公开(公告)号：US20090162595A1

公开(公告)日：2009-06-25

申请号：US11960575

申请日：2007-12-19

Applicant: Chan Ko ,  Doug Wilson ,  Jim Akeley ,  Prakash Mallya ,  James T. Tse ,  Yukihiko Sasaki

Inventor： Chan Ko ,  Doug Wilson ,  Jim Akeley ,  Prakash Mallya ,  James T. Tse ,  Yukihiko Sasaki

IPC: B32B9/00 ,  B29C65/00 ,  B05B7/06

CPC classification number: B05C5/0245 ,  B05C5/0254 ,  B05C5/027 ,  B05C9/06 ,  B32B7/06 ,  B32B7/14 ,  B32B27/10 ,  B32B27/20 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  B32B29/005 ,  B32B2255/12 ,  B32B2255/26 ,  B32B2307/308 ,  B32B2307/542 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2535/00 ,  C09J7/38 ,  C09J2201/36 ,  C09J2201/40 ,  C09J2409/00 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2483/00 ,  Y10T156/10 ,  Y10T428/1481

Abstract: Structured adhesive constructions are provided. The adhesive constructions comprise a layer of a first adhesive with a first property and a layer of a second adhesive with a second property. The layer of the first adhesive comprises a plurality of spaced apart stripes of adhesive, coated on or laminated to a facestock or release liner. The layer of the second adhesive comprises a plurality of spaced apart stripes of adhesive, coated on or laminated to the facestock or release liner and located between the plurality of stripes of the first adhesive. The use of two different adhesives enables manipulation of desired adhesive properties in a single adhesive construction. The resulting adhesive may have two or more different desired properties, such as adherence at both high and low temperatures, or initial repositionability followed by permanent adhesion, or other combinations of desired properties. A coating die and a method of coating structured adhesive constructions are also provided.

Abstract translation: 提供结构化粘合剂结构。 粘合剂结构包括具有第一特性的第一粘合剂层和具有第二特性的第二粘合剂层。 第一粘合剂的层包括多个间隔开的粘合剂条，涂覆在面层或剥离衬垫上或层压到面材或剥离衬垫上。 第二粘合剂层包括多个间隔开的粘合剂条，涂覆在面层或剥离衬垫上或层压在面材或剥离衬垫上并位于第一粘合剂的多个条之间。 使用两种不同的粘合剂可以在单一粘合剂结构中操作所需的粘合剂性质。 所得粘合剂可具有两种或更多种不同的期望性质，例如在高温和低温下的粘附性，或初始重新定位性，随后永久粘合，或所需性质的其它组合。 还提供了涂覆模具和涂覆结构化粘合剂结构的方法。

公开(公告)号：US07517724B2

公开(公告)日：2009-04-14

申请号：US10556535

申请日：2005-03-15

Applicant: Keiichi Hatakeyama ,  Michio Uruno ,  Takayuki Matsuzaki ,  Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata

Inventor： Keiichi Hatakeyama ,  Michio Uruno ,  Takayuki Matsuzaki ,  Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata

IPC: H01L21/00

CPC classification number: C09J163/10 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J7/35 ,  C09J133/068 ,  C09J161/06 ,  C09J161/28 ,  C09J175/14 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2475/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/73265 ,  H01L2224/83191

Abstract: The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).

Abstract translation: 本发明提供一种切割/切片接合片，其可以在切割时用作切割带，能够在拾取期间将半导体元件和粘合剂层与压敏粘合剂层容易地分离，并且其中粘合剂层具有令人满意的 作为芯片接合材料的粘合性。 一种切片/芯片粘接片，其中所述压敏粘合剂层包含含有碘值为0.5至20的分子内，可辐射固化碳 - 碳双键的化合物（A）和至少一种选自以下的化合物（B）： 由聚异氰酸酯，三聚氰胺 - 甲醛树脂和环氧树脂组成的组，并且粘合剂层包含环氧树脂（a），羟基当量至少为150g / eq的酚醛树脂（b），环氧基 - 含有丙烯酸共聚物（c），包含0.5-6重量％的丙烯酸缩水甘油酯或甲基丙烯酸缩水甘油酯，重均分子量至少为100,000，填料（d）和固化促进剂（e）。

公开(公告)号：US07485494B2

公开(公告)日：2009-02-03

申请号：US11413938

申请日：2006-04-27

Applicant: Byoung-Un Kang ,  Jai-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Dong-Cheon Shin ,  Kyung-Tae Wi

Inventor： Byoung-Un Kang ,  Jai-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Dong-Cheon Shin ,  Kyung-Tae Wi

IPC: H01L21/00

CPC classification number: H01L24/29 ,  C09J7/10 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2463/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.

Abstract translation: 本发明的半导体用切割模粘合膜具有3层结构，其包括附着在半导体晶片背面的第一粘接层; 附着在第一粘合剂层上的第二粘合剂层; 以及附着在第二粘合剂层上的切割膜，因此具有能够确保半导体封装工艺的可靠性的优点，因为它可以防止模切现象和切割过程中的模具拾取不良并保持足够的 模头与芯片之间的粘合力。

公开(公告)号：US20080202662A1

公开(公告)日：2008-08-28

申请号：US11917243

申请日：2005-12-02

Applicant: Marc Husemann ,  Reinhard Storbeck

Inventor： Marc Husemann ,  Reinhard Storbeck

IPC: B31B1/60 ,  B32B15/04

CPC classification number: G02F1/133603 ,  B32B7/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/4026 ,  B32B2307/41 ,  B32B2307/416 ,  B32B2405/00 ,  B32B2457/202 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/36 ,  C09J2205/102 ,  C09J2400/163 ,  G02F2202/28 ,  Y10T156/10 ,  Y10T428/265 ,  Y10T428/2848

Abstract: Disclosed is a pressure-sensitive adhesive tape, especially for creating adhesion of optical liquid crystal displays (LCDs), comprising a top face with light-reflective properties and a bottom face with light-absorbing properties, and a support film with a top face and a bottom face. Both faces of the contact-sensitive adhesive tape are provided with an outer pressure-sensitive adhesive layer (layers b, b′). The inventive pressure-sensitive adhesive tape includes at least one white-colored layer for creating the light-reflective effect and at least one pressure-sensitive adhesive layer (layer c) that is dyed black in order to create the light-absorbing effect are provided between the outer pressure-sensitive adhesive layers while at least the pressure-sensitive adhesive layer on the top face is transparent.

Abstract translation: 公开了一种压敏粘合带，特别是用于产生具有光反射性的顶面和具有光吸收性的底面的光学液晶显示器（LCD）的粘附性，以及具有顶面的支撑膜， 一个底面。 接触敏感性粘合带的两面设有外部粘合剂层（b，b'层）。 本发明的压敏粘合带包括至少一个用于产生光反射效果的白色层，并且提供了至少一个为了产生光吸收效果而染成黑色的压敏粘合剂层（层c） 在外部粘合剂层之间，而至少顶面上的压敏粘合剂层是透明的。

公开(公告)号：US20080160293A1

公开(公告)日：2008-07-03

申请号：US10591940

申请日：2005-02-18

Applicant: Yukio Arimitsu ,  Daisuke Shimokawa

Inventor： Yukio Arimitsu ,  Daisuke Shimokawa

IPC: B32B5/18 ,  B32B37/12

CPC classification number: H01L21/6835 ,  C09J5/08 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/0058 ,  Y10T428/249984 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2848

Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer caused by pressurization, further reduce chipping in grinding and cutting processes, be easily peeled off from a processed article after processing, and can be easily applied to an adhered at ordinary temperature.The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate, the heat-expandable pressure-sensitive adhesive layer containing a foaming agent and having a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The adhesive sheet further includes a pressure-sensitive adhesive layer being arranged on or above the heat-expandable pressure-sensitive adhesive layer and having a shear modulus (23° C.) of less than 7×106 Pa. The pressure-sensitive adhesive layer arranged on the heat-expandable pressure-sensitive adhesive layer preferably has a thickness of 0.01 to 10 μm.

Abstract translation: 公开了一种可以防止由加压引起的压敏粘合剂层的变形的热剥离性粘合片，进一步减少研磨和切割过程中的碎屑，在加工后容易从加工品中剥离，并且可以 容易在普通温度下施加于粘附物。 热剥离性粘合片包括基材和布置在基材的至少一侧上方的热膨胀性压敏粘合剂层，所述热膨胀性压敏粘合剂层含有发泡剂，并且具有 在7×10 -6 Pa以上的未发泡状态下的剪切模量（23℃）。 粘合片还包括压敏粘合剂层，其设置在热膨胀性压敏粘合剂层上或上方，并且具有小于7×10 6 Pa的剪切模量（23℃）。 布置在热膨胀性压敏粘合剂层上的压敏粘合剂层的厚度优选为0.01〜10μm。

公开(公告)号：US07282257B2

公开(公告)日：2007-10-16

申请号：US10875278

申请日：2004-06-25

Applicant: Hiroshi Orikabe ,  Kenji Kawai

Inventor： Hiroshi Orikabe ,  Kenji Kawai

IPC: B32B7/02

CPC classification number: B32B27/20 ,  B32B27/08 ,  B32B2309/105 ,  B32B2405/00 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/36 ,  H05K3/4661 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/066 ,  H05K2203/124 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24959 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/254 ,  Y10T428/259

Abstract: The present invention relates to resin compositions that are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being roughened by an oxidizing agent.

Abstract translation: 本发明涉及可用于制备粘合剂膜的树脂组合物，其又可用于形成具有优异机械强度且能够被氧化剂粗糙化的多层印刷线路板的层间绝缘层。

公开(公告)号：US20070148443A1

公开(公告)日：2007-06-28

申请号：US10584226

申请日：2004-12-16

Applicant: Walter Blum ,  Dirk Wester ,  Volker Wiegmann

Inventor： Walter Blum ,  Dirk Wester ,  Volker Wiegmann

IPC: B32B7/12 ,  B32B15/04

CPC classification number: C09J5/08 ,  C09J7/10 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2409/00 ,  C09J2431/00 ,  C09J2433/00 ,  C09J2453/00 ,  Y10S428/906 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2848 ,  Y10T428/2883

Abstract: Self-adhesive, flexible sealing tapes, comprising at least one flexible, self-adhesive core or at least one flexible, self-adhesive carrier layer provided with an envelope or two-sided coating consisting of a second adhesive system.

Abstract translation: 自粘性柔性密封带，包括至少一个柔性的，自粘的芯或至少一个柔性的自粘合载体层，其具有由第二粘合剂体系组成的外壳或双面涂层。

公开(公告)号：US20070141330A1

公开(公告)日：2007-06-21

申请号：US11700142

申请日：2007-01-31

Applicant: Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata ,  Takanori Yamakawa

Inventor： Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata ,  Takanori Yamakawa

IPC: B32B37/12 ,  B32B38/10 ,  B32B38/04 ,  B32B7/12 ,  B32B15/04

CPC classification number: H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/561 ,  H01L21/563 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: A wafer-processing tape, having a removable adhesive layer(2), and an adhesive layer (3), formed on a substrate film(1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.

Abstract translation: 一种形成在基片（1）上的具有可去除的粘合剂层（2）和粘合剂层（3）的晶片加工带，其特征在于，该方法包括以下步骤：研磨 具有凸型金属电极（4）的晶片电路基板（5），并且将所述晶片电路基板切割成芯片，所述芯片粘贴在所述晶片电路基板上。 并且拾取芯片，其中粘合剂层（3）从基材膜（1）剥离但结合到单个芯片的状态下拾取芯片。

公开(公告)号：US07217455B2

公开(公告)日：2007-05-15

申请号：US10477567

申请日：2002-05-20

Applicant: Benito Valdez

Inventor： Benito Valdez

IPC: B32B7/12

CPC classification number: C09J7/385 ,  C09J7/10 ,  C09J7/35 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2205/11 ,  C09J2423/00 ,  Y10T428/14 ,  Y10T428/249983 ,  Y10T428/249985 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2826 ,  Y10T428/2891

Abstract: The present invention relates to an adhesive tape and to a method for its manufacture, the tape comprising: (A) a heat-activatable adhesive resin layer, wherein the resin is a polymer of one or more monomers selected from the group consisting of olefins, and (B) a pressure-sensitive adhesive layer, comprising an acrylic-type pressure sensitive adhesive, wherein said pressure sensitive adhesive layer is permanently and directly bonded to a first major surface of said heat-activatable adhesive layer. The present invention also relates to an intermediate article comprising the heat-activatable adhesive resin layer (A) releasably bonded to a support layer, to a composite article comprising the adhesive tape and a rubber article bonded to the second major surface of the heat-activatable layer (A), and to a vehicle comprising the composite article.

Abstract translation: 胶带及其制造方法技术领域本发明涉及一种胶带及其制造方法，所述胶带包括：（A）可热活化的粘合树脂层，其中所述树脂是一种或多种选自以下的单体的聚合物：烯烃， 和（B）压敏粘合剂层，其包含丙烯酸类压敏粘合剂，其中所述压敏粘合剂层永久地并且直接粘合到所述可热激活的粘合剂层的第一主表面。 本发明还涉及一种中间制品，其包括可释放地结合到支撑层的可热激活的粘合树脂层（A），所述中间制品包括粘合带和粘合到可热激活的第二主表面上的橡胶制品的复合制品 层（A），以及包含复合制品的车辆。

公开(公告)号：US20070090299A1

公开(公告)日：2007-04-26

申请号：US11583699

申请日：2006-10-20

Applicant: Shouhei Kozakai ,  Nobuhiro Ichiroku

Inventor： Shouhei Kozakai ,  Nobuhiro Ichiroku

IPC: G01T1/24 ,  G01T1/20 ,  H01L27/146 ,  H01L25/00 ,  H01L27/00

CPC classification number: C09J163/00 ,  C08L63/00 ,  C08L79/08 ,  C08L83/00 ,  C08L2666/14 ,  C08L2666/20 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/38 ,  C09J179/08 ,  C09J183/10 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2479/08 ,  C09J2483/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/31663 ,  Y10T428/31721 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An adhesive composition comprising 5 to 60 wt % of (A) a polyimidesilicone resin 5 to 60 wt % of (B) an epoxy resin having a softening point of 80° C. or lower, 0.001 to 20 wt % of (C) at least one epoxy resin curing catalyst selected from imidazole compounds and dicyandiamide 20 to 70 wt % of (D) spherical silica having an average diameter of 0.1 to 10 μm, and 5 to 30 wt % of (E) spherical fine particles of silicone rubber composite, wt % being based on a total weight of the composition.

Abstract translation: 一种粘合剂组合物，其包含5至60重量％的（A）聚酰亚胺硅酮树脂5至60重量％的（B）软化点为80℃或更低的环氧树脂，（C）在 选自咪唑化合物和双氰胺的至少一种环氧树脂固化催化剂20至70重量％的（D）平均直径为0.1至10微米的球形二氧化硅和5至30重量％的（E）球形微粒硅橡胶复合材料 ，wt％是基于组合物的总重量。