公开(公告)号：US4810048A

公开(公告)日：1989-03-07

申请号：US788258

申请日：1985-10-17

申请人： Hideki Asano ,  Shuji Eguchi ,  Seikichi Tanno ,  Yoshiaki Okabe ,  Noriaki Taketani ,  Masanori Nemoto ,  Tuneo Narusawa ,  Yoshimitsu Mihara ,  Yukihiko Takada

发明人： Hideki Asano ,  Shuji Eguchi ,  Seikichi Tanno ,  Yoshiaki Okabe ,  Noriaki Taketani ,  Masanori Nemoto ,  Tuneo Narusawa ,  Yoshimitsu Mihara ,  Yukihiko Takada

IPC分类号： H05K7/04 ,  G02B6/12 ,  G11B33/02 ,  G11B33/12 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/30

CPC分类号： G11B33/12 ,  G02B6/12004 ,  G11B33/02 ,  H05K1/0284 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/18 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/1327 ,  H05K3/301

摘要： This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread out on the substrate surface.

摘要翻译： 本发明包括具有安装有机械部件的基座的统一电路，并且涉及设置有衬底和埋置在衬底中和/或扩散在衬底表面上的电路的机械部件安装底盘。

公开(公告)号：US4772496A

公开(公告)日：1988-09-20

申请号：US875034

申请日：1986-06-16

申请人： Masahiko Maeda ,  Kenzi Fuzitani ,  Yoshihiro Moteki

发明人： Masahiko Maeda ,  Kenzi Fuzitani ,  Yoshihiro Moteki

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  C08L23/08

CPC分类号： H05K1/0326 ,  H05K1/036 ,  H05K3/0014 ,  H05K3/0064 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2203/1327 ,  Y10S428/901 ,  Y10T428/1359 ,  Y10T428/24917 ,  Y10T428/31692 ,  Y10T428/31699

摘要： A molded product having a printed circuit board on a thermoplastic layer is disclosed, the printed circuit board comprising a conductive metal layer and a thin-wall body containing a crosslinked product of a mixture of (A) 1 to 99 wt % of an ethylenic copolymer containing at least one monomer unit selected from the group consisting of monocarboxylic acid unit, dicarboxylic acid unit, acid anhydride unit thereof and half ester unit thereof and (B) 99 to 1 wt % of an ethylenic copolymer containing at least one monomer unit selected from the group consisting of hydroxyl unit, amino unit and oxirane unit.

摘要翻译： 公开了一种在热塑性层上具有印刷电路板的模制产品，印刷电路板包括导电金属层和薄壁体，该薄壁体含有（A）1-99重量％乙烯共聚物 含有选自单羧酸单元，二羧酸单元，其酸酐单元和其半酯单元的至少一种单体单元和（B）99至1重量％的含有至少一个选自以下的单体单元的乙烯共聚物： 由羟基单元，氨基单元和环氧乙烷单元组成的组。

公开(公告)号：US4710419A

公开(公告)日：1987-12-01

申请号：US842183

申请日：1986-03-21

申请人： Vernon C. Gregory

发明人： Vernon C. Gregory

IPC分类号： B29C45/14 ,  H05K1/00 ,  H05K3/00 ,  H05K3/06 ,  B32B3/00 ,  B44C1/22 ,  G03C5/00

CPC分类号： H05K3/0014 ,  B29C45/14639 ,  H05K1/0393 ,  H05K2201/09118 ,  H05K2203/1327 ,  H05K3/06 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T428/24926

摘要： A molding process and resulting product is disclosed in which a printed circuit pattern carrier is placed in a mold and is molded to an insulation carrier. The insulation carrier is disclosed as a printed circuit board or the interior of the insulation housing for an electrical product. Plural laminations molded atop one another are disclosed. The printed circuit carrier has mold gate openings to enable molding of features which extend above the plane of the conductive layer. A printed circuit pattern is applied before the molding step.

摘要翻译： 公开了一种成型工艺和所得到的产品，其中将印刷电路图案载体放置在模具中并被模制到绝缘载体上。 绝缘载体公开为印刷电路板或用于电气产品的绝缘壳体的内部。 公开了彼此成型的多个叠片。 印刷电路载体具有模具门开口，以能够模制在导电层的平面之上延伸的特征。 在成型步骤之前应用印刷电路图案。

公开(公告)号：US3301730A

公开(公告)日：1967-01-31

申请号：US10022661

申请日：1961-04-03

申请人： ROGERS CORP

发明人： LAZARUS SPIWAK ,  TRAUT GEORGE R ,  ANDERSON PAUL L ,  ZAGUSTA JOHN A

IPC分类号： H05K1/00 ,  H05K3/04 ,  H05K3/38

CPC分类号： H05K3/041 ,  H05K1/0393 ,  H05K3/386 ,  H05K2203/0108 ,  H05K2203/1327 ,  Y10T29/49155 ,  Y10T156/108

公开(公告)号：US12096562B2

公开(公告)日：2024-09-17

申请号：US18644647

申请日：2024-04-24

申请人： TactoTek Oy

发明人： Mikko Heikkinen ,  Jarmo Sääski ,  Ilpo Hänninen ,  Antti Keränen ,  Tomi Simula ,  Vinski Bräysy ,  Pälvi Apilo ,  Pasi Korhonen ,  Topi Wuori

IPC分类号： H05K1/02 ,  B29C51/14 ,  G01P1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/14 ,  H05K3/30 ,  B29L31/34

CPC分类号： H05K1/185 ,  B29C51/14 ,  G01P1/02 ,  H05K3/0014 ,  H05K3/306 ,  B29L2031/3425 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2203/1327 ,  H05K2203/166

摘要： An interface assembly includes a functional multilayer structure that includes a first substrate a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

公开(公告)号：US11826169B2

公开(公告)日：2023-11-28

申请号：US18143900

申请日：2023-05-05

申请人： Force Impact Technologies, Inc.

发明人： Anthony M. Gonzales ,  Robert M. Merriman ,  Susan M. Merriman ,  Christopher T. Cooper

IPC分类号： A61B5/00 ,  H05K1/18 ,  H05K3/28 ,  G06F3/16 ,  B29C51/30 ,  G01C17/02 ,  A63B71/08 ,  B29C51/26 ,  A61B5/11 ,  G01C19/00 ,  G06F3/01 ,  G01P15/00 ,  H05K1/02 ,  B29C51/12 ,  B29L31/00 ,  B29L31/52

CPC分类号： A61B5/682 ,  A61B5/1126 ,  A61B5/4064 ,  A61B5/742 ,  A61B5/7455 ,  A63B71/085 ,  B29C51/12 ,  B29C51/266 ,  B29C51/30 ,  G01C17/02 ,  G01C19/00 ,  G01P15/00 ,  G06F3/016 ,  G06F3/16 ,  H05K1/028 ,  H05K1/189 ,  H05K3/284 ,  A61B2503/10 ,  A61B2560/0214 ,  A61B2562/0219 ,  A63B2220/40 ,  A63B2220/53 ,  B29L2031/52 ,  B29L2031/768 ,  H05K2201/09027 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2203/1322 ,  H05K2203/1327

摘要： A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

公开(公告)号：US11751337B2

公开(公告)日：2023-09-05

申请号：US16821568

申请日：2020-03-17

申请人： Honda Motor Co., Ltd.

发明人： Alex W. Baker ,  Zainab I. Ali

IPC分类号： H05K3/28 ,  H02J50/12 ,  F21S43/14 ,  H05K1/16 ,  H05K1/18 ,  B29C45/14 ,  B29L31/34

CPC分类号： H05K3/284 ,  B29C45/14336 ,  F21S43/14 ,  H02J50/12 ,  H05K1/165 ,  H05K1/181 ,  B29L2031/3425 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

摘要： A functional vehicle component and related methods include a transmitter coil and a molded part. The molded part includes a first thermoformed film, a molded polymeric structural layer arranged under the film, a printed electronic circuit arranged under the film and adjacent the structural layer, an optional second thermoformed film, and graphics on the first film. The electronic circuit includes a receiver coil, conductive traces, and electronic elements. The first film is arranged to cover the polymeric structural layer and the electronic circuit to thereby define an exposed surface of the molded part. The first film and/or the graphics camouflages the circuit. The transmitter coil is connected to an external power source, and is arranged on the molded part such that the receiver coil is inductively coupled to the transmitter coil so as to wirelessly power the electronic elements of the circuit.

公开(公告)号：US20190050706A1

公开(公告)日：2019-02-14

申请号：US16164322

申请日：2018-10-18

申请人： COMPOSECURE, LLC

发明人： Adam Lowe

IPC分类号： G06K19/077 ,  H05K3/30 ,  H05K3/28 ,  H05K1/18 ,  H01Q13/10

CPC分类号： B29C45/14647 ,  B22D19/00 ,  B29C45/14 ,  B29C45/14639 ,  B29C45/17 ,  B29L2017/006 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/07777 ,  H01Q13/10 ,  H05K1/18 ,  H05K3/284 ,  H05K3/285 ,  H05K3/301 ,  H05K2201/1003 ,  H05K2203/1316 ,  H05K2203/1327

摘要： A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.

公开(公告)号：US20190029119A1

公开(公告)日：2019-01-24

申请号：US16039719

申请日：2018-07-19

申请人： Molex, LLC

发明人： Patrick Weber

IPC分类号： H05K3/12 ,  H05K1/09 ,  H05K3/22

CPC分类号： H05K3/12 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/1283 ,  H05K3/22 ,  H05K3/247 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2201/0257 ,  H05K2203/049 ,  H05K2203/1131 ,  H05K2203/1327 ,  H01L2924/00014

摘要： A method of manufacturing includes bonding a paste material to an organic substrate by a polymer thick film (PTF) process to form a PTF trace, coating a sinterable material over the PTF trace, and sintering the sinterable material to the PTF trace.

公开(公告)号：US20180295720A1

公开(公告)日：2018-10-11

申请号：US15762791

申请日：2015-09-24

申请人： Intel Corporation

发明人： Aleksandar Aleksov ,  Adel A. Elsherbini ,  Javier Soto Gonzalez ,  Dilan Seneviratne ,  Shruti R. Jaywant ,  Sashi S. Kandanur ,  Srinivas Pietambaram ,  Nadine L. Dabby ,  Braxton Lathrop ,  Rajat Goyal ,  Vivek Raghunathan

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/00 ,  H05K3/34 ,  H05K3/28 ,  H05K3/42

CPC分类号： H05K1/0283 ,  H01L23/145 ,  H01L23/5387 ,  H05K1/038 ,  H05K1/111 ,  H05K1/189 ,  H05K3/0023 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/0055 ,  H05K3/18 ,  H05K3/205 ,  H05K3/284 ,  H05K3/341 ,  H05K3/429 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0133 ,  H05K2201/0329 ,  H05K2201/09263 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

摘要： Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.