公开(公告)号：US20110308069A1

公开(公告)日：2011-12-22

申请号：US13137669

申请日：2011-09-01

Applicant: Eung Suek LEE ,  Je Gwang YOO ,  Chang Sup RYU ,  Jun Oh HWANG ,  Jun Heyoung PARK ,  Jee Soo MOK

Inventor： Eung Suek LEE ,  Je Gwang YOO ,  Chang Sup RYU ,  Jun Oh HWANG ,  Jun Heyoung PARK ,  Jee Soo MOK

IPC: H05K13/00 ,  C04B35/64

CPC classification number: H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

Abstract translation: 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基底和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。

公开(公告)号：US08039174B2

公开(公告)日：2011-10-18

申请号：US11641716

申请日：2006-12-20

Applicant: Hye Yeon Cha ,  Tae Hoon Kim ,  Chang Sup Ryu ,  Sam Jin Her ,  Sung Han Kim

Inventor： Hye Yeon Cha ,  Tae Hoon Kim ,  Chang Sup Ryu ,  Sam Jin Her ,  Sung Han Kim

IPC: H01M8/02 ,  H01M4/88

CPC classification number: H01M8/1011 ,  H01M4/8657 ,  H01M4/8803 ,  H01M4/92 ,  H01M8/0239 ,  H01M8/0245 ,  H01M8/1004 ,  H01M8/1097 ,  H01M2250/30 ,  Y02B90/18 ,  Y02E60/523 ,  Y02P70/56

Abstract: Through holes for flow paths of the fuel cell are formed in a thermoplastic polymer film by a process selected from a group consisting of laser drilling, etching and lithography, an inner side surface of the thermoplastic polymer film is coated with a metal layer, and the through holes are filled with a fuel diffusion material and a catalyst to provide an anode. The procedure is repeated to provide a cathode. Then, the anode and the cathode are placed to oppose each other. A cation conducting polymer membrane is disposed, between the anode and the cathode, and the anode, the cation conducting polymer membrane and the cathode are hot-pressed.

Abstract translation: 通过选自激光钻孔，蚀刻和光刻的方法，在热塑性聚合物膜中形成用于燃料电池的流路的通孔，热塑性聚合物膜的内侧表面涂覆有金属层，并且 通孔填充有燃料扩散材料和催化剂以提供阳极。 重复该过程以提供阴极。 然后，阳极和阴极彼此相对放置。 在阳极和阴极之间设置阳离子导电聚合物膜，并且阳极，阳离子导电聚合物膜和阴极被热压。

公开(公告)号：US07983055B2

公开(公告)日：2011-07-19

申请号：US12010436

申请日：2008-01-24

Applicant: Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

Inventor： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC: H05K1/18 ,  H01L27/108

CPC classification number: H05K1/162 ,  H05K1/0218 ,  H05K1/0236 ,  H05K3/4069 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/09663 ,  H05K2201/09972

Abstract: A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.

Abstract translation: 公开了一种具有嵌入式腔体电容器的印刷电路板。 根据本发明的实施例，具有嵌入式空腔电容器的印刷电路板，印刷电路板可以分别包括用作功率层和接地层的两个导电层; 以及放置在所述两个导电层之间的第一电介质层，其中至少一个空腔电容器被布置在放置在所述印刷电路板上的噪声源和被噪声阻止的目的地之间的可噪声转移路径中，形成所述空腔电容器 以允许第二电介质层具有比第一电介质层更低的台阶区域，第二电介质层分别使用两个导电层作为第一电极和第二电极，并且放置在第一电极和第二电极之间。

公开(公告)号：US20110079349A1

公开(公告)日：2011-04-07

申请号：US12654360

申请日：2009-12-17

Applicant: Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Yong An ,  Soon Oh Jung ,  Sung Won Jeong ,  Byung Moon Kim ,  Dong Ju Jeon ,  Seok Kyu Lee ,  Jin Ho Kim

Inventor： Suk Hyeon Cho ,  Chang Sup Ryu ,  Jin Yong An ,  Soon Oh Jung ,  Sung Won Jeong ,  Byung Moon Kim ,  Dong Ju Jeon ,  Seok Kyu Lee ,  Jin Ho Kim

IPC: B32B38/10 ,  B32B38/04

CPC classification number: H05K3/4682 ,  H05K3/0035 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/28 ,  H05K2203/066 ,  H05K2203/1536

Abstract: The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.

Abstract translation: 本发明提供一种制造印刷电路板的方法，包括以下步骤：制备分别通过依次堆叠隔离膜和第一绝缘层而形成的一对原材料和粘合剂层; 在粘合剂层中嵌入彼此相对的一对原料，同时将释放膜设置在内层上; 在所述第一绝缘层上形成第二绝缘层，所述第二绝缘层具有穿过其形成的通孔和形成在与所述通孔连接的上表面上的电路图案; 第二和第一绝缘层，剥离膜和粘合剂层的切割边缘部分; 以及从所述第一绝缘层移除所述脱模膜。

公开(公告)号：US20100212951A1

公开(公告)日：2010-08-26

申请号：US12654766

申请日：2009-12-31

Applicant: Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

Inventor： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC: H05K9/00

CPC classification number: H05K9/0071 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0236 ,  H05K9/002 ,  H05K9/0064 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An EMI noise reduction board using an electromagnetic bandgap structure is disclosed. In the EMI noise reduction board according to an embodiment of the present invention, an electromagnetic bandgap structure having band stop frequency properties can be inserted into an inner portion of the board so as to shield an EMI noise, in which the portion corresponds to an edge of the board and in which the EMI noise is conducted from the inside to the edge of the board and radiates to the outside of the board.

Abstract translation: 公开了一种使用电磁带隙结构的EMI降噪板。 在根据本发明实施例的EMI噪声抑制板中，具有带阻频率特性的电磁带隙结构可以插入到板的内部，以屏蔽EMI噪声，其中该部分对应于边缘 并且其EMI噪声从板的内部传导到边缘并辐射到板的外部。

公开(公告)号：US20090294739A1

公开(公告)日：2009-12-03

申请号：US12263685

申请日：2008-11-03

Applicant: Eung-Suek Lee ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Jun-Oh Hwang ,  Tae-Eun Chang ,  Jee-Soo Mok

Inventor： Eung-Suek Lee ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Jun-Oh Hwang ,  Tae-Eun Chang ,  Jee-Soo Mok

IPC: H01B1/02

CPC classification number: H01B1/24 ,  B82Y10/00 ,  H05K1/095 ,  H05K3/4069 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2203/0425

Abstract: The invention provides a conductive paste including a carbon nanotube and a printed circuit board using the same. The invention provides the conductive paste which exhibits an excellent electrical conductivity and allows the implementation of the X-Y interconnection and simultaneously the Z-interconnection without loosing the carbon nanotube's own original characteristics.

Abstract translation: 本发明提供一种包括碳纳米管的导电浆料和使用其的印刷电路板。 本发明提供了导电性优异的导电性糊剂，其导电性优异，可以实现X-Y互连，同时实现Z-互连，而不会使碳纳米管本身的原有特性丧失。

公开(公告)号：US07605459B2

公开(公告)日：2009-10-20

申请号：US11706223

申请日：2007-02-15

Applicant: Jee-Soo Mok ,  Chang-Sup Ryu ,  Dong-Jin Park

Inventor： Jee-Soo Mok ,  Chang-Sup Ryu ,  Dong-Jin Park

IPC: H01L23/02 ,  H01L23/48

CPC classification number: H01L23/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/48237 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: An aspect of the present invention features a manufacturing method of a package on package with a cavity. The method can comprise (a) forming a first upper substrate cavity in one side of an upper substrate; (b) mounting an upper semiconductor chip on the other side of the upper substrate; (c) forming a lower substrate cavity in one side of a lower substrate; (d) mounting a lower semiconductor chip in the lower substrate cavity formed in the lower substrate; and (e) stacking the upper substrate above the lower substrate such that the first upper substrate cavity accommodates a part of the lower semiconductor chip. The package on package and a manufacturing method thereof can reduce the overall thickness of the package by forming cavities in both upper and lower substrates to accommodate a semiconductor chip mounted in the lower substrate.

Abstract translation: 本发明的一个方面的特征在于具有空腔的封装的封装的制造方法。 该方法可以包括（a）在上基板的一侧中形成第一上基板空腔; （b）将上半导体芯片安装在上基板的另一侧上; （c）在下基板的一侧中形成下基板空腔; （d）将下半导体芯片安装在形成在下基板中的下基板空腔中; 和（e）将上基板堆叠在下基板上方，使得第一上基板空腔容纳下半导体芯片的一部分。 包装上的封装及其制造方法可以通过在上基板和下基板中形成空腔来容纳安装在下基板中的半导体芯片来减小封装的整体厚度。

公开(公告)号：US20090250259A1

公开(公告)日：2009-10-08

申请号：US12216435

申请日：2008-07-03

Applicant: Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

Inventor： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC: H01R12/02 ,  B05D5/12 ,  B32B38/10

CPC classification number: H05K3/4007 ,  H01R12/523 ,  H05K3/0017 ,  H05K3/207 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/016 ,  H05K2203/1536

Abstract: Disclosed herein is a multilayered printed circuit board, including: a build-up layer including a plurality of insulating layers and a plurality of circuit layers; an insulating resin layer, including bumps, formed on the outermost circuit layer of one side of the build-up layer; and a solder resist layer formed on the outermost layer of the other side of the build-up layer. The multilayered printed circuit board is manufactured by sequentially placing a build-up layer and a solder resist layer on one side of an insulating resin layer, the other side of which is provided with bumps. The present invention is advantageous in that the thickness of the multilayered printed circuit board is decreased, the production processes thereof is simplified, and the production efficiency is increased.

Abstract translation: 本文公开了一种多层印刷电路板，包括：包括多个绝缘层和多个电路层的堆积层; 包含凸起的绝缘树脂层，形成在构成层一侧的最外层电路层上; 以及形成在积层的另一侧的最外层上的阻焊层。 多层印刷电路板通过在绝缘树脂层的一侧依次放置积层和阻焊层，另一侧设置有凸块来制造。 本发明的优点在于，多层印刷电路板的厚度减小，其制造工艺简化，生产效率提高。

公开(公告)号：US20090184420A1

公开(公告)日：2009-07-23

申请号：US12213466

申请日：2008-06-19

Applicant: Jin-Won Choi ,  Chang-Sup Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

Inventor： Jin-Won Choi ,  Chang-Sup Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

IPC: H01L23/488 ,  H01L21/44 ,  H05K3/00 ,  H05K1/00

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/02 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0568 ,  H05K2203/0571 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

Abstract: A post bump and a method of forming the post bump are disclosed. The method of forming the post bump can include: forming a resist layer, in which an aperture is formed in correspondence to a position of an electrode pad, over a substrate, on which the electrode pad is formed; forming a metal post by filling a part of the aperture with a metallic material; filling a remaining part of the aperture with solder; reflowing the solder by applying heat; and removing the resist layer. This method can be utilized to prevent deviations in the plated solder and prevent the unnecessary flowing of the solder over the sides of the metal post during reflowing, so that the amount of solder used can be minimized.

Abstract translation: 公开了一种后凸块和形成凸块的方法。 形成后凸块的方法可以包括：在其上形成有电极焊盘的基板上形成抗蚀剂层，其中形成有孔对应于电极焊盘的位置; 通过用金属材料填充孔的一部分来形成金属柱; 用焊料填充孔的剩余部分; 通过加热回流焊料; 并除去抗蚀剂层。 该方法可以用于防止电镀焊料中的偏差，并且防止在回流期间焊料在金属柱的侧面上不必要的流动，使得可以使所使用的焊料的量最小化。

公开(公告)号：US20090130390A1

公开(公告)日：2009-05-21

申请号：US12149952

申请日：2008-05-09

Applicant: Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

Inventor： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC: B32B3/00 ,  B29D11/00

CPC classification number: B29D11/00663 ,  B29D11/00807 ,  G02B6/136 ,  H05K1/0274 ,  Y10T428/24612

Abstract: An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.

Abstract translation: 公开了一种光布线板及其制造方法。 制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。 本发明的实施例可用于容易地控制芯的厚度。