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公开(公告)号：US06996903B2
公开(公告)日：2006-02-14
申请号：US10641182
申请日：2003-08-14
IPC分类号： H01K3/10
CPC分类号： H05K3/429 , H05K2201/0187 , H05K2201/096 , H05K2201/09645 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要： A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through nonplatable dielectric material within the dielectric layer. As a result, subsequent seeding and electroplating of the through hole results in a conductive metal plating forming at a wall of the through hole on a segment of the first laminate layer and on a segment of the second laminate layer, but not on the nonplatable dielectric material of the dielectric layer. Thus, the conductive metal plating is not continuous from the first laminate layer to the second laminate layer.
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公开(公告)号：US06872894B2
公开(公告)日：2005-03-29
申请号：US10379575
申请日：2003-03-06
CPC分类号： H05K3/462 , H05K3/321 , H05K3/4069 , H05K3/429 , H05K3/4623 , H05K2201/0347 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49151 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： An information handling system (e.g., computer, server, etc.) Utilizing at least one circuitized substrate assembly of robust construction and possessing enhanced operational capabilities. The substrate assemblies include a substrate having at least one opening which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.
摘要翻译： 信息处理系统（例如，计算机，服务器等）利用至少一个具有坚固结构并具有增强的操作能力的电路化基板组件。 衬底组件包括具有至少一个开口的衬底，其在接合之前基本上填充有导电膏。 一旦粘合，糊料也部分地位于另一个开口内，以提供与其的有效电连接。
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73.发明授权公开(公告)号：US06830627B1
公开(公告)日：2004-12-14
申请号：US09274935
申请日：1999-03-23
IPC分类号： B08B700
CPC分类号： C11D7/10 , C11D7/08 , C11D7/16 , C11D11/0047 , C23F1/18 , C23G1/103 , H05K1/167 , H05K3/383 , H05K2203/0796
摘要： The present invention is a persulfate microetchant composition especially useful for removing impurities from copper surfaces during fabrication of microelectronic packages. The microetchant formulation is characterized by its ability to selectively clean copper in the presence of nickel, nickel-phosphorous and noble metal alloys therefrom. Furthermore, no deleterious galvanic etching occurs in this microetchant-substrate system so that substantially no undercutting of the copper occurs. The combination of high selectivity and no undercutting allows for a simplification of the microelectronic fabrication process and significant improvements in the design features of the microelectronic package, in particular higher density circuits. The persulfate microetchant composition is stabilized with acid and phosphate salts to provide a process that is stable, fast acting, environmentally acceptable, has high capacity, and can be performed at room temperature. A preferred etchant composition is 100 gm/liter sodium persulfate, 3 volume % phosphoric acid and 0.058 molar sodium phosphate dibasic.
摘要翻译： 本发明是一种特别适用于在制造微电子封装期间从铜表面去除杂质的过硫酸盐微蚀剂组合物。 微蚀剂制剂的特征在于其在镍，镍 - 磷和贵金属合金存在下选择性地清洗铜的能力。 此外，在该微蚀刻 - 衬底系统中不会发生有害的电偶蚀刻，因此基本上不会发生铜的底切。 高选择性和无底切的组合允许微电子制造工艺的简化和微电子封装，特别是较高密度电路的设计特征的显着改进。 过硫酸盐微提取剂组合物用酸和磷酸盐稳定，以提供稳定，快速作用，环境可接受，具有高容量的方法，并且可以在室温下进行。 优选的蚀刻剂组合物为100g /升过硫酸钠，3体积％磷酸和0.058摩尔磷酸氢二钠。
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公开(公告)号：US06828514B2
公开(公告)日：2004-12-07
申请号：US10354000
申请日：2003-01-30
申请人： Benson Chan , John M. Lauffer , How T. Lin , Voya R. Markovich , David L. Thomas
发明人： Benson Chan , John M. Lauffer , How T. Lin , Voya R. Markovich , David L. Thomas
IPC分类号： H05K706
CPC分类号： H05K3/4688 , H01L23/3128 , H01L23/5383 , H01L25/0652 , H01L25/0655 , H01L25/18 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H01L2924/3025 , H05K1/024 , H05K1/113 , H05K3/4623 , H05K2201/09536 , H05K2201/096 , H05K2203/061 , Y10T29/49126 , Y10T29/49165 , H01L2224/0401
摘要： A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.
摘要翻译： 包括两个多层部分的多层PCB，其中之一能够电连接安装在PCB上的电子部件，以确保其间的高频连接。 PCB还包括常规PCB部分以降低成本，同时确保具有令人满意的整体厚度的结构以用于PCB领域。 这些组件的内部部分也可以进行耦合。 也提供了制造这些结构的方法。
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公开(公告)号：US06689543B2
公开(公告)日：2004-02-10
申请号：US10073558
申请日：2002-02-11
IPC分类号： G03C556
CPC分类号： H05K3/0032 , B23K2103/42 , B23K2103/50 , B41M5/24 , H05K1/0326 , H05K1/0373 , H05K2201/0112 , Y10S430/146
摘要： An epoxy based resin which exhibits good laser ablation and good adherence to a substrate such a copper is provided by adding to the resin a dye or dyes having substantial energy absorption at the emission wave lengths of lasers used to laser ablate the resin. The resin with the dye or dyes included is coated onto a substrate and cured, or laminated onto a substrate in the cured condition. The required openings are formed in the cured film by laser ablation. This allows for the use of optimum techniques to be used to form micro vias.
摘要翻译： 通过向树脂中添加染料或染料，在用于激光烧蚀树脂的激光器的发射波长处具有显着的能量吸收，提供了表现出良好的激光烧蚀和对衬底的良好粘合性的环氧树脂。 将含有染料或染料的树脂涂覆在基材上并固化，或在固化条件下层压到基材上。 通过激光烧蚀在所述固化膜中形成所需的开口。 这允许使用最佳技术来形成微通孔。
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公开(公告)号：US06426466B1
公开(公告)日：2002-07-30
申请号：US09501480
申请日：2000-02-09
IPC分类号： H05K102
CPC分类号： H05K1/0263 , H01R12/7088 , H05K3/325 , H05K3/403 , H05K3/4641 , H05K2201/0919 , H05K2201/10272 , H05K2201/2018
摘要： A printed wiring board structure having peripheral power input. A printed wiring board having internal conductive layers, wherein each internal conductive layer contains a plurality of tabs extending therefrom. Tabs of similar voltage are vertically aligned within the printed wiring board. A frame within which the printed wiring board is mounted is also provided. The frame, having connections mounted within an inner surface of the frame, electrically contacts the tabs along the periphery of the printed wiring board.
摘要翻译： 具有外围电源输入的印刷电路板结构。 一种具有内部导电层的印刷线路板，其中每个内部导电层包含从其延伸的多个翼片。 类似电压的标签在印刷电路板内垂直对齐。 还提供了安装印刷电路板的框架。 具有安装在框架的内表面内的连接的框架沿着印刷线路板的周边与接片电接触。
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公开(公告)号：US06423905B1
公开(公告)日：2002-07-23
申请号：US09562109
申请日：2000-05-01
IPC分类号： H05K103
CPC分类号： H05K3/4688 , H05K1/0271 , H05K3/429 , H05K2201/0133 , H05K2201/0195
摘要： A printed wiring board having a layered composite of metal planes and dielectric layers. At least one of the dielectric layers has a modulus lower than the modulus of the remaining dielectric material layers. A plating, extending through the layered composite, has a first land on a first external surface of the layered composite, a second land on a second external surface of the layered composite, and a barrel extending between the first land and the second land. The lower modulus dielectric material layer deforms during thermal excursions of the printed wiring board in such a way as to reduce the strains imposed on both the lands and the barrel of the plated through holes.
摘要翻译： 一种具有金属平面和电介质层的复合层的印刷电路板。 电介质层中的至少一个具有低于剩余介电材料层的模量的模量。 延伸穿过层状复合材料的电镀具有在层状复合材料的第一外表面上的第一焊盘，层状复合材料的第二外表面上的第二焊盘，以及在第一焊盘和第二焊盘之间延伸的镜筒。 在印刷线路板的热偏移期间，较低模量的介电材料层变形，以便减小施加在电镀通孔的焊盘和圆筒上的应变。
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公开(公告)号：US06361923B1
公开(公告)日：2002-03-26
申请号：US09375957
申请日：1999-08-17
IPC分类号： G03C173
CPC分类号： H05K3/0032 , B23K2103/42 , B23K2103/50 , B41M5/24 , H05K1/0326 , H05K1/0373 , H05K2201/0112 , Y10S430/146
摘要： An epoxy based resin which exhibits good laser ablation and good adherence to a substrate such a copper is provided by adding to the resin a dye or dyes having substantial energy absorption at the emission wave lengths of lasers used to laser ablate the resin. The resin with the dye or dyes included is coated onto a substrate and cured, or laminated onto a substrate in the cured condition. The required openings are formed in the cured film by laser ablation. This allows for the use of optimum techniques to be used to form micro vias.
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公开(公告)号：US06204456B1
公开(公告)日：2001-03-20
申请号：US09159938
申请日：1998-09-24
IPC分类号： H01R909
CPC分类号： H05K3/0094 , H01R12/523 , H05K3/0023 , H05K3/4602 , H05K2201/0209 , H05K2201/09536 , H05K2201/0959 , Y10T29/49165
摘要： Methods of filling apertures, for example, through holes, in substrates are provided. The methods utilize a dielectric film, preferably a photoimageable dielectric film, which is employed to fill the apertures and to form a dielectric film disposed above the substrate at the same time. As a result, the aperture fill material is the same as, and indeed continuous with, the dielectric film which is disposed on the substrate. The method employs the following steps: providing a substrate having apertures; providing a dielectric film disposed on the substrate covering the apertures, reflowing the dielectric film to flow into the apertures and to form a dielectric film adherent to the substrate, to provide a continuous dielectric extending from the dielectric film into the apertures. In certain embodiments, after filling, additional apertures, such as vias, are photoimaged in the dielectric film. Preferably the vias are then metallized, and circuitry formed atop the dielectric film.
摘要翻译： 提供了在基板中填充孔的方法，例如通孔。 该方法利用电介质膜，优选可光成像的介电膜，其用于填充孔并同时形成设置在基板上方的电介质膜。 结果，孔填充材料与设置在基底上的电介质膜相同，实际上是连续的。 该方法采用以下步骤：提供具有孔的基底; 提供设置在覆盖所述孔的基板上的电介质膜，回流所述电介质膜流入所述孔中并形成与所述衬底粘附的电介质膜，以提供从所述电介质膜延伸到所述孔中的连续电介质。 在某些实施例中，在填充之后，附加的孔，例如通孔，在电介质膜中被光刻。 优选地，将通孔金属化，并且在电介质膜的顶部形成电路。
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公开(公告)号：US6009619A
公开(公告)日：2000-01-04
申请号：US864632
申请日：1997-05-28
申请人： John M. Lauffer
发明人： John M. Lauffer
CPC分类号： H05K1/112 , H05K3/0023 , H05K3/225 , H05K3/3442 , H05K3/4652 , H05K1/0292 , H05K2201/0305 , H05K2201/0355 , H05K2201/09472 , H05K2201/10636 , H05K2203/0551 , H05K3/3452 , H05K3/4038 , Y02P70/611 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49156
摘要： An electronic circuit card and a process of manufacturing the electronic circuit card. The process includes the steps of providing the electronic circuit card with external electrical circuits. A photoimageable dielectric layer is formed on the electronic circuit card. A metal foil layer is laminated on the photoimageable dielectric layer and the metal foil layer is patterned to form a wire and a component add land pattern. The photoimageable dielectric layer is patterned and the wire and the component add land pattern are electrically connected to the electronic circuit card.
摘要翻译： 一种电子电路卡及其制造方法。 该过程包括为电子电路卡提供外部电路的步骤。 在电子电路卡上形成可光成像的电介质层。 在可光成像的介电层上层压金属箔层，对金属箔层进行图案化以形成导线和添加焊盘图案的部件。 将可光成像的介质层图案化，并将导线和部件添加焊盘图案电连接到电子电路卡。
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