公开(公告)号：US11644178B2

公开(公告)日：2023-05-09

申请号：US17082912

申请日：2020-10-28

Applicant: NICHIA CORPORATION

Inventor： Soichiro Miura

IPC: F21V13/00 ,  F21V5/04 ,  F21V7/00 ,  F21V13/04 ,  H01S5/00 ,  H01S5/40 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02255 ,  H01S5/02315 ,  F21Y115/30

CPC classification number: F21V5/04 ,  F21V5/045 ,  F21V7/0066 ,  F21V13/04 ,  H01S5/005 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02255 ,  H01S5/02315 ,  H01S5/4093 ,  F21Y2115/30

Abstract: A light emitting device includes a base, a first light emitting element and a first light reflecting member disposed on the base and a lens member. The first light reflecting member is positioned with respect to the first light emitting element so that emitted light from the first light emitting element is divided into a portion of the emitted light from the first light emitting element irradiating onto the light reflecting face and a portion of the emitted light from the first light emitting element traveling outside of the light reflecting face by having an edge of the light reflecting face serve as a boundary. The lens member includes a reflected light passing region having a first lens shape configured to control the travelling direction of reflected light, and a non-reflected light passing region having a second lens shape configured to control a travelling direction of non-reflected light.

公开(公告)号：US12132293B2

公开(公告)日：2024-10-29

申请号：US18213701

申请日：2023-06-23

Applicant: KYOCERA SLD Laser, Inc.

Inventor： James W. Raring ,  Paul Rudy

IPC: H01S5/02326 ,  F21V9/32 ,  G01S7/481 ,  G01S17/10 ,  G02B27/09 ,  H01S5/00 ,  H01S5/02212 ,  H01S5/024 ,  H01S5/042 ,  H01S5/22 ,  H01S5/323 ,  H01S5/34 ,  H04B10/116 ,  H04B10/40 ,  H04B10/50 ,  F21Y113/13 ,  F21Y115/10 ,  F21Y115/30 ,  G02B26/08 ,  H01L33/00 ,  H01L33/10 ,  H01L33/24 ,  H01L33/32 ,  H01L33/44 ,  H01S5/02251 ,  H01S5/02255 ,  H01S5/02345 ,  H01S5/343

CPC classification number: H01S5/02326 ,  F21V9/32 ,  G01S7/4815 ,  G01S17/10 ,  G02B27/095 ,  G02B27/0977 ,  H01S5/0071 ,  H01S5/02212 ,  H01S5/02469 ,  H01S5/0428 ,  H01S5/22 ,  H01S5/32308 ,  H01S5/3235 ,  H01S5/3401 ,  H04B10/116 ,  H04B10/40 ,  H04B10/503 ,  F21Y2113/13 ,  F21Y2115/10 ,  F21Y2115/30 ,  G02B26/0833 ,  H01L33/0045 ,  H01L33/105 ,  H01L33/24 ,  H01L33/32 ,  H01L33/44 ,  H01S5/02251 ,  H01S5/02255 ,  H01S5/02345 ,  H01S5/3432 ,  H01S5/34346 ,  H01S2304/02 ,  H01S2304/04

Abstract: A portable lighting apparatus is provided with a gallium-and-nitrogen containing laser diode based white light source combined with an infrared illumination source which are driven by drivers disposed in a printed circuit board assembly enclosed in a compact housing and powered by a portable power supply therein. The portable lighting apparatus includes a first wavelength converter configured to output a white-color emission and an infrared emission. A beam shaper may be configured to direct the white-color emission and the infrared emission to a front aperture of a compact housing of the portable lighting apparatus. An optical transmitting unit is configured to project or transmit a directional light beam of the white light emission and/or the infrared emission for illuminating a target of interest, transmitting a pulsed sensing signal or modulated data signal generated by the drivers therein. In some configurations, detectors are included for depth sensing and visible/infrared light communications.

公开(公告)号：US12123769B2

公开(公告)日：2024-10-22

申请号：US17412739

申请日：2021-08-26

Applicant: Sense Photonics, Inc.

Inventor： Scott Burroughs ,  Brent Fisher ,  James Carter

IPC: G01J1/44 ,  F21V5/04 ,  G01S7/481 ,  G01S17/02 ,  G01S17/89 ,  G01S17/894 ,  G02B5/08 ,  G02B26/10 ,  H01L25/00 ,  H01L31/167 ,  H01L31/18 ,  H01S3/02 ,  H01S5/00 ,  H01S5/02253 ,  H01S5/02375 ,  H01S5/026 ,  H01S5/042 ,  H01S5/062 ,  H01S5/12 ,  H01S5/183 ,  H01S5/30 ,  H01S5/40 ,  H01S5/42 ,  G02B3/00 ,  H01S5/02 ,  H01S5/02255

CPC classification number: G01J1/44 ,  F21V5/041 ,  F21V5/045 ,  G01S7/4815 ,  G01S17/02 ,  G01S17/89 ,  G01S17/894 ,  G02B5/0883 ,  G02B26/10 ,  H01L25/50 ,  H01L31/167 ,  H01L31/18 ,  H01S3/025 ,  H01S5/0028 ,  H01S5/0071 ,  H01S5/02253 ,  H01S5/02375 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/04254 ,  H01S5/062 ,  H01S5/12 ,  H01S5/183 ,  H01S5/18394 ,  H01S5/18397 ,  H01S5/30 ,  H01S5/40 ,  H01S5/4025 ,  H01S5/4037 ,  H01S5/4075 ,  H01S5/423 ,  G01J2001/448 ,  G02B3/0006 ,  H01S5/0216 ,  H01S5/0217 ,  H01S5/02255 ,  H01S5/04257

Abstract: A laser diode includes a semiconductor structure of a lower Bragg reflector layer, an active region, and an upper Bragg reflector layer. The upper Bragg reflector layer includes a lasing aperture having an optical axis oriented perpendicular to a surface of the active region. The active region includes a first material, and the lower Bragg reflector layer includes a second material, where respective lattice structures of the first and second materials are independent of one another. Related laser arrays and methods of fabrication are also discussed.

公开(公告)号：US12095223B1

公开(公告)日：2024-09-17

申请号：US18605578

申请日：2024-03-14

Applicant: Lijian Sun

Inventor： Lijian Sun

IPC: H01S5/023 ,  H01S5/02255 ,  H01S5/02315 ,  H01S5/02345 ,  H01S5/042

CPC classification number: H01S5/023 ,  H01S5/02255 ,  H01S5/02315 ,  H01S5/02345 ,  H01S5/042 ,  H01S5/04254

Abstract: This application provides a laser device with an edge emitting source surface-mounted for emission and an electronic device. The laser device includes parts involved in the following: A bottom plate of a housing covers a bottom end of a housing body, and the bottom plate includes a first conductive region and a second conductive region apart from each other. An inner cavity of the housing body and the bottom plate form a mounting cavity with a light outlet opposite the bottom plate, and the mounting cavity is provided in a light source assembly. A side surface of the light source chip facing the light outlet is a light-emitting surface, and light is projected from the front of the light outlet. The technical solution provided by this application is to attach an edge emitting source chip onto the mounting side surface of the support member, so as to achieve frontward projecting.

公开(公告)号：US12080989B2

公开(公告)日：2024-09-03

申请号：US18232919

申请日：2023-08-11

Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Hui Chen ,  Junpeng Shi ,  Xinglong Li ,  Chi-Wei Liao ,  Weng-Tack Wong ,  Chih-Wei Chao ,  Chen-ke Hsu

IPC: H01S5/00 ,  H01S5/02255 ,  H01S5/024 ,  H01S5/06 ,  H01S5/40 ,  F21V7/00 ,  H01S5/02208

CPC classification number: H01S5/0087 ,  H01S5/02255 ,  H01S5/02461 ,  H01S5/0609 ,  H01S5/4012 ,  F21V7/0008 ,  H01S5/02208 ,  H01S5/02469 ,  H01S5/4056

Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.

公开(公告)号：US20240222940A1

公开(公告)日：2024-07-04

申请号：US18608437

申请日：2024-03-18

Applicant: NICHIA CORPORATION

Inventor： Kazuma KOZURU ,  Takuya HASHIMOTO

IPC: H01S5/40 ,  G03B21/20 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/0237 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325

CPC classification number: H01S5/4087 ,  G03B21/2013 ,  G03B21/2033 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/0237 ,  H01S5/4093 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325

Abstract: A light emitting module includes two light emitting devices, each including: a package, a plurality of semiconductor laser elements mounted in the package, and one or more light-reflective members, mounted in the package and reflecting laser light emitted from the plurality of laser elements; and a mounting substrate having a mounting surface on which the two light emitting devices are mounted. The two light emitting devices are mounted on the mounting surface of the mounting substrate with an orientation different from each other by 180 degrees.

公开(公告)号：US20240222161A1

公开(公告)日：2024-07-04

申请号：US18387117

申请日：2023-11-06

Applicant: ADRC. CO. KR

Inventor： Jun Hyuk CHEON ,  Seongbok Kang ,  Jin-han Park

IPC: H01L21/67 ,  H01L21/268 ,  H01S5/02251 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/40

CPC classification number: H01L21/67115 ,  H01L21/268 ,  H01S5/02251 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/4025

Abstract: The present disclosure relates to blue laser annealing equipment and an annealing manufacturing process using the same. The blue laser annealing equipment includes at least one blue laser diode controller including at least one output fiber; at least one light path module connected to an output fiber of the blue laser diode controller to process light emitted from the output fiber and direct the light to a substrate and perform a dehydrogenation process or a crystallization process on a silicon layer applied to the substrate; and a stage capable of relative motion with respect to the light path module and loading the substrate so that the dehydrogenation process and the crystallization process are performed on a surface of the substrate with respect to the light path module.

公开(公告)号：US11962120B2

公开(公告)日：2024-04-16

申请号：US16988875

申请日：2020-08-10

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yuta Ishige ,  Etsuji Katayama

IPC: H01S5/02253 ,  G02B6/42 ,  H01S3/067 ,  H01S3/094 ,  H01S3/0941 ,  H01S5/00 ,  H01S5/02255 ,  H01S5/0239 ,  H01S5/40

CPC classification number: H01S5/02253 ,  H01S3/0675 ,  H01S3/06754 ,  H01S3/094003 ,  H01S3/094053 ,  H01S3/0941 ,  H01S5/0078 ,  H01S5/02255 ,  H01S5/0239 ,  H01S5/4012 ,  H01S5/4031 ,  G02B6/42

Abstract: A semiconductor laser module that can increase output of an optical fiber laser is provided. The semiconductor laser module includes: a mounted-base member having a mounted-base face; a plurality of semiconductor laser elements installed on the mounted-base face of the mounted-base member; a lens that collimates laser light emitted from the semiconductor laser element; a condensing lens that condenses the laser light; and an optical fiber to which the condensed laser light is optically coupled, and further includes: between the condensing lens that condenses the laser light and the lens that collimates laser light emitted from the semiconductor laser element, an aperture that restricts light in a slow axis direction of the laser light.

公开(公告)号：US20240120704A1

公开(公告)日：2024-04-11

申请号：US18264888

申请日：2021-06-14

Applicant: Mitsubishi Electric Corporation

Inventor： Hodaka SHIRATAKI ,  Akitsugu NIWA

IPC: H01S5/02255 ,  H01S5/02253 ,  H01S5/40

CPC classification number: H01S5/02255 ,  H01S5/02253 ,  H01S5/4031 ,  H01S5/0234

Abstract: The semiconductor laser device comprises a substrate, a semiconductor laser element that is disposed on the substrate and integrated into a single chip, a substrate electrode and an electrode that are respectively provided on the side of the substrate and on the opposite side of the substrate in the semiconductor laser element, a mirror to reflect incident laser light in a vertical direction relative to the substrate, second mirrors to reflect incident laser light in a horizontal direction relative to the substrate, and a lens to condense incident laser light.

公开(公告)号：US11955767B2

公开(公告)日：2024-04-09

申请号：US17264662

申请日：2019-08-01

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  David Racz

IPC: H01S5/022 ,  H01S5/00 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/40

CPC classification number: H01S5/0087 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/4056 ,  H01S5/4087

Abstract: In an embodiment a radiation-emitting component includes a first semiconductor chip configured to generate first primary electromagnetic radiation, a second semiconductor chip configured to generate second primary electromagnetic radiation, a first conversion element configured to partially convert the first and/or the second primary electromagnetic radiation into a first secondary radiation, wherein the first semiconductor chip is a first semiconductor laser diode, wherein the first primary electromagnetic radiation is blue primary radiation and wherein the first secondary radiation is green secondary radiation and a first optical element arranged between radiation emitting surfaces of the first semiconductor chip and the second semiconductor chip, wherein the first optical element is reflective for the first primary radiation and the second primary radiation.