公开(公告)号：US08181341B2

公开(公告)日：2012-05-22

申请号：US12488638

申请日：2009-06-22

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC: H01K3/10

CPC classification number: H05K3/421 ,  H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09863 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of the insulating substrate, a bottom opening in a bottom surface of the insulating substrate, and an inner wall extending from the top opening to the bottom opening along a thickness direction of the insulating substrate, the inner wall including a bulge which extends in a direction generally orthogonal to the thickness direction. A via hole is formed in the insulating substrate by providing metal in the hole such that the metal extends from the top opening to the bottom opening along the inner wall, and completely closes each of the top and bottom openings.

Abstract translation: 一种形成电路板的方法，其包括用二氧化碳激光器产生激光并通过用激光照射绝缘基板使绝缘基板形成孔。 所述孔包括在所述绝缘基板的上表面中的顶部开口，所述绝缘基板的底表面中的底部开口以及沿着所述绝缘基板的厚度方向从所述顶部开口延伸到所述底部开口的内壁， 内壁包括在大致正交于厚度方向的方向上延伸的凸起。 通过在孔中提供金属使得金属沿着内壁从顶部开口延伸到底部开口，并且完全封闭每个顶部和底部开口，在绝缘基板中形成通孔。

公开(公告)号：US08177577B2

公开(公告)日：2012-05-15

申请号：US12453718

申请日：2009-05-20

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K1/11

CPC classification number: H05K1/183 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/10484 ,  H05K2203/049 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate.

Abstract translation: 印刷布线板包括具有凹部和多个导体的第一基板，具有多个导体的第二基板，并插入在第一基板的凹部中，使得第一基板具有暴露出第一基板的表面的至少一部分的表面 第二基板。 第一衬底中的多个导体电连接到第二衬底中的多个导体，并且第二衬底具有比第一衬底的导体的密度高的导体的密度。

公开(公告)号：US20120060367A1

公开(公告)日：2012-03-15

申请号：US13297311

申请日：2011-11-16

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K3/10

CPC classification number: H05K3/4697 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T29/49158 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for manufacturing a flex-rigid wiring board including forming a rigid substrate including a rigid base material, a separator provided over the rigid base material, and insulation layers laminated over the rigid base material after the separator is provided, removing the separator together with a portion of the insulation layers after the laminating of the insulation layers, and forming a recessed portion configured to accommodate an electronic component according to a shape of the separator on a surface of the rigid substrate.

Abstract translation: 一种柔性刚性布线板的制造方法，其特征在于，具备形成刚性基材的刚性基材，设置在所述刚性基材上的隔膜，以及在隔膜之后层叠在所述刚性基材上的绝缘层， 在层压绝缘层之后的绝缘层的一部分，并且形成凹部，该凹部被构造成在刚性基板的表面上根据隔板的形状容纳电子部件。

公开(公告)号：US08101868B2

公开(公告)日：2012-01-24

申请号：US11580165

申请日：2006-10-13

Applicant: Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

Inventor： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC: H05K1/16

CPC classification number: H01L24/83 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/4652 ,  H05K2201/096 ,  H05K2201/10477 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109

Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.

Abstract translation: 用于安装半导体器件的多层印刷电路板或基板包括半导体器件，容纳半导体器件的第一树脂绝缘层，设置在第一树脂绝缘层上的第二树脂绝缘层，设置在第二树脂绝缘层上的导体电路 层和用于将半导体器件电连接到导体电路的通孔，其中半导体器件容纳在设置在第一树脂绝缘层中的凹部中，并且用于放置半导体器件的金属层设置在 休息。 提供了一种多层印刷电路板，其中安装的半导体器件通过通孔建立电连接。

公开(公告)号：US20120008293A1

公开(公告)日：2012-01-12

申请号：US13234365

申请日：2011-09-16

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K7/02 ,  H05K3/30 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K3/4602 ,  H05K1/0366 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/0959 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T156/1062

Abstract: A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm.

Abstract translation: 布线板具有基底基板，形成在基底基板上的导电图案，形成在导电图案和基底基板上的绝缘层，并且包括树脂浸渍的无机布，形成在绝缘层上的导电图案，形成的通孔 在所述绝缘层中并且连接形成在所述基底基板上的导电图案和形成在所述绝缘层上的导电图案，以及连接到形成在所述基底基板上的所述导电图案的通孔，穿过所述基底基板，并具有孔直径 在10μm至150μm的范围内。

公开(公告)号：US20120005889A1

公开(公告)日：2012-01-12

申请号：US13243112

申请日：2011-09-23

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

IPC: H05K3/00

CPC classification number: H01L23/48 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/00 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A method for manufacturing a multilayer printed wiring board including forming a multilayer printed wiring board structure comprising first and second buildup portions, the first buildup portion including insulating layers, conductor layers and first viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are formed in the insulating layers, respectively, the second buildup portion including insulating layers, conductor layers and second viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are tapered toward the second viaholes, and the second via holes are tapered toward the first viaholes. The viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers of the buildup portions, and each insulating layer in the buildup portions is about 100 μm or less in thickness.

Abstract translation: 一种制造多层印刷线路板的方法，包括形成包括第一和第二积累部分的多层印刷线路板结构，所述第一累积部分包括绝缘层，导体层和通过绝缘层将导体层电连接的第一通孔，使得第一 分别在绝缘层中形成通孔，第二累积部分包括绝缘层，导体层和第二通孔，其通过绝缘层电连接导体层，使得第一通孔朝向第二通孔逐渐变细，第二通孔为 朝向第一通孔逐渐变细。 通孔由层叠各积层部的绝缘层之后形成的电镀开口形成，积层部的各绝缘层的厚度为100μm以下。

公开(公告)号：US20110308079A1

公开(公告)日：2011-12-22

申请号：US13219169

申请日：2011-08-26

Applicant: Michimasa TAKAHASHI ,  Masakazu AOYAMA

Inventor： Michimasa TAKAHASHI ,  Masakazu AOYAMA

IPC: H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  Y10T29/49124 ,  Y10T29/49165

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括形成在柔性基板上的柔性基板和导体图案，邻近柔性基板设置的非柔性基板，覆盖柔性基板和非柔性基板的绝缘层，以及 暴露柔性板的一个或多个部分，形成在绝缘层上的导体图案，以及将柔性板的导体图案和导体图案连接在绝缘层上的镀层。

公开(公告)号：US20110247212A1

公开(公告)日：2011-10-13

申请号：US13165014

申请日：2011-06-21

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K3/02

CPC classification number: H05K3/4691 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2203/1536

Abstract: A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the base substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, forming vias in at least one of the first substrate or second substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than a mounting area of the first substrate such that the first substrate extends beyond an edge of the second substrate.

Abstract translation: 一种制造布线板的方法，包括形成基底基板，在基底基板的第一表面上形成第一绝缘层，在基底基板的与第一表面相对的第二表面上形成第二绝缘层，形成IVH（间隙Via 孔），其穿过基底基板，在第一基板或第二基板中的至少一个中形成通孔，并且在第一区域中切割第一绝缘层，并且在偏离所述第一区域的第二区域中切割第二绝缘层，以形成 第一衬底层压到第二衬底上，其中基底层插入其中，第二衬底具有比第一衬底的安装面积小的安装面积，使得第一衬底延伸超过第二衬底的边缘。

公开(公告)号：US20110209344A1

公开(公告)日：2011-09-01

申请号：US13106330

申请日：2011-05-12

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K3/42 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0035 ,  H05K3/0052 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler.

Abstract translation: 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的至少一个边缘。 基底衬底，第一衬底或第二衬底中的至少一个包括柔韧树脂，并且基底衬底，第一衬底或第二衬底中的至少一个包括无机填料。

公开(公告)号：US20110203837A1

公开(公告)日：2011-08-25

申请号：US12894777

申请日：2010-09-30

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2203/308 ,  Y10T29/49124

Abstract: A flex-rigid wiring board includes an insulative substrate, a flexible connected body positioned beside the insulative substrate and including multiple flexible wiring boards, and an insulation layer positioned over the insulative substrate and the flexible connected body and having a portion exposing a portion of the flexible connected body. The flexible wiring boards include a double-sided flexible wiring board having a conductive layer on one surface of the double-sided flexible wiring board and a conductive layer on the opposite surface of the double-sided flexible wiring board. The flexible connected body has a conductor on one side of the flexible connected body, a conductor on the opposite side of the flexible connected body, and a through-hole conductor electrically connecting the conductors of the flexible connected body. The through-hole conductor is penetrating from one side through the opposite side of the flexible wiring boards.

Abstract translation: 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性连接体，并且包括多个柔性布线板，以及位于绝缘基板和柔性连接体上方的绝缘层，并且具有露出一部分 柔性连接体。 柔性布线板包括双面柔性布线板，该双面柔性布线板在双面柔性布线板的一个表面上具有导电层，在双面柔性布线板的相对表面上具有导电层。 柔性连接体在柔性连接体的一侧具有导体，在柔性连接体的相对侧上具有导体，以及电连接柔性连接体的导体的通孔导体。 通孔导体从一侧穿过柔性布线板的相对侧。