公开(公告)号：US07371072B2

公开(公告)日：2008-05-13

申请号：US10750355

申请日：2003-12-29

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

IPC: H01R12/00

CPC classification number: H01L24/72 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06761 ,  G01R1/07342 ,  G01R3/00 ,  H01H1/0036 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/30105 ,  H05K3/326 ,  H05K3/4092 ,  H01L2924/00

Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.

Abstract translation: 包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。 第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。 在一个方面，互连具有适于直接接触半导体器件的尺寸。 可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。 在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。

公开(公告)号：US20080094088A1

公开(公告)日：2008-04-24

申请号：US11963575

申请日：2007-12-21

Applicant: Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

Inventor： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

IPC: G01R31/26

CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

Abstract translation: 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

公开(公告)号：US20080088010A1

公开(公告)日：2008-04-17

申请号：US11548668

申请日：2006-10-11

Applicant: Eric D. Hobbs ,  Gaetan Mathieu

Inventor： Eric D. Hobbs ,  Gaetan Mathieu

IPC: H01L23/34

CPC classification number: H01L23/34 ,  B81B7/0006 ,  B81B7/0093 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00

Abstract: An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.

Abstract translation: 电子设备可以包括其上可以形成微机械系统的半导体管芯。 微机械系统可以包括多个导电细长的接触结构，其可以设置在半导体管芯的输入和/或输出端子上。 微机械系统还可以包括设置在半导体管芯上的冷却结构。

公开(公告)号：US07352196B2

公开(公告)日：2008-04-01

申请号：US11423808

申请日：2006-06-13

Applicant: Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldridge

Inventor： Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldridge

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract translation: 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。 硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。 一个优选的主要接触是弹性弹簧接触。 空间变压器中的导电元件以更放松的间距被路由到第二触点。 在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。 硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。 可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

公开(公告)号：US07345493B2

公开(公告)日：2008-03-18

申请号：US11458375

申请日：2006-07-18

Applicant: Igor Y. Khandros ,  David V. Pedersen

Inventor： Igor Y. Khandros ,  David V. Pedersen

IPC: G01R31/02

CPC classification number: G01R31/2886 ,  G01R31/287 ,  G01R31/2874 ,  G01R31/318511 ,  H01L2924/01078 ,  H01L2924/01079

Abstract: Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. Physical alignment techniques are also described.

Abstract translation: 用于执行半导体器件的晶片级老化和测试的技术包括具有有源电子部件的测试基板，例如安装到互连基板或并入其中的ASIC，实现ASIC和多个器件之间的互连的金属弹簧接触元件 在测试晶片（WUT）上的测试（DUT）都被置于真空容器中，使得ASIC可以在与DUT的老化温度无关并且显着低于DUT的老化温度的温度下工作。 弹簧接触元件可以被安装到DUT或ASIC上，并且可以扇出来放松对ASIC和DUT的对准和互连的容限约束。 还描述了物理对准技术。

公开(公告)号：US20080061803A1

公开(公告)日：2008-03-13

申请号：US11466145

申请日：2006-08-22

Applicant: Frederick J. Lane

Inventor： Frederick J. Lane

IPC: G01R27/08

CPC classification number: G01R27/205 ,  G01R1/067

Abstract: According to some embodiments, a method of determining a resistance of probes on a contactor device is disclosed. The contactor device can include a plurality of probes disposed to contact an electronic device to be tested. The method can include electrically connecting a pair of the probes to each other, and then forcing one of a voltage onto or a current through the pair of the probes. At a location on the contactor device, the other of a voltage across or a current through the pair of the probes can be sensed. A determination relating to a resistance of the probes can be determined from the values of the forced voltage or current and sensed other of the voltage or current.

Abstract translation: 根据一些实施例，公开了一种确定接触器装置上探头的电阻的方法。 接触器装置可以包括多个探针，其设置成接触要测试的电子设备。 该方法可以包括将一对探针彼此电连接，然后将电压中的一个强制施加到一对探针上或通过一对探针。 在接触器装置上的位置处，可以感测通过该对探针的电压或电流中的另一个。 可以根据强制电压或电流的值和感测到的其他电压或电流来确定与探针的电阻有关的确定。

公开(公告)号：US07326327B2

公开(公告)日：2008-02-05

申请号：US10456343

申请日：2003-06-06

Applicant: Michael Armstrong ,  Gayle Herman ,  Greg Omweg ,  Ravindra V. Shenoy

Inventor： Michael Armstrong ,  Gayle Herman ,  Greg Omweg ,  Ravindra V. Shenoy

IPC: C25D5/02 ,  C25D3/00

CPC classification number: C25D3/54 ,  Y10T428/12 ,  Y10T428/24612 ,  Y10T428/265

Abstract: A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.

Abstract translation: 将卤化物基应力降低剂加入到镀铑溶液的浴中。 减压剂可减少电镀铑中的应力，增加镀层中不会开裂的铑的厚度。 此外，应力降低剂不会明显降低镀覆铑的耐磨性或硬度。

公开(公告)号：US20080010814A1

公开(公告)日：2008-01-17

申请号：US11779163

申请日：2007-07-17

Applicant: Charles Miller

Inventor： Charles Miller

IPC: H01R43/00 ,  H01C17/00 ,  H05K3/30

CPC classification number: G01R1/07378 ,  G01R3/00 ,  G01R31/2889 ,  G01R31/31723 ,  G01R31/318511 ,  G01R31/31905 ,  G01R31/31926 ,  Y10T29/49082 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: A probe card provides signal paths between integrated circuit (IC) tester channels and probes accessing input and output pads of ICs to be tested. When a single tester channel is to access multiple (N) IC pads, the probe card provides a branching path linking the channel to each of the N IC input pads. Each branch of the test signal distribution path includes a resistor for isolating the IC input pad accessed via that branch from all other branches of the path so that a fault on that IC pad does not substantially affect the voltage of signals appearing on any other IC pad. When a single tester channel is to monitor output signals produced at N IC pads, the resistance in each branch of the signal path linking the pads of the tester channel is uniquely sized to that the voltage of the input signal supplied to the tester channel is a function of the combination of logic states of the signals produced at the N IC pads. The tester channel measures the voltage of its input signal so that the logic state of the signals produced at each of the N IC output pads can be determined from the measured voltage.

Abstract translation: 探针卡提供集成电路（IC）测试仪通道之间的信号路径，以及访问要测试的IC的输入和输出焊盘的探头。 当单个测试仪通道要访问多个（N）个IC焊盘时，探针卡提供将通道连接到每个N个IC输入焊盘的分支路径。 测试信号分配路径的每个分支包括用于隔离通过该分支从该路径的所有其他分支访问的IC输入焊盘的电阻器，使得该IC焊盘上的故障基本上不影响出现在任何其它IC焊盘上的信号的电压 。 当单个测试仪通道用于监视在N个IC焊盘处产生的输出信号时，连接测试仪通道的焊盘的信号路径的每个分支中的电阻的唯一尺寸是使提供给测试仪通道的输入信号的电压为 在N个IC焊盘上产生的信号的逻辑状态的组合的功能。 测试仪通道测量其输入信号的电压，使得可以根据测量的电压确定在每个N IC输出焊盘处产生的信号的逻辑状态。

公开(公告)号：US20070296433A1

公开(公告)日：2007-12-27

申请号：US11423878

申请日：2006-06-13

Applicant: John K. Gritters

Inventor： John K. Gritters

IPC: G01R31/02

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R3/00

Abstract: In some embodiments of the invention, a probing apparatus can comprise a substrate, a spring structure attached to the substrate, and a plurality of resilient probes attached to the spring structure. Each probe can comprise a contact portion disposed to contact a device. The spring structure can provide a first source of compliance for each of the probes in response to forces on the contact portions of the probes, and each of the probes can individually provide second sources of compliance in response to the forces on the contact portions of the probes.

Abstract translation: 在本发明的一些实施例中，探测装置可以包括衬底，附接到衬底的弹簧结构以及附接到弹簧结构的多个弹性探针。 每个探针可以包括设置成接触设备的接触部分。 弹簧结构可以响应于探针的接触部分上的力而为每个探针提供第一符合源，并且每个探针可以响应于在接触部分的接触部分上的力而单独地提供第二依从源 探针。

公开(公告)号：US07312618B2

公开(公告)日：2007-12-25

申请号：US11428423

申请日：2006-07-03

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand S. Shinde ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand S. Shinde ,  Gaetan L. Mathieu

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

Abstract: A method and system for compensating for thermally induced motion of probe cards used in testing die on a wafer are disclosed. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced movement of the probe card is disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

Abstract translation: 公开了一种用于补偿在晶片上测试模具中使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 公开了用于允许探针卡的径向膨胀以防止热诱导的探针卡的移动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。