636 ,  G02B6/3668 ,  G02B6/3676 ,  G02B6/3692 ,  G02B6/4214 ,  H05K1/0274 ,  H05K2203/167

摘要： An optical transmission board is provided. The optical transmission board includes an optical transmission channel, a retention board for retaining the optical transmission channel and circuit patterns. The circuit patterns are formed on the retention board and a part of the circuit patterns is used as an electric circuit. The optical transmission channel is positionally regulated by the part of the circuit patterns.

摘要翻译： 提供一种光传输板。 光传输板包括光传输通道，用于保持光传输通道和电路图案的保持板。 电路图案形成在保持板上，一部分电路图形用作电路。 光传输通道由电路图案的一部分位置调节。

公开(公告)号：US20050168960A1

公开(公告)日：2005-08-04

申请号：US11043123

申请日：2005-01-27

申请人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama

发明人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama

IPC分类号： H01L21/68 ,  H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H05K1/00 ,  H05K1/18 ,  H05K3/20 ,  H05K3/40

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/49805 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K1/183 ,  H05K1/187 ,  H05K3/20 ,  H05K3/403 ,  H05K2203/302 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component 100 includes an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface; and an electronic component 32 which is disposed within the sheet substrate.

摘要翻译： 提供具有内置部件的模块，其可以在没有通孔形成步骤的情况下制造。 具有内置部件100的模块包括绝缘片基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c; 至少一个布线20，其通过侧表面从上表面延伸到下表面; 以及设置在片状基板内的电子部件32。

公开(公告)号：US08501583B2

公开(公告)日：2013-08-06

申请号：US12497996

申请日：2009-07-06

申请人： Takashi Kitae ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

发明人： Takashi Kitae ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

IPC分类号： H01L21/30 ,  H01L21/4763

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/0695 ,  H01L2924/05432 ,  H01L2924/0001

摘要： A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates.

摘要翻译： 在每个具有多个电极的基板之间的空间中提供含有导电颗粒和气泡发生剂的树脂。 然后将树脂加热以熔化包含在树脂中的导电颗粒，并从气泡发生剂产生气泡。 在至少一个基板上形成台阶部。 在加热树脂的过程中，通过生长的气泡将树脂推开，其结果是，包含在树脂中的导电颗粒被引导到电极之间的空间，并且在空间中形成连接器 。 同时，树脂被引导到形成台阶部分的基板的部分之间的空间，并固化以固定基板之间的距离。

公开(公告)号：US07820021B2

公开(公告)日：2010-10-26

申请号：US12078891

申请日：2008-04-08

申请人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： C25B9/00 ,  C25C7/00 ,  C25D17/00 ,  B22D37/00 ,  B22D39/00 ,  B22D41/00 ,  B22D45/00 ,  H01L21/00

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83047 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2225/06513 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/087 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

摘要： A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a method for connecting substrates are provided. A circuit board 10 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 21 are disposed in mutually facing relation and a resin 13 containing conductive particles 12 and a gas bubble generating agent is supplied into the space therebetween. In this state, the resin 13 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 13. The resin 13 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof. The resin 13 pushed to the outside is self-assembled in the form of columns between the respective terminals of the circuit board 10 and the semiconductor chip 20. In this state, by pressing the semiconductor chip 20 against the circuit board 10, the conductive particles 12 contained in the resin 13 self-assembled between the facing terminals are brought into contact with each other to provide electrical connection between the terminals.

摘要翻译： 提供了一种适用于下一代LSI的倒装芯片安装并且生产率和可靠性高的倒装芯片安装方法以及用于连接基板的方法。 具有多个连接端子11的电路板10和具有多个电极端子21的半导体芯片20以相互面对的关系设置，并且将含有导电粒子12和气泡发生剂的树脂13供给到它们之间的空间中。 在这种状态下，树脂13被加热，从包含在树脂13中的气泡产生剂产生气泡30.树脂13通过其生长被推向产生的气泡30的外部。 被推到外面的树脂13以电路板10的各个端子和半导体芯片20之间的列的形式自组装。在这种状态下，通过将半导体芯片20压靠在电路板10上，导电颗粒 包含在自组装在相对端子之间的树脂13中的12彼此接触以提供端子之间的电连接。

公开(公告)号：US07714444B2

公开(公告)日：2010-05-11

申请号：US12424867

申请日：2009-04-16

申请人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： H01L23/52

CPC分类号： H05K3/3484 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/3613 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29311 ,  H01L2924/00014 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/16225

摘要： The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.

摘要翻译： 本发明提供一种导电树脂组合物，用于电连接电极，其中金属颗粒分散在流动介质中，其中流动介质包括与金属颗粒相比具有较高润湿性的第一流动介质和具有相对较高的第二流动介质 与金属颗粒的低润湿性，以及第一流动介质和第二流动介质在彼此不相容的状态下分散。 因此，提供了可以应用于LSI的倒装芯片封装并且具有高生产率和高可靠性的倒装芯片封装方法。

公开(公告)号：US20100007033A1

公开(公告)日：2010-01-14

申请号：US12497996

申请日：2009-07-06

申请人： Takashi KITAE ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

发明人： Takashi KITAE ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

IPC分类号： H01L23/48 ,  H01L21/56 ,  H05K1/14

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/0695 ,  H01L2924/05432 ,  H01L2924/0001

摘要： A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates.

摘要翻译： 在每个具有多个电极的基板之间的空间中提供含有导电颗粒和气泡发生剂的树脂。 然后将树脂加热以熔化包含在树脂中的导电颗粒，并从气泡发生剂产生气泡。 在至少一个基板上形成台阶部。 在加热树脂的过程中，通过生长的气泡将树脂推开，其结果是，包含在树脂中的导电颗粒被引导到电极之间的空间，并且在空间中形成连接器 。 同时，树脂被引导到形成台阶部分的基板的部分之间的空间，并固化以固定基板之间的距离。

公开(公告)号：US20090229120A1

公开(公告)日：2009-09-17

申请号：US12280907

申请日：2007-02-22

申请人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Matsuoka ,  Masayoshi Koyama

发明人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Matsuoka ,  Masayoshi Koyama

IPC分类号： H05K3/00 ,  B23P19/00

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83886 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0776 ,  H05K2203/087 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/532 ,  Y10T29/53204 ,  H01L2924/00

摘要： In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

摘要翻译： 在布线基板31的电极32上形成凸块19的方法中，将含有导电粒子16和气泡生成剂的流体14供给到布线基板31上的包含电极32的第一区域17上。然后， 40具有与第一区域17具有相同面积并形成在具有比第一区域17的面积大的面积的基板40的主表面18上的突出表面13，使得突出表面13面向 然后，流体14被加热，从包含在流体14中的气泡发生剂产生气泡30。

公开(公告)号：US07537961B2

公开(公告)日：2009-05-26

申请号：US11683612

申请日：2007-03-08

申请人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： H01L21/00

CPC分类号： H05K3/3484 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/3613 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29311 ,  H01L2924/00014 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/16225

摘要： The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.

摘要翻译： 本发明提供一种导电树脂组合物，用于电连接电极，其中金属颗粒分散在流动介质中，其中流动介质包括与金属颗粒相比具有较高润湿性的第一流动介质和具有相对较高的第二流动介质 与金属颗粒的低润湿性，以及第一流动介质和第二流动介质在彼此不相容的状态下分散。 因此，提供了可以应用于LSI的倒装芯片封装并且具有高生产率和高可靠性的倒装芯片封装方法。