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    Substrate for mounting semiconductor chip and method for producing same
    71.
    发明授权
    Substrate for mounting semiconductor chip and method for producing same 有权
    用于安装半导体芯片的基板及其制造方法

    公开(公告)号：US08997341B2

    公开(公告)日：2015-04-07

    申请号：US13394688

    申请日：2010-09-06

    申请人： Yoshinori Ejiri ,  Kiyoshi Hasegawa ,  Takehisa Sakurai ,  Yoshiaki Tsubomatsu

    发明人： Yoshinori Ejiri ,  Kiyoshi Hasegawa ,  Takehisa Sakurai ,  Yoshiaki Tsubomatsu

    IPC分类号： H05K3/46 ,  H05K3/42 ,  H05K3/24 ,  H01L21/48 ,  H05K3/06 ,  H05K3/10

    CPC分类号： H05K3/244 ,  H01L21/4857 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K3/062 ,  H05K3/108 ,  H05K3/4644 ,  H05K3/4652 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

    摘要： It is an object of the invention to provide a method for producing a substrate for mounting a semiconductor chip, that can reduce bridging and allows excellent wire bondability and solder connection reliability to be obtained, even when forming fine-pitch wirings. The method for producing a substrate for mounting a semiconductor chip according to the invention comprises a resist-forming step in which a resist is formed on the first copper layer of a stack comprising an inner board with an inner layer circuit on the surface and a first copper layer formed on the inner board separated by an insulating layer at the sections other than those that are to constitute a conductor circuit, a conductor circuit-forming step in which a second copper layer is formed by electrolytic copper plating on the first copper layer to obtain a conductor circuit, a nickel layer-forming step in which a nickel layer is formed by electrolytic nickel plating on at least part of the conductor circuit, a resist removal step in which the resist is removed, an etching step in which the first copper layer is removed by etching, and a gold layer-forming step in which a gold layer is formed by electroless gold plating on at least part of the conductor circuit.

    摘要翻译： 本发明的目的是提供一种用于制造用于安装半导体芯片的基板的方法，即使在形成精细间距布线时也能够减少桥接并且能够获得优异的引线接合性和焊接连接可靠性。 根据本发明的用于制造用于安装半导体芯片的基板的方法包括抗蚀剂形成步骤，其中在包括在内表层电路的内板上的第一铜层上形成抗蚀剂，并且第一 铜层，其形成在内板上，除了构成导体电路的部分之外的绝缘层分隔开;导体电路形成步骤，其中通过在第一铜层上的电解铜电镀形成第二铜层， 获得导体电路，镍层形成步骤，其中在导体电路的至少一部分上通过电解镀镍形成镍层，去除抗蚀剂的抗蚀剂去除步骤，其中第一铜 通过蚀刻去除层，以及金层形成步骤，其中在导体电路的至少一部分上通过无电镀金形成金层。

    SERVO CONTROL DEVICE
    72.
    发明申请
    SERVO CONTROL DEVICE 有权
    伺服控制装置

    公开(公告)号：US20140117919A1

    公开(公告)日：2014-05-01

    申请号：US13980984

    申请日：2012-10-25

    申请人： Hidetoshi Ikeda ,  Yoshihiro Marushita ,  Koji Mahara ,  Kiyoshi Hasegawa ,  Hidemasa Ogi

    发明人： Hidetoshi Ikeda ,  Yoshihiro Marushita ,  Koji Mahara ,  Kiyoshi Hasegawa ,  Hidemasa Ogi

    IPC分类号： G05B6/02 ,  G05B5/01

    CPC分类号： G05B6/02 ,  G05B5/01

    摘要： A servo control device includes a follow-up control unit that controls a control target that drives a mechanical system by a motor, a command function unit that has input therein a phase signal θ indicating a phase of a cyclic operation performed by the control target, and that calculates a machine motion command according to the phase signal θ by a preset first function, a second derivative unit that uses a second function obtained by second-order differentiating the first function with respect to the phase signal to calculate a value of the second function according to the phase signal as a second-order differential base signal, a correction-value computation unit that computes a first command correction value for correcting the motor motion command by using a product of a square value of the phase velocity, the second-order differential base signal, and a first constant, and a correction-value addition unit that calculates the motor motion command based on an added value of the first command correction value and the machine motion command.

    摘要翻译： 一种伺服控制装置，包括：跟随控制单元，其控制由马达驱动机械系统的控制对象;命令功能单元，其中输入有相位信号; 指示由控制对象执行的循环操作的相位，并且根据相位信号计算机器运动命令; 通过预设的第一功能，二阶导数单元使用通过相对于相位信号对第一函数进行二阶微分而获得的第二函数，以根据相位信号计算第二函数的值作为二阶差分基极 信号，校正值计算单元，其通过使用相速度，二阶差分基准信号和第一常数的平方值的乘积来计算用于校正马达运动命令的第一命令校正值，以及校正 - 值附加单元，其基于第一命令校正值和机器运动命令的相加值来计算马达运动命令。

    Shield shell
    74.
    发明授权
    Shield shell 失效
    盾壳

    公开(公告)号：US08167653B2

    公开(公告)日：2012-05-01

    申请号：US12449542

    申请日：2008-02-29

    申请人： Kiyoshi Hasegawa ,  Sho Miyazaki ,  Fujio Sonoda

    发明人： Kiyoshi Hasegawa ,  Sho Miyazaki ,  Fujio Sonoda

    IPC分类号： H01R9/03

    CPC分类号： H01R13/6593 ,  H01R13/74

    摘要： A shield shell is composed of a tubular shell body made of a conductive resin and a metallic conductive body mounted in the shell body. The conductive body is capable of, in the base end part, connecting with a shielding member by being exposed on the surface of the shell body, while in the tip part, connecting with a shield case by being exposed on the surface of the shell body. The shielding member and the shield case are connected via the metallic conductive body of a low electric resistance, and thereby achieving excellent shielding performance in a low-frequency region in the shield shell.

    摘要翻译： 屏蔽壳由安装在壳体内的由导电树脂制成的管状壳体和金属导电体构成。 导电体能够在基端部通过露出在壳体的表面上与屏蔽构件连接，而在顶端部分中，通过暴露在壳体的表面上与屏蔽壳体连接 。 屏蔽构件和屏蔽壳体通过低电阻的金属导电体连接，从而在屏蔽壳体的低频区域中实现优异的屏蔽性能。