公开(公告)号：US09704822B2

公开(公告)日：2017-07-11

申请号：US14936849

申请日：2015-11-10

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Jae-Woong Nah

IPC: H01L23/00 ,  H01L23/544

CPC classification number: H01L24/81 ,  H01L21/6836 ,  H01L23/544 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2224/8113 ,  H01L2224/81815 ,  H01L2924/3511

Abstract: Methods are provided for bonding substrates together using alignment structures and solder reflow techniques which achieve self-alignment in three dimensions, as well as semiconductor structures that are formed using such methods. A first alignment structure is formed on a bonding surface of a first substrate, which includes an alignment trench formed in the bonding surface of the first substrate. A second alignment structure is formed on a bonding surface of a second substrate, which includes a bonding pad with solder formed on the bonding pad. The first and second substrates are placed together with the solder of the second alignment structure in contact with the first alignment structure. A solder reflow process causes the solder to melt and flow into the alignment trench while pulling on the bonding pad to cause the second substrate to move into alignment with the first substrate in each of X, Y, and Z directions.

公开(公告)号：US20170135464A1

公开(公告)日：2017-05-18

申请号：US14942522

申请日：2015-11-16

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Minhua Lu ,  Sufi Zafar

IPC: A46B15/00 ,  G09G5/00 ,  G01N27/414 ,  A46B17/08 ,  A46B9/04

CPC classification number: A46B15/0004 ,  A46B9/04 ,  A46B11/002 ,  A46B15/0044 ,  A46B17/08 ,  A46B2200/1066 ,  A61B5/00 ,  G09G5/00

Abstract: Smart toothbrush designs are provided. In one aspect, a toothbrush is provided which includes: a handle portion; and a head portion attached to the handle portion, wherein the head portion has bristles, a sample testing chamber containing at least one electronic sensor, a removable tip for drawing saliva samples into the sample testing chamber, and a calibration solution reservoir connected to the sample testing chamber. In another aspect, the head portion of the toothbrush has at least one optical sensor. A method for acquiring user data using the present smart toothbrush designs is also provided.

公开(公告)号：US09648782B2

公开(公告)日：2017-05-09

申请号：US15041213

申请日：2016-02-11

Applicant: International Business Machines Corporation

Inventor： Thomas J. Brunschwiler ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bruno Michael ,  Chin Lee Ong ,  Cornelia K. Tsang

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/427 ,  H01L25/065 ,  H01L29/06 ,  H01L23/498

CPC classification number: H05K7/20381 ,  H01L23/367 ,  H01L23/427 ,  H01L23/49816 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/81141 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06593 ,  H05K7/20309 ,  H05K7/20327

Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.

公开(公告)号：US20170124446A1

公开(公告)日：2017-05-04

申请号：US14927013

申请日：2015-10-29

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Montague Denneau ,  John U. Knickerbocker ,  Robert L. Wisnieff

IPC: G06K19/077

CPC classification number: G08B13/244 ,  G06K19/0704 ,  G06K19/0707 ,  G06K19/0716 ,  G06K19/0717 ,  G06K19/0723 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07775 ,  H01L21/78 ,  H01L23/544 ,  H01L23/66 ,  H01L31/0547 ,  H01L2223/54426 ,  H01L2223/6677

Abstract: A smart tag comprises a processor, a non-volatile memory, at least one of an internal power source and an external power source, and a transceiver configured for two-way communication with a reader external to the smart tag. The smart tag is formed as an integrated circuit chip less than 10 cubic millimeters in size to less than 0.000125 cubic millimeters in size. An apparatus comprising the smart tag may further include an antenna connect to the smart tag.

公开(公告)号：US09636782B2

公开(公告)日：2017-05-02

申请号：US14226966

申请日：2014-03-27

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: B23K26/36 ,  G01R31/26 ,  H01L21/302 ,  H01L21/683

CPC classification number: B23K26/36 ,  G01R31/2607 ,  H01L21/302 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/265 ,  Y10T428/30 ,  Y10T428/31678

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.

公开(公告)号：US09606142B2

公开(公告)日：2017-03-28

申请号：US14495606

申请日：2014-09-24

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Jae-Woong Nah ,  Robert E. Trzcinski ,  Cornelia Kang-I Tsang

IPC: H01L21/8242 ,  G01R1/04

CPC classification number: G01R1/0408 ,  G01R1/06761 ,  G01R3/00 ,  H01L22/30 ,  H01L22/34 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/32145 ,  H01L2224/73265 ,  H01L2924/014

Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.

公开(公告)号：US09472789B2

公开(公告)日：2016-10-18

申请号：US14340253

申请日：2014-07-24

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Joana Sofia Branquinho Teresa Maria ,  Bing Dang ,  Michael A. Gaynes ,  John U. Knickerbocker ,  Eric P. Lewandowski ,  Cornelia K. Tsang ,  Bucknell C. Webb

IPC: H01L21/336 ,  H01M2/02 ,  G02C7/08 ,  A61B5/145 ,  H01M4/38 ,  H01M4/50 ,  H01M4/66 ,  H01M10/04 ,  C25D5/02 ,  H01M4/42 ,  H01M4/48 ,  C25D1/04 ,  C25D1/22 ,  H01M4/139 ,  H01M4/02 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D5/10 ,  C25D5/50

CPC classification number: H01M2/0202 ,  A61B5/145 ,  A61B2562/028 ,  C25D1/04 ,  C25D1/22 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D3/565 ,  C25D5/02 ,  C25D5/10 ,  C25D5/50 ,  G02C7/083 ,  H01M4/139 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/661 ,  H01M4/664 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2004/027 ,  H01M2004/028 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A microsystem with an integrated energy source serves as a platform and ecosystem for a variety of microsystems for implanting into human tissue. The microsystem includes a flexible battery located in an enclosed void. The enclosed void is formed by joining a first dielectric element with a second dielectric element.

Abstract translation: 具有综合能源的微系统作为植入人体组织的各种微系统的平台和生态系统。 微系统包括位于封闭空隙中的柔性电池。 封闭的空隙通过将第一介电元件与第二介电元件接合而形成。

公开(公告)号：US20160254744A1

公开(公告)日：2016-09-01

申请号：US15072675

申请日：2016-03-17

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC: H02M3/156 ,  G06F1/26 ,  H01L25/065 ,  H01L23/64 ,  H01L23/00

CPC classification number: H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

公开(公告)号：US20160233190A1

公开(公告)日：2016-08-11

申请号：US15131171

申请日：2016-04-18

Applicant: International Business Machines Corporation

Inventor： William E. Bernier ,  Bing Dang ,  Mario J. Interrante ,  John U. Knickerbocker ,  Son K. Tran

IPC: H01L23/00 ,  H01L23/367 ,  H01L25/065 ,  H01L23/60 ,  H01L23/552 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/60 ,  H01L24/09 ,  H01L25/0655 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15738 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

Abstract translation: 插入器夹层结构包括顶部插入器和封装集成电路电子器件的底部插入器，其包括用于将器件附接到底部插入器的装置，以及将顶部插入件连接到底部插入器的互连结构。 除了底部插入器之外，顶部插入器还可以直接连接到芯片载体。 该结构提供了在小型化3D封装中防止静电放电（ESD），电磁干扰（EMI）和电磁导电（EMC））的器件的屏蔽和保护。

公开(公告)号：US20140103499A1

公开(公告)日：2014-04-17

申请号：US13649573

申请日：2012-10-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul S. Andry ,  Russell A. Budd ,  John U. Knickerbocker ,  Robert E. Trzcinski ,  Douglas C. La Tulipe, JR.

IPC: H01L23/498 ,  H01L29/00

CPC classification number: H01L23/49827 ,  H01L21/02 ,  H01L21/2007 ,  H01L21/6835 ,  H01L29/00 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for processing a semiconductor wafer includes applying a release layer to a transparent handler. An adhesive layer, that is distinct from the release layer, is applied between a semiconductor wafer and the transparent handler having the release layer applied thereon. The semiconductor wafer is bonded to the transparent handler using the adhesive layer. The semiconductor wafer is processed while it is bonded to the transparent handler. The release layer is ablated by irradiating the release layer through the transparent handler with a laser. The semiconductor wafer is removed from the transparent handler.

Abstract translation: 一种用于处理半导体晶片的方法包括将释放层应用于透明处理器。 将不同于剥离层的粘合剂层施加在半导体晶片和其上施加有剥离层的透明处理器之间。 使用粘合剂层将半导体晶片结合到透明处理器。 半导体晶片在与透明处理器结合时进行处理。 通过用激光器通过透明处理器照射释放层来消除释放层。 从透明处理器移除半导体晶片。