公开(公告)号：USD997130S1

公开(公告)日：2023-08-29

申请号：US29720520

申请日：2020-01-14

Applicant: Jun Lu

Designer： Jun Lu

Abstract: FIG. 1 is a top, front, right side perspective view of an AUDIO INTERFACE, showing my design.
FIG. 2 is a bottom, rear, left side perspective view thereof.
FIG. 3 is a front elevation view thereof.
FIG. 4 is a rear elevation view thereof.
FIG. 5 is a left side elevation view thereof.
FIG. 6 is a right side elevation view thereof.
FIG. 7 is a top plan view thereof.
FIG. 8 is a bottom plan view thereof.
FIG. 9 is an enlarged view of an area labeled 9 in FIG. 1.
FIG. 10 is an enlarged view of an area labeled 10 in FIG. 1.
The evenly spaced dashed broken lines depict portions of the Audio Interface that form no part of the claimed design. The dot-dash line circles depict the limits of the enlarged views and form no part of the claimed design.

公开(公告)号：US09535566B2

公开(公告)日：2017-01-03

申请号：US13997752

申请日：2012-08-24

Applicant: Jun Lu ,  Yipeng Yang ,  Edwin L. Wang

Inventor： Jun Lu ,  Yipeng Yang ,  Edwin L. Wang

IPC: G06F3/00 ,  G06F3/048 ,  G06F3/0481 ,  G06F3/14 ,  G09G5/14 ,  G06F3/0484 ,  G09G5/42

CPC classification number: G06F3/0481 ,  G06F3/04842 ,  G06F3/1462 ,  G09G5/14 ,  G09G5/42 ,  G09G2370/022

Abstract: A device, method and system of displaying a file on a mobile communication device may comprise duplicating at least a leftmost part of a file to obtain a duplicated leftmost part of the file, and displaying a frame through moving a display window along the frame, the frame comprising a rightmost part of the file and the duplicated leftmost part of the file, wherein the duplicated leftmost part of the file is placed on right of the rightmost part of the file. In some embodiments, the mobile communication device may control the display window to automatically move to a leftmost side of the frame, if the display window moves to a rightmost side of the frame, and further in response to a user instruction of continuing viewing the file.

Abstract translation: 在移动通信设备上显示文件的装置，方法和系统可以包括复制文件的至少最左部分以获得文件的最左边部分，并且通过沿着帧移动显示窗口来显示帧， 所述文件的最右边部分和所述文件的最左边部分是所述文件的最右边部分，所述文件的最左边部分位于所述文件的最右边部分的右侧。 在一些实施例中，如果显示窗口移动到帧的最右侧，则移动通信设备可以控制显示窗口自动移动到帧的最左侧，并且还响应于用户继续观看文件的指令 。

公开(公告)号：US09496590B2

公开(公告)日：2016-11-15

申请号：US14042203

申请日：2013-09-30

Applicant: Stefan Vajda ,  Larry A. Curtiss ,  Jun Lu ,  Khalil Amine ,  Eric C. Tyo

Inventor： Stefan Vajda ,  Larry A. Curtiss ,  Jun Lu ,  Khalil Amine ,  Eric C. Tyo

IPC: H01M4/36 ,  H01M12/08 ,  H01M4/90 ,  C01D15/02 ,  H01M4/38

CPC classification number: H01M12/08 ,  C01D15/02 ,  H01M4/38 ,  H01M4/382 ,  H01M4/9058 ,  H01M2220/20 ,  H01M2300/0028 ,  H01M2300/0037 ,  Y02E60/128

Abstract: The invention provides a method for generating Li2O2 or composites of it, the method uses mixing lithium ions with oxygen ions in the presence of a catalyst. The catalyst comprises a plurality of metal clusters, their alloys and mixtures, each cluster consisting of between 3 and 18 metal atoms. The invention also describes a lithium-air battery which uses a lithium metal anode, and a cathode opposing the anode. The cathode supports metal clusters, each cluster consisting of size selected clusters, taken from a range of between approximately 3 and approximately 18 metal atoms, and an electrolyte positioned between the anode and the cathode.

Abstract translation: 本发明提供了一种生成Li 2 O 2或其复合物的方法，该方法在催化剂存在下使用锂离子与氧离子混合。 催化剂包括多个金属簇，它们的合金和混合物，每个簇由3至18个金属原子组成。 本发明还描述了使用锂金属阳极和与阳极相对的阴极的锂空气电池。 阴极支撑金属簇，每个簇由尺寸选定的簇组成，取自大约3至大约18个金属原子之间的范围，以及位于阳极和阴极之间的电解质。

公开(公告)号：US20160285107A1

公开(公告)日：2016-09-29

申请号：US14667524

申请日：2015-03-24

Applicant: Jun Lu ,  Khalil Amine ,  Larry A. Curtiss ,  Kah Chun Lau ,  Yang-Kook Sun ,  Yun Jung Lee ,  Xiangyi Luo

Inventor： Jun Lu ,  Khalil Amine ,  Larry A. Curtiss ,  Kah Chun Lau ,  Yang-Kook Sun ,  Yun Jung Lee ,  Xiangyi Luo

IPC: H01M4/90 ,  H01M4/92

CPC classification number: H01M4/9016 ,  H01M4/382 ,  H01M4/9041 ,  H01M4/92 ,  H01M4/923 ,  H01M12/08 ,  H01M2300/0028 ,  Y02E60/128

Abstract: A composition includes LiO2, reduced graphene oxide, and a metal catalyst or residue thereof.

Abstract translation: 组合物包括LiO 2，还原性氧化石墨烯，以及金属催化剂或其残余物。

公开(公告)号：US20160155688A9

公开(公告)日：2016-06-02

申请号：US14033140

申请日：2013-09-20

Applicant: Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu ,  Lei Shi ,  Liang Zhao ,  Ping Huang

Inventor： Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu ,  Lei Shi ,  Liang Zhao ,  Ping Huang

IPC: H01L23/495

CPC classification number: H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/16245 ,  H01L2924/13091 ,  H01L2924/00

Abstract: A power semiconductor package has an ultra thin chip with front side molding to reduce substrate resistance; a lead frame unit with grooves located on both side leads provides precise positioning for connecting numerous bridge-shaped metal clips to the front side of the side leads. The bridge-shaped metal clips are provided with bridge structure and half or fully etched through holes for relieving superfluous solder during manufacturing process.

公开(公告)号：US20160126214A1

公开(公告)日：2016-05-05

申请号：US14526518

申请日：2014-10-29

Applicant: Xiaotian Zhang ,  Jun Lu ,  Kai Liu

Inventor： Xiaotian Zhang ,  Jun Lu ,  Kai Liu

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29015 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/40499 ,  H01L2224/45144 ,  H01L2224/48106 ,  H01L2224/48108 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83048 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/84203 ,  H01L2224/84862 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/06 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: This invention discloses a semiconductor package with adhesive material pre-printed on the lead frame and chip, and the manufacturing method. The adhesive material is applied onto the chip carrier and the pin of the lead frame and also on the front electrode of the semiconductor chip via pre-printing. The back of the semiconductor chip is adhered on the chip carrier, and the front electrode of the semiconductor chip and the pin are connected respectively with a metal connector. The size, shape and thickness of the adhesive material are applied according to different application requirements according to size and shapes of the contact zone of the semiconductor chip and the metal connector. Particularly, the adhesive zones are formed by pre-printing the adhesive material thus significantly enhance the quality and performance of semiconductor products, and improves the productivity.

Abstract translation: 本发明公开了一种半导体封装，其具有预先印刷在引线框架和芯片上的粘合剂材料及其制造方法。 粘合剂材料通过预打印被施加到芯片载体和引线框架的引脚以及半导体芯片的前电极上。 半导体芯片的背面粘附在芯片载体上，并且半导体芯片的前电极和引脚分别与金属连接器连接。 根据不同的应用要求，根据半导体芯片和金属连接器的接触区域的尺寸和形状来施加粘合材料的尺寸，形状和厚度。 特别地，通过预先印刷粘合剂材料形成粘合剂区域，从而显着提高半导体产品的质量和性能，并提高生产率。

公开(公告)号：US09184117B2

公开(公告)日：2015-11-10

申请号：US13663694

申请日：2012-10-30

Applicant: Yueh-Se Ho ,  Yan Xun Xue ,  Hamza Yilmaz ,  Jun Lu

Inventor： Yueh-Se Ho ,  Yan Xun Xue ,  Hamza Yilmaz ,  Jun Lu

IPC: H01L29/40 ,  H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L23/4952 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49562 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L2221/68327 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13794 ,  H01L2224/13839 ,  H01L2224/1403 ,  H01L2224/16245 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/371 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40248 ,  H01L2224/40499 ,  H01L2224/405 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92225 ,  H01L2224/92226 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/00012

Abstract: The invention relates to a power semiconductor device and a preparation method, particularly relates to preparation of stacked dual-chip packaging structure of MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) using flip chip technology with two interconnecting plates. The first chip is flipped and attached on the base such that the first chip is overlapped with the third pin; the back metal layer of the first chip is connected to the bonding strip of the first pin through a first interconnecting plate; the second chip is flipped and attached on a main plate portion of the first interconnecting plate such that the second chip is overlapped with the fourth pin; and the back metal layer of the second chip is connected to the bonding strip of the second pin through the second interconnecting plate.

Abstract translation: 本发明涉及一种功率半导体器件及其制备方法，特别涉及使用具有两个互连板的倒装芯片技术来制备MOSFET（金属氧化物半导体场效应晶体管）的层叠双芯片封装结构。 第一芯片被翻转并附接在基座上，使得第一芯片与第三引脚重叠; 第一芯片的背金属层通过第一互连板连接到第一引脚的接合条; 第二芯片被翻转并附接在第一互连板的主板部分上，使得第二芯片与第四引脚重叠; 并且第二芯片的背金属层通过第二互连板连接到第二引脚的接合条。

公开(公告)号：US09084888B2

公开(公告)日：2015-07-21

申请号：US13294038

申请日：2011-11-10

Applicant: Per Rugaard Poulsen ,  Walther Fledelius ,  Paul Keall ,  Elisabeth Weiss ,  Jun Lu ,  Emily Brackbill ,  Geoffrey Hugo

Inventor： Per Rugaard Poulsen ,  Walther Fledelius ,  Paul Keall ,  Elisabeth Weiss ,  Jun Lu ,  Emily Brackbill ,  Geoffrey Hugo

IPC: G06K9/00 ,  A61N5/10 ,  G06T17/00

CPC classification number: G06T11/008 ,  A61N5/1049 ,  A61N2005/1061 ,  G06T17/00 ,  G06T2210/41

Abstract: A method of determining a model of a marker includes obtaining projection images, each of the projection images having an image of a marker that indicates a shape of the marker, determining binary images of the marker for respective ones of the projection images, and constructing a three-dimensional model of the marker using the binary images, the three-dimensional model comprising a set of voxels in a three-dimensional space that collectively indicates a three-dimensional shape of the marker, wherein the act of constructing the three-dimensional model is performed using a processing unit.

Abstract translation: 确定标记的模型的方法包括获得投影图像，每个投影图像具有指示标记的形状的标记的图像，确定各个投影图像的标记的二值图像，并且构建一个 使用二值图像的标记的三维模型，三维模型包括三维空间中的一组体素，其共同表示标记的三维形状，其中构建三维模型的动作 使用处理单元执行。

公开(公告)号：US09054091B2

公开(公告)日：2015-06-09

申请号：US13913770

申请日：2013-06-10

Applicant: Hamza Yilmaz ,  Yan Xun Xue ,  Jun Lu ,  Peter Wilson ,  Yan Huo ,  Zhiqiang Niu ,  Ming-Chen Lu

Inventor： Hamza Yilmaz ,  Yan Xun Xue ,  Jun Lu ,  Peter Wilson ,  Yan Huo ,  Zhiqiang Niu ,  Ming-Chen Lu

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/02 ,  H01L23/34 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/561 ,  H01L21/565 ,  H01L21/768 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/544 ,  H01L24/40 ,  H01L24/41 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/50 ,  H01L2223/5446 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73104 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A hybrid packaging multi-chip semiconductor device comprises a lead frame unit, a first semiconductor chip, a second semiconductor chip, a first interconnecting structure and a second interconnecting structure, wherein the first semiconductor chip is attached on a first die paddle and the second semiconductor chip is flipped and attached on a third pin and a second die paddle, the first interconnecting structure electrically connecting a first electrode at a front surface of the first semiconductor chip and a third electrode at a back surface of the second semiconductor chip and a second electrode at the front surface of the first semiconductor chip is electrically connected by second interconnecting structure.

Abstract translation: 一种混合封装多芯片半导体器件，包括引线框单元，第一半导体芯片，第二半导体芯片，第一互连结构和第二互连结构，其中第一半导体芯片附接在第一裸片上，第二半导体 芯片被翻转并附接在第三引脚和第二管芯焊盘上，第一互连结构电连接第一半导体芯片的前表面处的第一电极和第二半导体芯片的后表面处的第三电极和第二电极 在第一半导体芯片的前表面通过第二互连结构电连接。

公开(公告)号：US20150021780A1

公开(公告)日：2015-01-22

申请号：US13946949

申请日：2013-07-19

Applicant: Yuping Gong ,  Yan Xun Xue ,  Ming-Chen Lu ,  Ping Huang ,  Jun Lu ,  Hamza Yilmaz

Inventor： Yuping Gong ,  Yan Xun Xue ,  Ming-Chen Lu ,  Ping Huang ,  Jun Lu ,  Hamza Yilmaz

IPC: H01L23/13 ,  H01L23/00

CPC classification number: H05K3/306 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/06 ,  H01L24/24 ,  H01L24/25 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/89 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/24101 ,  H01L2224/24147 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73267 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2224/92224 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/15153 ,  H05K3/32 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/8384 ,  H01L2224/8485 ,  H01L2224/8385

Abstract: A thin power device comprises a substrate having a first set of first contact pads at a front surface of the substrate electrically connecting to a second set of second contact pads at a back surface of the substrate, a through opening opened from the front surface and through the substrate exposing a third contact pad at the back surface of the substrate, a semiconductor chip embedded into the through opening with a back metal layer at a back surface of the semiconductor chip attached on the third contact pad, and a plurality of conductive structures electrically connecting electrodes at a front surface of the semiconductor chip with the corresponding first contact pads in the first sets of first contact pads.

Abstract translation: 薄功率器件包括衬底，衬底在衬底的前表面处具有第一组第一接触焊盘，电连接到衬底的背面处的第二组第二接触焊盘，从前表面开口并穿过 所述基板在所述基板的背面暴露第三接触焊盘，在所述第三接触焊盘的所述半导体芯片的后表面处嵌入所述通孔中的背面金属层的半导体芯片，以及多个导电结构， 将所述半导体芯片的前表面处的电极与所述第一组第一接触焊盘中的对应的第一接触焊盘连接。