公开(公告)号：USD694291S1

公开(公告)日：2013-11-26

申请号：US29425624

申请日：2012-06-25

申请人： Philip F. Hottmann ,  Alan Wood

设计人： Philip F. Hottmann ,  Alan Wood

公开(公告)号：US08420001B2

公开(公告)日：2013-04-16

申请号：US12454473

申请日：2009-05-18

申请人： Martin Leuterer ,  Andreas Pfister ,  Frank Mueller ,  Alan Wood ,  Brian Wilson ,  Horst Sandner

发明人： Martin Leuterer ,  Andreas Pfister ,  Frank Mueller ,  Alan Wood ,  Brian Wilson ,  Horst Sandner

IPC分类号： B29C35/08 ,  C08F2/42 ,  C08J3/28

CPC分类号： B29C35/16 ,  B29C64/153 ,  B29C2035/0838 ,  B29K2995/004 ,  B33Y10/00 ,  B33Y70/00

摘要： A three-dimensional object is manufactured from a powder of polymer material by selective sintering process by means of electromagnetic radiation of the powder, wherein the powder comprises a preselected polymer or copolymer and is subjected to selective sintering such that the manufactured three-dimensional object has a final crystallinity which is in such a range that the balance of properties, in particular mechanical properties including Young's modulus, tensile strength and elongation at break, is improved.

公开(公告)号：US20110003163A1

公开(公告)日：2011-01-06

申请号：US12919978

申请日：2009-02-11

申请人： Alan Wood

发明人： Alan Wood

IPC分类号： B32B27/28 ,  B32B27/04 ,  B32B27/06 ,  B32B5/02 ,  B32B37/02

CPC分类号： B29C70/44 ,  B29C43/203 ,  B29C43/3642 ,  B29C70/086 ,  B29C2043/3644 ,  B29C2043/3647 ,  B29K2071/00 ,  B29K2081/00 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2105/0854 ,  B29L2031/7156 ,  Y10T156/10 ,  Y10T428/31504 ,  Y10T428/31942 ,  Y10T428/31946

摘要： A polyetheretherketone film is used in the consolidation of a prepreg so that the film becomes incorporated into the consolidated prepreg, defines an outer layer of the consolidated prepreg and therefore provides the consolidated prepreg with advantageous properties. In one embodiment, a film may be used as a bagging material. In this embodiment, prepreg is positioned in a mould to define a precursor of a composite material. A bagging film is positioned next to the prepreg and a vacuum is applied via port to evacuate the space between the prepreg and film and induction heating is used to cause the resin in the prepreg to melt. In addition, the film yields and draws and this stretched film will cover the prepreg and act as a bagging material. Another embodiment addresses the problem of insertion and/or removal of an inflatable bladder in the manufacture of hollow articles and utilizes a gas filled thermoplastic bag.

摘要翻译： 将聚醚醚酮薄膜用于固化预浸料，使得薄膜变成掺入固结的预浸料中，限定固结预浸料的外层，因此为固结预浸料提供有利的性能。 在一个实施例中，膜可以用作装袋材料。 在该实施例中，将预浸料坯定位在模具中以限定复合材料的前体。 袋装薄膜位于预浸料坯的旁边，通过端口进行真空抽真空，预浸料和薄膜之间的空间进行感应加热，使预浸料坯中的树脂熔化。 此外，薄膜产生和拉伸，并且该拉伸的薄膜将覆盖预浸料并充当装袋材料。 另一个实施例解决了在制造中空制品时插入和/或移除可充气囊的问题，并利用气体填充的热塑性袋。

公开(公告)号：US20080196900A1

公开(公告)日：2008-08-21

申请号：US12036426

申请日：2008-02-25

申请人： Richard Thomas Leibfried ,  Guglielmo Pernice ,  Geoff Small ,  Jack Vloedman ,  Alan Wood

发明人： Richard Thomas Leibfried ,  Guglielmo Pernice ,  Geoff Small ,  Jack Vloedman ,  Alan Wood

IPC分类号： E21B17/00

CPC分类号： E21B36/003 ,  B23P6/00 ,  E21B43/103 ,  Y10T29/4973 ,  Y10T29/49732 ,  Y10T29/49746 ,  Y10T29/49865 ,  Y10T29/49885

摘要： A method of fitting a compressed component, for example a pipe, in a receiver, for example a bore, comprises compressing a selected component which is made out of a polymeric material having a glass transition temperature of at least 100° C., for example polyetheretherketone; arranging the compressed component in position within a receiver; and subjecting the compressed component to conditions, for example of temperature and/or pressure, whereby the compressed component expands.

摘要翻译： 将压缩部件（例如管）装配在接收器例如孔中的方法包括压缩由具有至少100℃的玻璃化转变温度的聚合材料制成的选定部件，例如 聚醚醚酮 将压缩组件布置在接收器内的适当位置; 并且使压缩的组分经受例如温度和/或压力的状态，由此压缩组分膨胀。

公开(公告)号：US20070214394A1

公开(公告)日：2007-09-13

申请号：US11371998

申请日：2006-03-08

申请人： Kenny Gross ,  Alan Wood

发明人： Kenny Gross ,  Alan Wood

IPC分类号： G06F11/00

CPC分类号： G06F11/2041 ,  G06F11/1471 ,  G06F11/2025 ,  G06F11/203 ,  G06F11/2046

摘要： One embodiment of the present invention provides a system that enhances throughput and fault-tolerance in a parallel-processing system. During operation, the system first receives a task. Next, the system partitions N computing nodes into M set-aside nodes and N-M primary computing nodes, wherein M≧1. The system then processes the task in parallel across the N-M primary computing nodes. While doing so, the system proactively monitors the health of each of the N-M primary computing nodes. If the system detects a node in the N-M primary computing nodes to be at risk of failure, the system copies the portion of the task associated with the at-risk node to a subset of the M set-aside nodes. The system then processes the portion of the task in parallel across the subset of the M set-aside nodes while the N-M primary computing nodes continue executing.

摘要翻译： 本发明的一个实施例提供一种提高并行处理系统中的吞吐量和容错能力的系统。 在操作过程中，系统首先接收到一个任务。 接下来，系统将N个计算节点划分为M个置换节点和N-M个主要计算节点，其中M> = 1。 然后，系统在N-M主计算节点上并行处理任务。 在这样做的同时，系统主动监控每个N-M主计算节点的运行状况。 如果系统检测到N-M主计算节点中的节点处于故障风险，则系统将与风险中节点相关联的任务的一部分复制到M个备用节点的子集。 然后，在N-M主计算节点继续执行的同时，系统跨M个备用节点的子集并行地处理任务的该部分。

公开(公告)号：US20070088451A1

公开(公告)日：2007-04-19

申请号：US11545067

申请日：2006-10-06

申请人： Salman Akram ,  Warren Farnworth ,  Derek Gouchnour ,  David Hembree ,  Michael Hess ,  John Jacobson ,  James Wark ,  Alan Wood

发明人： Salman Akram ,  Warren Farnworth ,  Derek Gouchnour ,  David Hembree ,  Michael Hess ,  John Jacobson ,  James Wark ,  Alan Wood

IPC分类号： G06F19/00

CPC分类号： G03F7/7065 ,  G06F11/006 ,  H01L2223/5444

摘要： An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on ICs at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the ICs. The ID codes of the ICs are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the ICs is then accessed, and additional repair procedures the ICs may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.

摘要翻译： 在集成电路（IC）制造过程中的创造性方法，用于使用关于在探针上的IC进行的修复程序的数据，以确定是否在制造过程中稍后进行进一步的修理，包括将数据与每个的熔丝ID相关联地存储 IC。 IC的ID代码在制造过程中例如在打开/短路测试中自动读取。 然后访问与IC的ID代码相关联存储的数据，并且根据所访问的数据选择IC可能经历的附加修复过程。 因此，例如，访问的数据可以指示IC不可修复，因此IC可以直接进入废料仓，而不必被查询以确定其是否可修复，如在传统IC制造过程中所必需的。

公开(公告)号：US20070045515A1

公开(公告)日：2007-03-01

申请号：US11218126

申请日：2005-09-01

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： H01L27/00

CPC分类号： H01L27/14687 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L31/0232 ,  H01L2224/13

摘要： Microelectronic imaging devices and associated methods for attaching transmissive elements are disclosed. A manufacturing method in accordance with one embodiment of the invention includes providing an imager workpiece having multiple image sensor dies configured to detect energy over a target frequency. The image sensor dies can include an image sensor and a corresponding lens device positioned proximate to the image sensor. The method can further include positioning standoffs adjacent to the lens devices while the image sensor dies are connected to each other via the imager workpiece. At least one transmissive element can be attached to the workpiece at least proximate to the standoffs so the lens devices are positioned between the corresponding image sensors and the at least one transmissive element. Accordingly, the at least one transmissive element can protect the image sensors while the image sensor dies are still connected. In a subsequent process, the image sensor dies can be separated from each other.

公开(公告)号：US20060275949A1

公开(公告)日：2006-12-07

申请号：US11496180

申请日：2006-07-31

申请人： Warren Farnworth ,  Alan Wood ,  Trung Tri Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Tri Doan

IPC分类号： H01L21/00

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor substrate having protective polymer layers on up to six surfaces. The component also includes contacts on a circuit side of the substrate, conductive vias in electrical contact with the contacts, aNd conductors on a backside of the substrate. A method for fabricating the component includes the steps of providing the semiconductor substrate with the contacts on the circuit side, forming conductive vias from the back side in electrical contact with the contacts, and forming conductors on the backside.

摘要翻译： 半导体部件包括在多达六个表面上具有保护性聚合物层的变薄的半导体衬底。 该部件还包括在基板的电路侧的触点，与触点电接触的导电通孔，在基板的背面上的一个导体。 一种制造该部件的方法包括以下步骤：在电路侧提供半导体衬底上的触点，从背面形成与触点电接触的导电通孔，并在背面形成导体。

公开(公告)号：US20060261340A1

公开(公告)日：2006-11-23

申请号：US11494453

申请日：2006-07-28

申请人： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Kyle Kirby ,  Peter Benson ,  James Wark ,  Alan Wood ,  David Hembree ,  Salman Akram ,  Charles Watkins

发明人： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Kyle Kirby ,  Peter Benson ,  James Wark ,  Alan Wood ,  David Hembree ,  Salman Akram ,  Charles Watkins

IPC分类号： H01L29/04 ,  H01L33/00 ,  H01L29/768 ,  H01L27/148 ,  H01L31/0203

CPC分类号： H01L27/14618 ,  H01L23/481 ,  H01L24/48 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.

摘要翻译： 本文公开了微电子成像器和用于封装微电子成像器的方法。 在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。 导电晶片互连延伸穿过管芯并且与焊盘接触。 互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。 导电支撑构件由接合垫承载和突出。 图像传感器上的盖连接到支撑构件。

公开(公告)号：US20060255826A1

公开(公告)日：2006-11-16

申请号：US11409060

申请日：2006-04-24

申请人： Salman Akram ,  William Hiatt ,  Alan Wood ,  Charles Watkins ,  Kyle Kirby

发明人： Salman Akram ,  William Hiatt ,  Alan Wood ,  Charles Watkins ,  Kyle Kirby

IPC分类号： G01R31/26

CPC分类号： G01R31/2635 ,  G01R31/2831

摘要： Systems and methods for testing microelectronic imagers and microfeature devices are disclosed herein. In one embodiment, a method includes providing a microfeature workpiece including a substrate having a front side, a backside, and a plurality of microelectronic dies. The individual dies include an integrated circuit and a plurality of contact pads at the backside of the substrate operatively coupled to the integrated circuit. The method includes contacting individual contact pads with corresponding pins of a probe card. The method further includes testing the dies. In another embodiment, the individual dies can further comprise an image sensor at the front side of the substrate and operatively coupled to the integrated circuit. The image sensors are illuminated while the dies are tested.

摘要翻译： 本文公开了用于测试微电子成像器和微特征器件的系统和方法。 在一个实施例中，一种方法包括提供微功能工件，其包括具有正面，背面和多个微电子管芯的衬底。 各个管芯包括集成电路和在衬底的背面可操作地耦合到集成电路的多个接触焊盘。 该方法包括使各个接触垫与探针卡的相应引脚接触。 该方法还包括测试模具。 在另一个实施例中，各个管芯还可以包括在衬底的前侧的图像传感器，并可操作地耦合到集成电路。 在测试模具时，图像传感器被照亮。