公开(公告)号：US20050220794A1

公开(公告)日：2005-10-06

申请号：US11132241

申请日：2005-05-19

申请人： Gertrud Hotten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl ,  Michael Paulista

发明人： Gertrud Hotten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl ,  Michael Paulista

IPC分类号： A61K39/395 ,  C07K16/22

CPC分类号： C07K16/22 ,  A61K38/00 ,  C07K14/495 ,  Y10S435/81 ,  Y10S435/975

摘要： The invention relates to an antibody or antibody fragment which specifically binds to a protein of the TGF-β family. The invention also relates to a kit for detecting a protein of the TGF-β family which comprises the antibody or antibody fragment. Finally, the invention relates to method for detecting a protein of the TGF-β family which uses the antibody or antibody fragment.

摘要翻译： 本发明涉及特异性结合TGF-β家族的蛋白质的抗体或抗体片段。 本发明还涉及用于检测包含抗体或抗体片段的TGF-β家族的蛋白质的试剂盒。 最后，本发明涉及检测使用该抗体或抗体片段的TGF-β家族的蛋白质的方法。

公开(公告)号：US20050194674A1

公开(公告)日：2005-09-08

申请号：US10790907

申请日：2004-03-02

申请人： Jochen Thomas ,  Peter Weitz ,  Jurgen Grafe ,  Harry Hedler ,  Jens Pohl

发明人： Jochen Thomas ,  Peter Weitz ,  Jurgen Grafe ,  Harry Hedler ,  Jens Pohl

IPC分类号： G11C5/14 ,  H01L23/48 ,  H01L23/50 ,  H01L25/065

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012

摘要： An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is coupled to the substrate, preferably by an adhesive. Wire leads electrically couple the bond pads of the first die to contacts on the substrate. A second die is placed on the first die, and wire leads electrically couple the bond pads of the second die to contacts on the substrate. Preferably, a spacer is placed between the first die and the second die. Additional dies may be stacked on the second die.

摘要翻译： 堆叠式模具组件的装置和制造方法。 第一管芯被放置在衬底上，使得管芯的背面，即与接合焊盘的侧面相反的一侧，优选地通过粘合剂耦合到衬底。 引线将第一管芯的接合焊盘电耦合到衬底上的接触点。 第二管芯被放置在第一管芯上，引线将第二管芯的接合焊盘电耦合到衬底上的接触点。 优选地，间隔件被放置在第一管芯和第二管芯之间。 另外的模具可以堆叠在第二模具上。

公开(公告)号：US20050169965A1

公开(公告)日：2005-08-04

申请号：US11080494

申请日：2005-03-16

申请人： Michael Paulista ,  Jens Pohl ,  Joachim Pabst ,  Helmut Heide

发明人： Michael Paulista ,  Jens Pohl ,  Joachim Pabst ,  Helmut Heide

IPC分类号： C12N15/09 ,  A61K38/00 ,  A61K38/18 ,  A61L27/00 ,  A61L27/22 ,  A61L27/42 ,  C07K14/495 ,  C07K14/51 ,  C07K19/00 ,  A61K38/17 ,  A61F2/00 ,  A61K33/42

CPC分类号： A61L27/425 ,  A61K38/1875 ,  A61L27/227 ,  C07K14/495 ,  C07K14/51

摘要： The present invention concerns a bioactive implant material having a cartilage-inducing and/or bone-inducing activity composed of two components A and B, of which A is a bone-inducing and/or cartilage-inducing protein or protein mixture and preferably one or several proteins from the TGF-β superfamily, preferably MP52 or a DNA sequence coding therefor and B is a carrier matrix composed of calcium phosphate ceramics with an interconnecting microporosity which already alone has bone-inducing properties. The invention additionally concerns the production of these compounds and their use for the treatment of diseases which affect cartilage and/or bones as well as to treat damage to cartilage and/or bone tissue.

摘要翻译： 本发明涉及具有由两种组分A和B组成的软骨诱导和/或骨诱导活性的生物活性植入材料，其中A是诱导骨诱导和/或软骨诱导蛋白或蛋白质混合物，优选其中一种或 来自TGF-β超家族的几种蛋白质，优选MP52或其编码的DNA序列，B是由磷酸钙陶瓷构成的载体基质，其具有已经单独具有骨诱导性质的互连微孔。 本发明还涉及这些化合物的生产及其用于治疗影响软骨和/或骨骼的疾病以及治疗软骨和/或骨组织损伤的用途。

公开(公告)号：US06377460B1

公开(公告)日：2002-04-23

申请号：US09583131

申请日：2000-05-30

申请人： Jens Pohl ,  Gerolf Thamm ,  Andreas Hippe

发明人： Jens Pohl ,  Gerolf Thamm ,  Andreas Hippe

IPC分类号： H05K720

CPC分类号： H01L23/3677 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

摘要： An electronic circuit module has at least one electronic component and a heat sink, which is thermally connected to the at least one electronic component. A thermal conduction path between the at least one electronic component and the heat sink is formed by an intermediate layer, which adjoins a surface of the heat sink. The intermediate layer is formed by an island-like structure including pillars of a flexible, thermally conductive material.

摘要翻译： 电子电路模块具有与至少一个电子部件热连接的至少一个电子部件和散热器。 所述至少一个电子部件与所述散热器之间的热传导路径由与所述散热片的表面相邻的中间层形成。 中间层由包括柔性导热材料柱的岛状结构形成。

公开(公告)号：US08309454B2

公开(公告)日：2012-11-13

申请号：US11746936

申请日：2007-05-10

申请人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

发明人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

IPC分类号： H01L21/4763

CPC分类号： H01L25/50 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/60 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1617 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

摘要翻译： 工件具有至少两个半导体芯片，每个半导体芯片具有至少部分暴露的第一主表面和第二主表面。 所述工件还包括布置在所述至少两个半导体芯片上的导电层，所述导电层至少布置在所述第二主表面的区域上，所述模制化合物布置在所述导电层上。

公开(公告)号：US20120258594A1

公开(公告)日：2012-10-11

申请号：US13084105

申请日：2011-04-11

申请人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

发明人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

IPC分类号： H01L21/28

CPC分类号： H01L21/76898 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/76879 ,  H01L23/481 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6688 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2924/00014 ,  H01L2224/05552

摘要： Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry. The method further includes forming patterns for redistribution lines on a photo resist layer, the photo resist layer disposed under the back surface, and filling the through substrate opening and the patterns for redistribution lines with a conductive material.

摘要翻译： 公开了一种片上系统的结构以及片上系统的形成方法。 在一个实施例中，一种制造片上系统的方法包括从衬底的背面形成穿透衬底开口，穿过衬底开口设置在第一和第二区域之间，第一区域包括用于RF电路的装置，第二区域包括第二 区域包括用于其他电路的装置。 该方法还包括在光致抗蚀剂层上形成用于再分配线的图案，设置在背面下方的光致抗蚀剂层，以及用导电材料填充贯通基板开口和再分配线图案。

公开(公告)号：US07936052B2

公开(公告)日：2011-05-03

申请号：US12242487

申请日：2008-09-30

申请人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

发明人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

IPC分类号： H01L29/72

CPC分类号： H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/552 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05569 ,  H01L2924/0002 ,  H01L2224/05552

摘要： Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry. The method further includes forming patterns for redistribution lines on a photo resist layer, the photo resist layer disposed under the back surface, and filling the through substrate opening and the patterns for redistribution lines with a conductive material.

摘要翻译： 公开了一种片上系统的结构以及片上系统的形成方法。 在一个实施例中，一种制造片上系统的方法包括从衬底的背面形成穿透衬底开口，穿过衬底开口设置在第一和第二区域之间，第一区域包括用于RF电路的装置，第二区域包括第二 区域包括用于其他电路的装置。 该方法还包括在光致抗蚀剂层上形成用于再分配线的图案，设置在背面下方的光致抗蚀剂层，以及用导电材料填充贯通基板开口和再分配线图案。

公开(公告)号：US20100237506A1

公开(公告)日：2010-09-23

申请号：US12408110

申请日：2009-03-20

申请人： Markus Brunnbauer ,  Jens Pohl ,  Thorsten Meyer

发明人： Markus Brunnbauer ,  Jens Pohl ,  Thorsten Meyer

IPC分类号： H01L23/498 ,  H01L21/768 ,  H01L21/50

CPC分类号： H01L24/11 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/525 ,  H01L23/528 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/1132 ,  H01L2224/12105 ,  H01L2224/13111 ,  H01L2224/19 ,  H01L2224/2105 ,  H01L2224/22 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/01028 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2224/29599 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact pad is placed over the first conductor line. At least a portion of the first conductor line lies within a projection of the external contact pad on the semiconductor chip.

摘要翻译： 半导体器件及其制造方法。 一个实施例提供了包括半导体芯片的装置。 第一导线被放置在半导体芯片上。 外部接触垫放置在第一导体线上。 第一导体线的至少一部分位于半导体芯片上的外部接触焊盘的突出部内。

公开(公告)号：US07786584B2

公开(公告)日：2010-08-31

申请号：US11944846

申请日：2007-11-26

申请人： Hans-Joachim Barth ,  Jens Pohl

发明人： Hans-Joachim Barth ,  Jens Pohl

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2224/05552

摘要： A structure and method of forming landing pads for through substrate vias in forming stacked semiconductor components are described. In various embodiments, the current invention describes landing pad structures that includes multiple levels of conductive plates connected by vias such that the electrical connection between a through substrate etch and landing pad is independent of the location of the bottom of the through substrate trench.

摘要翻译： 描述了在形成堆叠的半导体部件中形成通过衬底通孔的着陆焊盘的结构和方法。 在各种实施例中，本发明描述着陆焊盘结构，其包括通过通孔连接的多层导电板，使得贯穿衬底蚀刻和着陆焊盘之间的电连接独立于贯穿衬底沟槽的底部的位置。

公开(公告)号：US07687895B2

公开(公告)日：2010-03-30

申请号：US11939938

申请日：2007-11-14

申请人： Markus Brunnbauer ,  Jens Pohl ,  Klaus Pressel ,  Thorsten Meyer ,  Recai Sezi ,  Stephan Bradl ,  Ralf Plieninger

发明人： Markus Brunnbauer ,  Jens Pohl ,  Klaus Pressel ,  Thorsten Meyer ,  Recai Sezi ,  Stephan Bradl ,  Ralf Plieninger

IPC分类号： H01L23/02 ,  H01L23/043 ,  H01L23/10 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/28

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/60 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/12105 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05099

摘要： A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also includes an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. In the molding compound a contact via is arranged.

摘要翻译： 工件具有至少两个半导体芯片，每个半导体芯片具有至少部分暴露的第一主表面和第二主表面。 工件还包括布置在至少两个半导体芯片上的导电层，导电层至少布置在第二主表面的区域上，以及配置在导电层上的模塑料。 在模塑料中配置有接触孔。