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公开(公告)号：US20180063949A1
公开(公告)日：2018-03-01
申请号：US15247151
申请日：2016-08-25
Applicant: International Business Machines Corporation
Inventor： Eric J. Campbell , Joseph Kuczynski , Timothy J. Tofil
CPC classification number: H05K1/0353 , B29C35/02 , B29C35/0272 , B29K2105/0872 , B29K2105/162 , B29K2995/0008 , B29L2031/3425 , H05K1/0201 , H05K2201/068 , H05K2201/09009
Abstract: A composite material incorporates multi-compartment microcapsules that produce heat when subject to a stimulus such as a compressive force or a magnetic field. The stimulus ruptures an isolating structure within the multi-compartment microcapsule, allowing reactants within the multi-compartment microcapsule to produce heat from an exothermic reaction. In some embodiments, the composite material is a laminate used in the manufacture of multi-layer printed circuit boards (PCBs) and provides heat during the curing process of the multi-layer PCBs to ensure a consistent thermal gradient in the multi-layer product.
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公开(公告)号：US20170338722A1
公开(公告)日：2017-11-23
申请号：US15597890
申请日：2017-05-17
Applicant: Johnson Electric S.A.
Inventor： Qing Bin LUO , Chi Wai LAI , Wen Ming WU
CPC classification number: H02K11/30 , H02K11/026 , H02K11/40 , H02K13/105 , H05K1/0216 , H05K1/11 , H05K1/162 , H05K2201/09009
Abstract: A printed circuit board includes a body, a first conductive pattern layer disposed on a first surface of the body, and a second conductive pattern layer disposed on a second surface of the body. The first conductive pattern layer and the second conductive pattern layer form a capacitor. The present disclosure further provides an motor having the printed circuit board.
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公开(公告)号：US09795035B2
公开(公告)日：2017-10-17
申请号：US15356852
申请日：2016-11-21
Inventor： Jonathan Douglas Hatch , Stephen McGarry Hatch
CPC classification number: H05K1/0306 , H05K1/02 , H05K1/028 , H05K1/0393 , H05K1/115 , H05K1/144 , H05K3/0023 , H05K3/0064 , H05K3/007 , H05K3/048 , H05K3/103 , H05K3/125 , H05K3/386 , H05K3/389 , H05K3/4611 , H05K3/4644 , H05K2201/0145 , H05K2201/0154 , H05K2201/05 , H05K2201/09009 , H05K2203/0152
Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.
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公开(公告)号：US09788423B2
公开(公告)日：2017-10-10
申请号：US15139482
申请日：2016-04-27
Applicant: JX Nippon Mining & Metals Corporation
Inventor： Tomota Nagaura , Michiya Kohiki , Terumasa Moriyama
IPC: H05K1/09 , B32B15/01 , B32B3/30 , C22C9/00 , H05K3/38 , H05K1/03 , H05K3/06 , H05K3/18 , B32B15/08 , B32B15/20 , C25D1/04 , C25D5/12 , H05K3/02 , C25D3/12 , C25D3/38 , C25D9/08
CPC classification number: H05K1/09 , B32B3/30 , B32B15/01 , B32B15/08 , B32B15/20 , B32B2307/306 , B32B2307/714 , B32B2457/08 , C22C9/00 , C25D1/04 , C25D3/12 , C25D3/38 , C25D5/12 , C25D9/08 , H05K1/0313 , H05K3/022 , H05K3/025 , H05K3/06 , H05K3/181 , H05K3/188 , H05K3/381 , H05K3/383 , H05K3/388 , H05K2201/09009 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611 , Y10T428/12792 , Y10T428/12847 , Y10T428/12903 , Y10T428/1291
Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.
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公开(公告)号：US09706645B2
公开(公告)日：2017-07-11
申请号：US14428358
申请日：2015-01-07
Inventor： Hu He
CPC classification number: H05K1/028 , H05K1/0203 , H05K1/0284 , H05K1/0298 , H05K1/05 , H05K3/0061 , H05K2201/066 , H05K2201/09009 , H05K2201/10106 , H05K2201/10409 , H05K2201/10553
Abstract: A L-Bending PCB includes a straight portion and a bending portion connecting to the straight portion, the straight portion has a metal substrate bottom, an insulation layer, a conductive layer and a protective layer. The insulation layer is disposed on a partial surface of the metal substrate bottom, the conductive layer is disposed on the insulation layer and the protective layer is disposed on the conductive layer.
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Patent Agency Ranking
公开(公告)号：US20170164463A1
公开(公告)日：2017-06-08
申请号：US15356852
申请日：2016-11-21
Inventor： JONATHAN DOUGLAS HATCH , STEPHEN MCGARRY HATCH
CPC classification number: H05K1/0306 , H05K1/02 , H05K1/028 , H05K1/0393 , H05K1/115 , H05K1/144 , H05K3/0023 , H05K3/0064 , H05K3/007 , H05K3/048 , H05K3/103 , H05K3/125 , H05K3/386 , H05K3/389 , H05K3/4611 , H05K3/4644 , H05K2201/0145 , H05K2201/0154 , H05K2201/05 , H05K2201/09009 , H05K2203/0152
Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.
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公开(公告)号：US20160282688A1
公开(公告)日：2016-09-29
申请号：US15036346
申请日：2013-11-14
Applicant: SAKAI DISPLAY PRODUCTS CORPORATION
Inventor： Hidetoshi Nakagawa
IPC: G02F1/1362 , H05K1/02
CPC classification number: G02F1/136259 , G02F2001/136263 , H05K1/0266 , H05K1/0269 , H05K1/0296 , H05K3/22 , H05K2201/09009
Abstract: Provided are a circuit board and a display apparatus in which, when a worker restores a cut wiring with laser, the worker may easily determine a portion to be irradiated with laser by the naked eye.In a circuit board including multiple layered wiring parts (G, O) and an insulating part deposited between layers of the wiring parts (G, O), the insulating portion has a missing part (F) at a superposed position where the wiring parts are superposed onto each other in a layered direction, and a marker (P) indicating the presence of the missing part (F) is formed.
Abstract translation: 在包括多层布线部分（G，O）和沉积在布线部分（G，O）的层之间的绝缘部分的电路板中，绝缘部分在布线部分的叠置位置具有缺损部分（F） 在层叠方向上彼此重叠，形成表示缺失部分（F）的存在的标记（P）。
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公开(公告)号：US20160205763A1
公开(公告)日：2016-07-14
申请号：US15077211
申请日：2016-03-22
Applicant: YAZAKI CORPORATION
Inventor： Akira HARAO , Mototatsu MATSUNAGA , Yasuhiro SUGIURA , Minoru KUBOTA
CPC classification number: H05K1/0204 , H01L23/49861 , H01L2224/05571 , H01L2224/48091 , H01L2225/1094 , H01R12/728 , H05K1/0203 , H05K1/05 , H05K1/056 , H05K1/11 , H05K1/14 , H05K3/10 , H05K3/202 , H05K3/3447 , H05K3/368 , H05K7/1046 , H05K2201/09009 , H05K2201/09063 , H05K2201/10757 , H05K2201/10787 , H05K2203/025 , Y10T29/49147 , Y10T29/49155
Abstract: Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.
Abstract translation: 公开了布线基板，该布线基板包括具有高导热层的基板，其中基板的前表面和后表面中的至少一个是用于各种部件的安装表面; 形成在所述基板中的窗部; 以及从所述窗部的内表面部分延伸并在垂直于所述基板的表面的方向上弯曲的连接端子。
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公开(公告)号：US20160128181A1
公开(公告)日：2016-05-05
申请号：US14773558
申请日：2015-03-30
Applicant: KYOCERA Corporation
Inventor： Hiroshi Yamada , Takuji Okamura
CPC classification number: H05K1/0271 , H01L23/053 , H01L23/13 , H01L23/15 , H01L23/36 , H01L23/562 , H01L2224/48091 , H01L2224/49175 , H01L2224/73265 , H01L2924/3511 , H05K1/0313 , H05K1/182 , H05K2201/09009 , H01L2924/00014
Abstract: There is provided a substrate for mounting electronic elements, including: a frame-shaped first wiring substrate with a first through hole formed in an interior portion thereof; a flat plate-shaped or frame-shaped second wiring substrate arranged to overlap with a bottom surface of the first wiring substrate and electrically connected thereto; and a sheet-shaped metal sheet arranged to overlap with a bottom surface of the second wiring substrate such that the second wiring substrate is sandwiched between the first wiring substrate and the metal sheet, an area inside the frame-shaped first wiring substrate or areas inside the frame-shaped first wiring substrate and second wiring substrate being electronic element mounting areas, and the second wiring substrate having an elastic modulus lower than those of the first wiring substrate and the metal sheet.
Abstract translation: 提供了一种用于安装电子元件的基板，包括：框状的第一布线基板，其第一通孔形成在其内部; 平板状或框状的第二布线基板，被布置成与第一布线基板的底表面重叠并与其电连接; 以及片状金属片，其布置成与第二布线基板的底表面重叠，使得第二布线基板夹在第一布线基板和金属片之间，框架状的第一布线基板内的区域或内部的区域 框状的第一布线基板和第二布线基板是电子元件安装区域，第二布线基板的弹性模量低于第一布线基板和金属板的弹性模量。
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公开(公告)号：US20150353428A1
公开(公告)日：2015-12-10
申请号：US14827456
申请日：2015-08-17
Applicant: NGK INSULATORS, LTD.
Inventor： Tatsuro Takagaki , Yasunori Iwasaki , Sugio Miyazawa , Akiyoshi Ide , Hirokazu Nakanishi
IPC: C04B35/119 , H01B3/12
CPC classification number: H05K1/115 , C04B35/111 , C04B35/119 , C04B35/634 , C04B2235/3206 , C04B2235/3217 , C04B2235/3225 , C04B2235/3244 , C04B2235/3281 , C04B2235/3418 , C04B2235/6023 , C04B2235/606 , C04B2235/612 , C04B2235/6582 , C04B2235/662 , C04B2235/72 , C04B2235/77 , C04B2235/786 , C04B2235/95 , H01B3/12 , H01B17/56 , H05K1/03 , H05K1/0306 , H05K3/00 , H05K3/0014 , H05K3/0029 , H05K2201/09009 , Y10T428/24273
Abstract: It is provided an insulating substrate including through holes 2 for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 300 μm , and a diameter of the through hole is 20 to 100 μm . The insulating substrate is composed of an alumina sintered body. A relative density and an average grain size of the alumina sintered body is 99.5 percent or higher and 2 to 50 μm , respectively.
Abstract translation: 提供了绝缘基板，其包括用于布置在绝缘基板中的导体的通孔2。 绝缘基板的厚度为25〜300μm，通孔的直径为20〜100μm。 绝缘基板由氧化铝烧结体构成。 氧化铝烧结体的相对密度和平均粒径分别为99.5％以上且2〜50μm。
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