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78 条记录 (耗时 0.024 秒)

    Video signal processing device for writing and reading a video signal with respect to a memory according to different clocks, while preventing a write/read address pass-by in the memory
    72.
    发明授权
    Video signal processing device for writing and reading a video signal with respect to a memory according to different clocks, while preventing a write/read address pass-by in the memory 失效
    视频信号处理装置，用于根据不同的时钟相对于存储器写入和读取视频信号，同时防止存储器中的写入/读取地址通过

    公开(公告)号：US5861879A

    公开(公告)日：1999-01-19

    申请号：US722341

    申请日：1996-09-27

    申请人： Yutaka Shimizu ,  Hideaki Sasaki ,  Shigeru Sawada ,  Teruo Hotta

    发明人： Yutaka Shimizu ,  Hideaki Sasaki ,  Shigeru Sawada ,  Teruo Hotta

    IPC分类号： G09G5/00 ,  G09G5/12 ,  G09G5/397 ,  G09G5/399 ,  H04N7/50 ,  H04L7/00

    CPC分类号： G09G5/399 ,  H04N19/423 ,  H04N19/61 ,  G09G2340/0407 ,  G09G5/12

    摘要： An input video signal is written into alternate field memories M1 and M2, according to a timing clock from an input video clock generator. A display video signal is alternately read from those field memories, according to a timing clock from a display video clock generator. In switching a read memory, an address observation circuit judges whether or not a read/write address passes by a write/read address, referring to the condition of reading and writing operations. In this event, the circuit makes a judgement, based on the lag between a vertical synchronizing signals of an input video signal and of a display video signal, and a change of the lag with time. If it is judged that one address will pass by the other, the same read/write memory is again accessed for reading/writing. With this arrangement, there is provided a circuit having a relatively simple structure for preventing a match of read and write addresses.

    摘要翻译： 根据来自输入视频时钟发生器的定时时钟，将输入视频信号写入交替场存储器M1和M2。 根据来自显示视频时钟发生器的定时时钟，从这些场存储器交替地读取显示视频信号。 在切换读取存储器时，参考读写操作的条件，地址观察电路判断读/写地址是否通过写/读地址。 在这种情况下，电路基于输入视频信号的垂直同步信号和显示视频信号之间的滞后与滞后随时间的变化而进行判断。 如果判断一个地址将被另一个地址通过，则再次访问相同的读/写存储器以进行读/写。 利用这种布置，提供了一种具有相对简单结构的电路，用于防止读和写地址的匹配。

    Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals
    75.
    发明授权
    Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals 失效
    电子电路器件，连接焊料和焊料的方法，用于连接镀金端子

    公开(公告)号：US5136360A

    公开(公告)日：1992-08-04

    申请号：US563281

    申请日：1990-08-06

    申请人： Masahide Harada ,  Ryohei Satoh ,  Fumiyuki Kobayashi ,  Takaji Takenaka ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai

    发明人： Masahide Harada ,  Ryohei Satoh ,  Fumiyuki Kobayashi ,  Takaji Takenaka ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai

    IPC分类号： B23K35/22 ,  B23K35/26 ,  C22C13/00 ,  H01L21/60 ,  H01L23/488 ,  H05K3/34

    CPC分类号： H05K3/3463 ,  B23K35/262 ,  H01L23/488 ,  H01L2224/16225

    摘要： An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.0 wt % of Ag and the balance of Sn and a method of connecting an electronic part having a gold-plated connecting terminal arranged thereon to a circuit substrate, which comprises the steps of placing the electronic part and the gold-plated connected terminal so as to face each other via a solder and then melting the solder to connect and fix the connecting terminal to the circuit substrate onto the predetermined element thereof, the composition of said solder consisting of 1.0 to 8.0 wt % Ag and the balance of Sn.

    摘要翻译： 一种电子电路装置，包括电子部件，该电子部件具有通过焊料连接到其预定连接元件上的电路基板上的镀金连接端子，其中电子部件的连接端子和电路的焊接部分 基材由1.0〜8.0重量份的合金组成构成。 提供Ag的％，0.1〜6.0重量％的Au和余量的Sn。 该装置通过使用焊料制成，用于连接由1.0至8.0重量％的Ag组成的镀金连接端子和余量的Sn，以及连接其上布置有镀金连接端子的电子部件的方法 电路基板，其包括以下步骤：通过焊料将电子部件和镀金连接的端子放置成彼此面对，然后熔化焊料以将连接端子连接并固定到电路基板到预定元件 所述焊料的组成由1.0至8.0重量％的Ag和余量的Sn组成。

    Automatic wiring machine for printed circuit boards
    77.
    发明授权
    Automatic wiring machine for printed circuit boards 失效
    印刷电路板自动接线机

    公开(公告)号：US4437603A

    公开(公告)日：1984-03-20

    申请号：US221458

    申请日：1980-12-30

    申请人： Mamoru Kobayashi ,  Kanji Ishige ,  Hideaki Sasaki ,  Mitsukiyo Tani ,  Yashuhiko Kawakami

    发明人： Mamoru Kobayashi ,  Kanji Ishige ,  Hideaki Sasaki ,  Mitsukiyo Tani ,  Yashuhiko Kawakami

    IPC分类号： G05B19/40 ,  G05B19/414 ,  H05K3/10 ,  H05K13/06

    CPC分类号： H05K13/06 ,  G05B19/40 ,  G05B19/4142 ,  G05B2219/34239 ,  Y10T29/49162

    摘要： A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head. The wire guide unit sequentially pays out the insulated fine wire onto the printed circuit board carried by the X-Y table, the bonding unit exposes the core of the payed-out insulated wire and fuses the wire for connection thereof to the conductor pad of the printed circuit board by heating and depressing the payed-out wire, and the wire cutter unit cuts away the wire after completion of wiring.

    摘要翻译： 在布线图案的印刷电路板上自动布线作为布线图案的印刷电路板上的毛发的绝缘细线的机器被设置在相邻的要布线的导体印刷电路板之间，该XY台可在X和Y方向上移动 ，并且XY台根据配线位置移动。 安装在XY工作台上方的线引导单元，接合单元和线切割器单元围绕垂直于XY工作台表面的轴可旋转地支撑的头部被旋转，以便在各个方向上被定向成光学 支撑装置用于沿着键合头的旋转轴从上方对操作进行光学监视。 导线单元顺序地将绝缘细线支撑到由XY工作台承载的印刷电路板上，接合单元暴露所付出的绝缘电线的芯并将导线熔接到印刷电路板的导体焊盘上 通过加热和压下付出的电线，线切割器单元在接线完成之后切断电线。

    Process for producing expandable thermoplastic resin beads
    78.
    发明授权
    Process for producing expandable thermoplastic resin beads 失效
    用于生产可膨胀热塑性树脂珠粒的方法

    公开(公告)号：US4303756A

    公开(公告)日：1981-12-01

    申请号：US207422

    申请日：1980-11-17

    申请人： Mutsuhiko Kajimura ,  Hideaki Sasaki

    发明人： Mutsuhiko Kajimura ,  Hideaki Sasaki

    IPC分类号： C08F255/04 ,  C08J9/18 ,  C08J9/16

    CPC分类号： C08J9/18 ,  C08F255/04 ,  C08J2351/06

    摘要： A process for producing expandable thermoplastic resin beads which comprises suspending in an aqueous medium 20 to 70% by weight of a random copolymer of propylene and ethylene containing 1 to 10% by weight of ethylene and 99 to 90% by weight of propylene and 30 to 80% by weight of a vinyl aromatic monomer such as styrene, polymerizing the vinyl aromatic monomer in the presence of a polymerization catalyst to graft the vinyl aromatic monomer onto the backbone of the random copolymer and, optionally, adding a cross-linking agent, to form graft-copolymerized thermoplastic resin beads, and introducing a blowing agent into the thermoplastic resin beads. The resulting resin beads have excellent foamability and molding fusability, and a foamed shaped article having superior thermal stability can be prepared from these beads.

    摘要翻译： 一种制造可膨胀热塑性树脂珠粒的方法，其包括在水性介质中悬浮20至70重量％的丙烯和乙烯的无规共聚物，其含有1至10重量％的乙烯和99至90重量％的丙烯，30至30重量％ 80重量％的乙烯基芳族单体如苯乙烯，在聚合催化剂的存在下聚合乙烯基芳族单体，将乙烯基芳族单体接枝到无规共聚物的主链上，并任选加入交联剂至 形成接枝共聚的热塑性树脂珠，并将发泡剂引入到热塑性树脂珠中。 所得到的树脂珠具有优异的发泡性和成型熔融性，并且可以从这些珠制备具有优异的热稳定性的发泡成型制品。